Abstract: A layer for a protective mask (100a, 100b, 200a) comprises at least a first sublayer (122b, 218b), wherein the first sublayer (122b, 218b) includes a first substrate and a layer of a plurality of nanoparticles (124b, 7) of a nanomaterial provided on the first substrate. The protective mask (100a, 100b, 200a) includes an outer layer (120b, 230a) which is made of an organic fibular network bonded with nanomaterials. An air filtration element (900, 1070, 1240) for attenuation of airborne contaminants includes negatively charged nanodiamonds (920, 1320). A filter (1100, 1200, 1500, 1600) for an air conditioning system (1130, 1530) or an air purifier (1230, 1630) comprises the air filtration element (900, 1070, 1240). An air treatment element (1140,1300,1540,1640) comprises nanodiamonds (920,1320) including colour centers.

Abstract: A digital controlled oscillator (DCO) is provided that includes a plurality of selectable delay cells, a first load adjustment delay (LAD) cell, a second LAD cell, a first set of the load cells (LCs), a second set of the LCs and first and second capacitance elements. A number of the selectable delay cells that are part of a delay cell chain is configurable based on a delay cell number control vector. The delay cell chain generates a delay cell output signal that is received by the first LAD cell. The first set of the LCs generate a first load signal to control an amount of loading on the second LAD cell, and the second set of the LCs generate a second load signal to control loading on the first LAD cell. Substrate voltages of the first and second capacitance elements can be adjusted to adjust loading in the DCO.

Abstract: A PLL control system is provided that implements a phase tracer module to reduce lock time and output clock jitter. A second clock signal is generated by dividing a frequency of a reference clock signal. A feedback clock signal is generated based on a high-frequency clock signal from a digitally controlled oscillator (DCO) and a PLL feedback divide number. Lead/lag determination circuitry generates a lead/lag detection result that indicates whether the feedback clock signal leads or lags the second clock signal. A skew digitizer digitizes a skew between a falling edge of the second clock signal and a rising edge of the feedback clock signal to generate a skew signal. The phase tracer module processes the lead/lag detection result and the skew signal to generate a digital control signal that controls cycle time of the DCO to change frequency of the high-frequency clock signal.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A two dimensional barcode containing encoded information can be embedded with an image with a high visual quality. The encoded information within the barcode is meaningful to machines, while the image is meaningful to humans. The two dimensional barcode embedded with the image is designed such that machines can decode the information encoded within the two dimensional barcode even with the distortion from the image. The subject application describes various systems, methods and devices that can facilitate embedding the image within the two dimensional barcode, detecting the two dimensional barcode embedded with the image within a practical environment, and decoding the encoded information from the two dimensional barcode even with the distortion from the image.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing layer forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The Mn, Cr, or V containing layer also promotes strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use, as well as protecting against failure by electromigration of the copper during use of the devices and protecting the copper from corrosion by oxygen or water from its surroundings. In forming such integrated circuits, certain embodiments of the invention provide methods to selectively deposit Mn, Cr, V, or Co on the copper surfaces while reducing or even preventing deposition of Mn, Cr, V, or Co on insulator surfaces.

Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.

Abstract: A method for detecting and directing traffic in a network environment is provided that includes receiving a packet included within a communication flow that is initiated by a mobile terminal and setting a flag within the packet. The method further includes directing the packet to a next destination by recognizing that the flag included within the packet was set and therefore is associated with a mobile-to-mobile communication session.