Patents by Inventor Yeung AU

Yeung AU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250216483
    Abstract: A process for the polarization transfer between electron spin of Nitrogen Vacancy (NV) centre to nuclear spin of Carbon-13 labelled metabolites (13C-metabolites) in ambient conditions, said process including the steps of (i) providing a mixture including host vehicles which provide a source of NV centres, and 13C-metabolites; (ii) transforming said mixture into a solid glassy state, wherein the spatial orientation of the host and electron spin state of NV centres are randomly distributed within said mixture in a solid state; and (iii) applying a hyperpolarization process to the mixture in a solid state, wherein at the end of polarization transfer process, both electron spin of NV centres and nuclear spin of carbon-13 are strongly polarized in one direction at ambient temperature.
    Type: Application
    Filed: April 27, 2023
    Publication date: July 3, 2025
    Applicant: Primemax Biotech Limited
    Inventors: Juan CHENG, Yau Chuen YIU, Chak Yeung AU, Koon Chung HUI
  • Publication number: 20230105070
    Abstract: A layer for a protective mask (100a, 100b, 200a) comprises at least a first sublayer (122b, 218b), wherein the first sublayer (122b, 218b) includes a first substrate and a layer of a plurality of nanoparticles (124b, 7) of a nanomaterial provided on the first substrate. The protective mask (100a, 100b, 200a) includes an outer layer (120b, 230a) which is made of an organic fibular network bonded with nanomaterials. An air filtration element (900, 1070, 1240) for attenuation of airborne contaminants includes negatively charged nanodiamonds (920, 1320). A filter (1100, 1200, 1500, 1600) for an air conditioning system (1130, 1530) or an air purifier (1230, 1630) comprises the air filtration element (900, 1070, 1240). An air treatment element (1140,1300,1540,1640) comprises nanodiamonds (920,1320) including colour centers.
    Type: Application
    Filed: February 11, 2021
    Publication date: April 6, 2023
    Applicant: MASTER DYNAMIC LIMITED
    Inventors: Yau Chuen YIU, Juan CHENG, Chak Yeung AU, Wing Chi TANG, Ching Tom KONG
  • Publication number: 20170012001
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 12, 2017
    Inventors: Roy Gerald GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
  • Patent number: 9390971
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: July 12, 2016
    Assignee: President and Fellows of Harvard College
    Inventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
  • Publication number: 20150325474
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Application
    Filed: July 8, 2015
    Publication date: November 12, 2015
    Inventors: Roy Gerald GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
  • Patent number: 9112005
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: August 18, 2015
    Assignee: President and Fellows of Harvard College
    Inventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
  • Patent number: 8948445
    Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: February 3, 2015
    Assignee: The Hong Kong University of Science and Technology
    Inventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang
  • Publication number: 20140045331
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Application
    Filed: August 8, 2013
    Publication date: February 13, 2014
    Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Roy Gerald GORDON, Harish BHANDARI, Yeung AU, Youbo LIN
  • Publication number: 20130301870
    Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.
    Type: Application
    Filed: May 2, 2013
    Publication date: November 14, 2013
    Inventors: Wai Ho Mow, Chi Yeung Au, Cheuk Yin Chiu, Ka Shun Li, Wenjian Huang
  • Patent number: 8569165
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: October 29, 2013
    Assignee: President and Fellows of Harvard College
    Inventors: Roy Gerald Gordon, Harish B. Bhandari, Yeung Au, Youbo Lin
  • Publication number: 20110163062
    Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.
    Type: Application
    Filed: October 20, 2010
    Publication date: July 7, 2011
    Inventors: Roy G. GORDON, Harish B. BHANDARI, Yeung AU, Youbo LIN
  • Patent number: 7852864
    Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.
    Type: Grant
    Filed: January 2, 2008
    Date of Patent: December 14, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: Andrew Wan-yeung Au, Jayaraman R. Iyer
  • Patent number: 7327746
    Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: February 5, 2008
    Assignee: Cisco Technology, Inc.
    Inventors: Andrew Wan-yeung Au, Jayaraman R. Iyer