Patents by Inventor Yeryung JEON

Yeryung JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry composition and method of manufacturing integrated circuit device by using the same
    Patent number: 11186749
    Abstract: A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 30, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Boyun Kim, Yeryung Jeon, Boun Yoon, Taek Dong Chung, Jae Gyeong Lee, Jin-Young Lee
  • Semiconductor device including interconnections having different structures and method of fabricating the same
    Patent number: 11094586
    Abstract: A semiconductor device and a method of fabricating a semiconductor device, the semiconductor device including a semiconductor substrate including a first region and a second region; an interlayer insulating layer on the semiconductor substrate, the interlayer insulating layer including a first opening on the first region and having a first width; and a second opening on the second region and having a second width, the second width being greater than the first width; at least one first metal pattern filling the first opening; a second metal pattern in the second opening; and a filling pattern on the second metal pattern in the second opening, wherein the at least one first metal pattern and the second metal pattern each include a same first metal material, and the filling pattern is formed of a non-metal material.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Hoon Choi, Jaeung Koo, Kwansung Kim, Bo Yun Kim, Wandon Kim, Boun Yoon, Jeonghyuk Yim, Yeryung Jeon
  • SLURRY COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
    Publication number: 20200392375
    Abstract: A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 17, 2020
    Applicants: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Boyun KIM, Yeryung JEON, Boun YOON, Taek Dong CHUNG, Jae Gyeong LEE, Jin-Young LEE
  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20200243374
    Abstract: A semiconductor device and a method of fabricating a semiconductor device, the semiconductor device including a semiconductor substrate including a first region and a second region; an interlayer insulating layer on the semiconductor substrate, the interlayer insulating layer including a first opening on the first region and having a first width; and a second opening on the second region and having a second width, the second width being greater than the first width; at least one first metal pattern filling the first opening; a second metal pattern in the second opening; and a filling pattern on the second metal pattern in the second opening, wherein the at least one first metal pattern and the second metal pattern each include a same first metal material, and the filling pattern is formed of a non-metal material.
    Type: Application
    Filed: August 13, 2019
    Publication date: July 30, 2020
    Inventors: Seung Hoon CHOI, Jaeung KOO, Kwansung KIM, Bo Yun KIM, Wandon KIM, Boun YOON, Jeonghyuk YIM, Yeryung JEON