Abstract: A device for at least one of diagnosis and treatment of binocular vision disorders is disclosed. The device comprises a portable, wearable viewing apparatus that includes a left eye electronic display and a right eye electronic display, a dual data channel input, wherein each data channel corresponds to a respective one of the left eye and right eye electronic displays, a left eye adjustable optic structure adjusting a view of the left eye electronic display, and a right eye adjustable optic structure adjusting a view of the right eye electronic display.

Abstract: A device for at least one of diagnosis and treatment of binocular vision disorders is disclosed. The device comprises a portable, wearable viewing apparatus that includes a left eye electronic display and a right eye electronic display, a dual data channel input, wherein each data channel corresponds to a respective one of the left eye and right eye electronic displays, a left eye adjustable optic structure adjusting a view of the left eye electronic display, and a right eye adjustable optic structure adjusting a view of the right eye electronic display.

Abstract: A vision treatment system comprises a computer and a user input output module associated with the computer, the user input output module including a display screen and means for receiving user input, wherein the computer includes a testing and training module for one or more vision disorders, the training and testing module in communication with the user input output module and testing a user's cutoff spatial frequency of a contrast sensitivity and applying a training regimen based upon Perceptual Template Model (PTM) analysis of interactions with the user.

Abstract: A vision treatment system comprises a computer and a user input output module associated with the computer, the user input output module including a display screen and means for receiving user input, wherein the computer includes a testing and training module for one or more vision disorders, the training and testing module in communication with the user input output module and testing a user's cutoff spatial frequency of a contrast sensitivity and applying a training regimen based upon Perceptual Template Model (PTM) analysis of interactions with the user.

Abstract: An optoelectronic distance sensor with slant component 200 having a spacer 202 bonded on a mother substrate 201 is disclosed. The spacer 202 has slant surface for receiving one or more optoelectronic components 204, such as an optical sensor, that are mounted at an angle to the mother substrate 201. Such electronic components 204 are bonded on a daughter substrate 203 which attaches to the spacer 202 at the slant surface. The optoelectronic assembly 200 can be manufactured at chip-level, including by one ore more of exemplary methods disclosed herein.

Abstract: An optical displacement sensor for measuring distance or surface displacement of an object by surface profile scanning includes an optical source, a first optical detector and a second optical detector. The optical source is located intermediate the first and second optical detectors. The first and second optical detectors are arranged to collect light emitted by the optical source when scattered by and/or reflected from the object.

Abstract: A method of sensing movement or proximity of objects by optical reflection is provided. The method includes the steps of transmitting a train of optical pulses towards a destination, sensing optical pulses reflected from the destination, and sensing and evaluating movement or proximity characteristics of objects at the destination with reference to variation in pulse width between transmitted and reflected optical pulses.

Abstract: An optoelectronic distance sensor with slant component 200 having a spacer 202 bonded on a mother substrate 201 is disclosed. The spacer 202 has slant surface for receiving one or more optoelectronic components 204, such as an optical sensor, that are mounted at an angle to the mother substrate 201. Such electronic components 204 are bonded on a daughter substrate 203 which attaches to the spacer 202 at the slant surface. The optoelectronic assembly 200 can be manufactured at chip-level, including by one ore more of exemplary methods disclosed herein.

Abstract: A method of sensing movement or proximity of objects by optical reflection is provided. The method includes the steps of transmitting a train of optical pulses towards a destination, sensing optical pulses reflected from the destination, and sensing and evaluating movement or proximity characteristics of objects at the destination with reference to variation in pulse width between transmitted and reflected optical pulses.

Abstract: An optical displacement sensor for measuring distance or surface displacement of an object by surface profile scanning includes an optical source, a first optical detector and a second optical detector. The optical source is located intermediate the first and second optical detectors. The first and second optical detectors are arranged to collect light emitted by the optical source when scattered by and/or reflected from the object.

Abstract: A monitoring device for security surveillance application, the device comprising: an electromagnetic wave sensor for sensing electromagnetic wave from an external electromagnetic wave source; a detection window for forming a partition between the external electromagnetic wave source and the electromagnetic wave sensor; and an anti-tampering arrangement comprising an optical arrangement for deploying an optical surveillance beam and control circuitry, wherein i. the optical surveillance beam comprising a first beam portion and a second beam portion, the first beam portion being a beam emitted by the optical arrangement towards the detection window and the second beam portion being due to total internal reflection of the first beam portion by the detection window, and ii. the control circuitry being for detection of a variation of the second beam portion, wherein the variation is indicative of tampering of the detection window.

Abstract: A semiconductor wafer having solder bumps thereon for use in flip-chip bonded integrated circuits comprises a semiconductor substrate formed with metal bond pads at selected locations thereon, a metal electroplating buss layer or layers over the bond pads, a layer of solder-wettable under bump metal on the buss layer, a layer of barrier metal which overlies and encapsulates the solder-wettable metal, and a solder bump formed on the barrier metal.

Abstract: A semiconductor wafer having solder bumps thereon for use in flip-chip bonded integrated circuits comprises a semiconductor substrate formed with metal bond pads at selected locations thereon, a metal electroplating buss layer or layers over the bond pads, a layer of solder-wettable under bump metal on the buss layer, a layer of barrier metal which overlies and encapsulates the solder-wettable metal, and a solder bump formed on the barrier metal.

Abstract: A method of fabrication of solder bumps on a semiconductor wafer provided with metal bond pads comprises the steps of: (a) applying a metal adhesion/barrier/electroplating buss layer or layers on at least the bond pads; (b) forming a layer of a resist in a predefined pattern defining openings therein over the bond pads; (c) applying a layer of solder-wettable under bump metal into the openings; (d) removing a volume of resist from the regions of the openings to create an opening between an edge of the layer of wettable metal and the resist; (e) applying a layer of a barrier metal over the layer of solder-wettable metal including the openings created at step (d) while encapsulates the layer of wettable metal; (f) fabricating a solder bump onto the layer of barrier metal; and (g) removing the resist material; and (h) removing any exposed adhesion/barrier layer.