Patents by Inventor Yew Ming CHONG

Yew Ming CHONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CAPACITOR COVER
    Publication number: 20240121922
    Abstract: A system for an electric vehicle may include a housing, a cover configured to couple to the housing, the cover including an opening; a capacitor disposed within the housing, wherein the capacitor is mounted directly to the cover; and a heatsink disposed within or adjacent to the opening of the cover, wherein the heatsink is thermally connected to the capacitor.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: Delphi Technologies IP Limited
    Inventor: Yew Ming CHONG