Abstract: An LCoS panel and a method of preparation includes wafer level packaging, manufacturing vias through a silicon substrate in each die area of a wafer substrate, and manufacturing conductive interfaces on a back surface of the wafer substrate. Each conductive interface corresponds to one via and so connected to an active circuit of the die area where the conductive interface is located. Liquid crystal packaging is applied, a seal coated to surround the pixel circuit area of the active circuit on a front surface of the wafer substrate, injecting liquid crystal into a space defined by the seal, the seal coupling glass substrate comprising a transparent conductive layer and the wafer substrate, and then cutting. Wafer level chip scale packaging of the LCoS panels is thus achieved, the cost is reduced, the obtained LCoS panels are small in total area and of greater thinness.

Abstract: An LCoS panel and a method of preparation includes wafer level packaging, manufacturing vias through a silicon substrate in each die area of a wafer substrate, and manufacturing conductive interfaces on a back surface of the wafer substrate. Each conductive interface corresponds to one via and so connected to an active circuit of the die area where the conductive interface is located. Liquid crystal packaging is applied, a seal coated to surround the pixel circuit area of the active circuit on a front surface of the wafer substrate, injecting liquid crystal into a space defined by the seal, the seal coupling glass substrate comprising a transparent conductive layer and the wafer substrate, and then cutting. Wafer level chip scale packaging of the LCoS panels is thus achieved, the cost is reduced, the obtained LCoS panels are small in total area and of greater thinness.