Abstract: A process for the polarization transfer between electron spin of Nitrogen Vacancy (NV) centre to nuclear spin of Carbon-13 labelled metabolites (13C-metabolites) in ambient conditions, said process including the steps of (i) providing a mixture including host vehicles which provide a source of NV centres, and 13C-metabolites; (ii) transforming said mixture into a solid glassy state, wherein the spatial orientation of the host and electron spin state of NV centres are randomly distributed within said mixture in a solid state; and (iii) applying a hyperpolarization process to the mixture in a solid state, wherein at the end of polarization transfer process, both electron spin of NV centres and nuclear spin of carbon-13 are strongly polarized in one direction at ambient temperature.

Abstract: A layer for a protective mask (100a, 100b, 200a) comprises at least a first sublayer (122b, 218b), wherein the first sublayer (122b, 218b) includes a first substrate and a layer of a plurality of nanoparticles (124b, 7) of a nanomaterial provided on the first substrate. The protective mask (100a, 100b, 200a) includes an outer layer (120b, 230a) which is made of an organic fibular network bonded with nanomaterials. An air filtration element (900, 1070, 1240) for attenuation of airborne contaminants includes negatively charged nanodiamonds (920, 1320). A filter (1100, 1200, 1500, 1600) for an air conditioning system (1130, 1530) or an air purifier (1230, 1630) comprises the air filtration element (900, 1070, 1240). An air treatment element (1140,1300,1540,1640) comprises nanodiamonds (920,1320) including colour centers.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.

Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.