Patents by Inventor Yeung AU
Yeung AU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250216483Abstract: A process for the polarization transfer between electron spin of Nitrogen Vacancy (NV) centre to nuclear spin of Carbon-13 labelled metabolites (13C-metabolites) in ambient conditions, said process including the steps of (i) providing a mixture including host vehicles which provide a source of NV centres, and 13C-metabolites; (ii) transforming said mixture into a solid glassy state, wherein the spatial orientation of the host and electron spin state of NV centres are randomly distributed within said mixture in a solid state; and (iii) applying a hyperpolarization process to the mixture in a solid state, wherein at the end of polarization transfer process, both electron spin of NV centres and nuclear spin of carbon-13 are strongly polarized in one direction at ambient temperature.Type: ApplicationFiled: April 27, 2023Publication date: July 3, 2025Applicant: Primemax Biotech LimitedInventors: Juan CHENG, Yau Chuen YIU, Chak Yeung AU, Koon Chung HUI
-
Publication number: 20230105070Abstract: A layer for a protective mask (100a, 100b, 200a) comprises at least a first sublayer (122b, 218b), wherein the first sublayer (122b, 218b) includes a first substrate and a layer of a plurality of nanoparticles (124b, 7) of a nanomaterial provided on the first substrate. The protective mask (100a, 100b, 200a) includes an outer layer (120b, 230a) which is made of an organic fibular network bonded with nanomaterials. An air filtration element (900, 1070, 1240) for attenuation of airborne contaminants includes negatively charged nanodiamonds (920, 1320). A filter (1100, 1200, 1500, 1600) for an air conditioning system (1130, 1530) or an air purifier (1230, 1630) comprises the air filtration element (900, 1070, 1240). An air treatment element (1140,1300,1540,1640) comprises nanodiamonds (920,1320) including colour centers.Type: ApplicationFiled: February 11, 2021Publication date: April 6, 2023Applicant: MASTER DYNAMIC LIMITEDInventors: Yau Chuen YIU, Juan CHENG, Chak Yeung AU, Wing Chi TANG, Ching Tom KONG
-
Publication number: 20170012001Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: ApplicationFiled: July 11, 2016Publication date: January 12, 2017Inventors: Roy Gerald GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
-
Patent number: 9390971Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: GrantFiled: July 8, 2015Date of Patent: July 12, 2016Assignee: President and Fellows of Harvard CollegeInventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
-
Publication number: 20150325474Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: ApplicationFiled: July 8, 2015Publication date: November 12, 2015Inventors: Roy Gerald GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
-
Patent number: 9112005Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: GrantFiled: August 8, 2013Date of Patent: August 18, 2015Assignee: President and Fellows of Harvard CollegeInventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
-
Patent number: 8948445Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.Type: GrantFiled: May 2, 2013Date of Patent: February 3, 2015Assignee: The Hong Kong University of Science and TechnologyInventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang
-
Publication number: 20140045331Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: ApplicationFiled: August 8, 2013Publication date: February 13, 2014Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGEInventors: Roy Gerald GORDON, Harish BHANDARI, Yeung AU, Youbo LIN
-
Publication number: 20130301870Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.Type: ApplicationFiled: May 2, 2013Publication date: November 14, 2013Inventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang
-
Patent number: 8569165Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: GrantFiled: October 20, 2010Date of Patent: October 29, 2013Assignee: President and Fellows of Harvard CollegeInventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
-
Publication number: 20110163062Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.Type: ApplicationFiled: October 20, 2010Publication date: July 7, 2011Inventors: Roy G. GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
-
Patent number: 7852864Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.Type: GrantFiled: January 2, 2008Date of Patent: December 14, 2010Assignee: Cisco Technology, Inc.Inventors: Andrew Wan-yeung Au, Jayaraman R. Iyer
-
Patent number: 7327746Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.Type: GrantFiled: August 8, 2003Date of Patent: February 5, 2008Assignee: Cisco Technology, Inc.Inventors: Andrew Wan-yeung Au, Jayaraman R. Iyer