Abstract: Methods for selecting integrated circuit dies based on pre-determined criteria are disclosed. A disclosed method includes binning tools that characterizes multiple integrated circuit dies based on performance attributes. Each integrated circuit die is labeled with an identifier that represents bin location of the integrated circuit die within a die storage structure. A user can search for integrated circuit dies that matches certain performance grading by providing a performance description to an input interface on testing equipment. A tester is then configured to perform a screening to identify the physical locations of integrated circuit dies that match the retrieved identifiers from the die storage structure.