Patents by Inventor Yew Ming CHONG

Yew Ming CHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250083532
    Abstract: An inverter may include a housing having a body and a protruding rim extending from the body, wherein the protruding rim surrounds a cavity that extends through to the body. An inverter may include one or more electrical receptacles, wherein the one or more electrical receptacles are disposed within the cavity such that a portion of at least one of the one or more electrical receptacles extends above the protruding rim. An inverter may include a metal sheet, wherein the metal sheet is molded to an inner surface of the protruding rim such that the protruding rim extends past the metal sheet, and wherein the metal sheet circumferentially surrounds the cavity.
    Type: Application
    Filed: October 25, 2023
    Publication date: March 13, 2025
    Applicant: BorgWarner US Technologies LLC
    Inventors: HongJun Luo, Jun Jie How, Kin Yean Chow, Edmund Lim, Yew Ming Chong
  • Publication number: 20250088097
    Abstract: An inverter assembly may include a housing with a base and side walls, wherein one of the side walls includes an opening extending through the wall, and wherein the side walls form a periphery around an interior of the housing. An inverter assembly may include a header with a body, the body having a first end and a second end, wherein the body further includes a flange disposed between the first end and the second end, and wherein a portion of the body extends through the opening such that the flange abuts the side wall. An inverter assembly may include a bracket positioned within the interior of the housing and coupled to the housing. An inverter assembly may include a choke that is fully enclosed in a circumferential direction, wherein the choke is positioned within the bracket and against an inner surface of the bracket facing the opening.
    Type: Application
    Filed: October 25, 2023
    Publication date: March 13, 2025
    Applicant: BorgWarner US Technologies LLC
    Inventors: Jun Jie How, Kin Yean Chow, Edmund Lim, HongJun Luo, Yew Ming Chong
  • Patent number: 12193199
    Abstract: A system for an electric vehicle may include a housing, a cover configured to couple to the housing, the cover including an opening; a capacitor disposed within the housing, wherein the capacitor is mounted directly to the cover; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: January 7, 2025
    Assignee: BorgWarner US Technologies LLC
    Inventor: Yew Ming Chong
  • Publication number: 20240121922
    Abstract: A system for an electric vehicle may include a housing, a cover configured to couple to the housing, the cover including an opening; a capacitor disposed within the housing, wherein the capacitor is mounted directly to the cover; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: Delphi Technologies IP Limited
    Inventor: Yew Ming CHONG