Abstract: An apparatus for inspecting a printed circuit board device, the device including at least one component mounted on a circuit board, the apparatus comprising an object carrier for carrying the printed circuit board device, imaging means for imaging along an optical axis so as to receive light reflected from surfaces of the device when placed on the object carrier within a field of view of the imaging means, and light projecting means for projecting light toward the object carrier in an oblique direction with respect to the optical axis of the imaging means for illumination of said surfaces of the device. The light projecting means includes a substantially dome-shaped structure incorporating a plurality of light elements for producing and projecting the light. Said plurality of light elements includes light elements of different light characteristics and light elements of different orientations of projection for creating a predetermined illumination pattern on said surfaces of said printed circuit board device.

Abstract: A semiconductor inspection system transports devices in trays from an input stacker to a flipping mechanism along a first inspection path in a first direction and from the flipping mechanism to an output stacker along a second inspection path in a second direction that is a different direction than the first direction. The flipping mechanism moves the devices from the first inspection path to a flipping location, flips the devices at the flipping location, and moves the devices to the second inspection path. In this manner, the devices can be inspected by a plurality of stations on different inspection paths and in different directions. One of the stations is an integrated station that performs both mark inspection and sorting of defective devices. A semiconductor inspection method is also described.

Abstract: A ball grid array unit suitable for calibrating an inspection system, comprising a substrate and an array of balls mounted on a surface of the substrate, the balls having a melting point greater than 400 degrees centigrade or a Britnell hardness number greater than 150.

Abstract: An apparatus for inspecting a printed circuit board device, the device including at least one component mounted on a circuit board, the apparatus comprising an object carrier for carrying the printed circuit board device, imaging means for imaging along an optical axis so as to receive light reflected from surfaces of the device when placed on the object carrier within a field of view of the imaging means, and light projecting means for projecting light toward the object carrier in an oblique direction with respect to the optical axis of the imaging means for illumination of said surfaces of the device. The light projecting means includes a substantially dome-shaped structure incorporating a plurality of light elements for producing and projecting the light. Said plurality of light elements includes light elements of different light characteristics and light elements of different orientations of projection for creating a predetermined illumination pattern on said surfaces of said printed circuit board device.