Patents by Inventor Yet Ling LOH

Yet Ling LOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11202374
    Abstract: A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 14, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Watanabe, Dai Yokoyama, Shigeki Imafuku, Yosuke Nagasawa, Yew Song Danny Ng, Yet Ling Loh
  • Patent number: 10568250
    Abstract: A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: February 18, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Watanabe, Dai Yokoyama, Shigeki Imafuku, Yosuke Nagasawa, Yew Song Danny Ng, Yet Ling Loh
  • Publication number: 20180255670
    Abstract: A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.
    Type: Application
    Filed: February 28, 2018
    Publication date: September 6, 2018
    Inventors: Hideaki WATANABE, Dai YOKOYAMA, Shigeki IMAFUKU, Yosuke NAGASAWA, Yew Song Danny NG, Yet Ling LOH
  • Publication number: 20180255671
    Abstract: A component mounting device for mounting a component on a substrate comprises a pair of clamping members pinching and clamping the component; the pair of clamping members is able to clamp both a first component including a first body and a first lead projecting downward from a lower portion of the first body and a second component including a second body and a second lead projecting laterally from both side portions of the second body with a tip bent downward; and the pair of clamping members has facing portions each provided with a clamping surface contacting the first body of the first component and a holding groove formed at the clamping surface and holding the second lead of the second component.
    Type: Application
    Filed: February 28, 2018
    Publication date: September 6, 2018
    Inventors: Hideaki WATANABE, Dai YOKOYAMA, Shigeki IMAFUKU, Yosuke NAGASAWA, Yew Song Danny NG, Yet Ling LOH