Patents by Inventor Yew San Lim

Yew San Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147654
    Abstract: The present disclosure is directed to a laptop arrangement including: a chassis defining a space that is divided into a first compartment and a second compartment, the first compartment including an air inlet and the second compartment including an air outlet; and a partitioning element positioned between the first and second compartments, whereby the partitioning element at least partially seals the first compartment from the second compartment and enables the second compartment to have a greater pressurization than the first compartment.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Jiunn Shyong CHEE, Howe Yin LOO, Tin Poay CHUAH, Chin Kung GOH, Yew San LIM
  • Publication number: 20240006338
    Abstract: A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed between the first and the second plurality of solder balls and configured to shield each solder ball of the first and second plurality of solder balls from electromagnetic interference.
    Type: Application
    Filed: July 4, 2022
    Publication date: January 4, 2024
    Inventors: Poh Boon KHOO, Jiun Hann SIR, Min Suet LIM, Seok Ling LIM, Yew San LIM
  • Publication number: 20230395480
    Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 7, 2023
    Applicant: Intel Corporation
    Inventors: Tin Poay Chuah, Jeff Ku, Min Suet Lim, Yew San Lim, Twan Sing Loo
  • Publication number: 20230397323
    Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 7, 2023
    Inventors: Min Suet LIM, Tin Poay CHUAH, Yew San LIM, Jeff KU, Twan Sing LOO, Poh Boon KHOO, Jiun Hann SIR
  • Publication number: 20230317680
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes one or more ribbon bond connections along with one or more wire bond connections. In one example, ribbon bond connections are shown, and are coupled to ground, and configured to provide a shielding effect to wire bond connections.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventors: Prabhat Ranjan, Boon Ping Koh, Min Suet Lim, Yew San Lim, Ranjul Balakrishnan, Omkar Karhade, Robert A. Stingel, Nitin Deshpande
  • Patent number: 11699664
    Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 11, 2023
    Assignee: Intel Corporation
    Inventors: Eng Huat Goh, Tin Poay Chuah, Yew San Lim, Min Suet Lim
  • Publication number: 20230123645
    Abstract: There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 20, 2023
    Inventors: Tin Poay CHUAH, Jeff KU, Yew San LIM, Boon Ping KOH, Min Suet LIM
  • Patent number: 11596052
    Abstract: The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: February 28, 2023
    Assignee: Intel Corporation
    Inventors: Wei Cheang Lau, Yew San Lim, Min Suet Lim
  • Patent number: 11589460
    Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 21, 2023
    Assignee: INTEL CORPORATION
    Inventors: Tin Poay Chuah, Min Suet Lim, Chee Chun Yee, Yew San Lim, Eng Huat Goh
  • Publication number: 20230017925
    Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.
    Type: Application
    Filed: September 16, 2022
    Publication date: January 19, 2023
    Inventors: Jeff Ku, Min Suet Lim, Tin Poay Chuah, Yew San Lim, Twan Sing Loo
  • Patent number: 11556157
    Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: January 17, 2023
    Assignee: INTEL CORPORATION
    Inventors: Min Suet Lim, Chee Chun Yee, Yew San Lim, Jeff Ku, Tin Poay Chuah
  • Patent number: 11487326
    Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: November 1, 2022
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Tin Poay Chuah, Yew San Lim, Min Suet Lim, Chee Chun Yee
  • Patent number: 11481001
    Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: October 25, 2022
    Assignee: INTEL CORPORATION
    Inventors: Chee Chun Yee, Tin Poay Chuah, Yew San Lim, Min Suet Lim, Jeff Ku
  • Patent number: 11445608
    Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: September 13, 2022
    Assignee: Intel Corporation
    Inventors: Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Min Suet Lim, Tin Poay Chuah, Yew San Lim
  • Publication number: 20220110229
    Abstract: Particular embodiments described herein provide for an electronic device that includes an electronic component, a support structure that includes a radiation source, a radiation shield on the support structure. The radiation shield includes a wall and the wall is not continuous around the radiation source and includes a radiation shield gap, where the electronic component covers the radiation shield gap to complete the radiation shield wall.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Applicant: Intel Corporation
    Inventors: Boon Ping Koh, Yew San Lim, Min Suet Lim
  • Publication number: 20220078911
    Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.
    Type: Application
    Filed: November 6, 2020
    Publication date: March 10, 2022
    Inventors: Tin Poay CHUAH, Min Suet LIM, Chee Chun YEE, Yew San LIM, Eng Huat GOH
  • Publication number: 20220075410
    Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.
    Type: Application
    Filed: November 5, 2020
    Publication date: March 10, 2022
    Inventors: Min Suet LIM, Chee Chun YEE, Yew San LIM, Jeff KU, Tin Poay CHUAH
  • Publication number: 20220066506
    Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.
    Type: Application
    Filed: November 4, 2020
    Publication date: March 3, 2022
    Inventors: Jeff KU, Tin Poay CHUAH, Yew San LIM, Min Suet LIM, Chee Chun YEE
  • Publication number: 20220066509
    Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.
    Type: Application
    Filed: November 4, 2020
    Publication date: March 3, 2022
    Inventors: Chee Chun YEE, Tin Poay CHUAH, Yew San LIM, Min Suet LIM, Jeff KU
  • Publication number: 20220068834
    Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
    Type: Application
    Filed: November 5, 2020
    Publication date: March 3, 2022
    Inventors: Eng Huat GOH, Tin Poay CHUAH, Yew San LIM, Min Suet LIM