Patents by Inventor Yevsey SENDERZON

Yevsey SENDERZON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS FOR, METHODS OF, AND APPARATUS FOR PROCESSING SUBSTRATE SURFACES
    Publication number: 20150306728
    Abstract: The following description pertains to processing substrates using processes such as, but not limited to, polishing or lapping. Descriptions of systems, methods, and apparatuses according to one or more embodiments of the present invention are presented.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 29, 2015
    Applicant: SILICON QUEST INTERNATIONAL, INCORPORATED
    Inventors: Yevsey SENDERZON, Michael LYU
  • METHODS OF AND APPARATUS FOR PRODUCING WAFERS
    Publication number: 20140045411
    Abstract: An aspect of the present invention pertains to a method of fabricating wafers. One embodiment comprises a method of processing a substrate having defects into a wafer. The method comprises grinding the substrate to flatness while supporting the substrate in a grinding apparatus so that there is minimum or substantially zero stress on the substrate. Another aspect of the present invention comprises a substrate holder for holding a substrate as part of grinding processes to produce a flat surface on the substrate.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 13, 2014
    Inventors: Yevsey SENDERZON, Michael LYU