Patents by Inventor Yew F. KOK

Yew F. KOK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTICHIP PACKAGE STAIRCASE CAVITIES
    Publication number: 20230101340
    Abstract: Embodiments disclosed herein include electronic packages and methods of assembling an electronic package. In an embodiment, an electronic package comprises a package substrate with a stepped top surface, and a first die on a first plateau of the stepped top surface. In an embodiment, a second die is on a second plateau of the stepped top surface, where the second die extends over the first die, In an embodiment, a third die is on a third plateau of the stepped top surface, where the third die extends over the second die.
    Type: Application
    Filed: September 24, 2021
    Publication date: March 30, 2023
    Inventors: Kaveh HOSSEINI, Omkar KARHADE, Ravindranath V. MAHAJAN, Sergey Yuryevich SHUMARAYEV, Yew F. KOK, Sai VADLAMANI