Patents by Inventor Yevgeniy (Eugene) Rabinovich

Yevgeniy (Eugene) Rabinovich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7473339
    Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: January 6, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Allen L. D'Ambra, Arulkumar Shanmugasundram, Michael X. Yang, Yevgeniy (Eugene) Rabinovich, Dmitry Lubomirsky
  • Patent number: 7273535
    Abstract: A method and apparatus for plating a metal onto a substrate. The apparatus includes a fluid basin configured to contain a plating solution, an anode fluid volume positioned in a lower portion of the fluid basin, a cathode fluid volume positioned in an upper portion of the fluid basin, an ionic membrane positioned to separate the anode fluid volume from the cathode fluid volume, a plating electrode centrally positioned in the anode fluid volume, and a deplating electrode positioned adjacent the plating electrode in the anode fluid volume.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: September 25, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Nicolay Y. Kovarsky, Dmitry Lubomirsky, Yevgeniy (Eugene) Rabinovich
  • Publication number: 20040206623
    Abstract: Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.
    Type: Application
    Filed: April 16, 2004
    Publication date: October 21, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Allen L. D'Ambra, Arulkumar Shanmugasundram, Michael X. Yang, Yevgeniy (Eugene) Rabinovich, Dmitry Lubomirsky