Patents by Inventor Yew San Lim
Yew San Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147654Abstract: The present disclosure is directed to a laptop arrangement including: a chassis defining a space that is divided into a first compartment and a second compartment, the first compartment including an air inlet and the second compartment including an air outlet; and a partitioning element positioned between the first and second compartments, whereby the partitioning element at least partially seals the first compartment from the second compartment and enables the second compartment to have a greater pressurization than the first compartment.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Inventors: Jiunn Shyong CHEE, Howe Yin LOO, Tin Poay CHUAH, Chin Kung GOH, Yew San LIM
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Publication number: 20240006338Abstract: A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed between the first and the second plurality of solder balls and configured to shield each solder ball of the first and second plurality of solder balls from electromagnetic interference.Type: ApplicationFiled: July 4, 2022Publication date: January 4, 2024Inventors: Poh Boon KHOO, Jiun Hann SIR, Min Suet LIM, Seok Ling LIM, Yew San LIM
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Publication number: 20230395480Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.Type: ApplicationFiled: June 7, 2022Publication date: December 7, 2023Applicant: Intel CorporationInventors: Tin Poay Chuah, Jeff Ku, Min Suet Lim, Yew San Lim, Twan Sing Loo
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Publication number: 20230397323Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.Type: ApplicationFiled: June 7, 2022Publication date: December 7, 2023Inventors: Min Suet LIM, Tin Poay CHUAH, Yew San LIM, Jeff KU, Twan Sing LOO, Poh Boon KHOO, Jiun Hann SIR
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Publication number: 20230317680Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes one or more ribbon bond connections along with one or more wire bond connections. In one example, ribbon bond connections are shown, and are coupled to ground, and configured to provide a shielding effect to wire bond connections.Type: ApplicationFiled: March 29, 2022Publication date: October 5, 2023Inventors: Prabhat Ranjan, Boon Ping Koh, Min Suet Lim, Yew San Lim, Ranjul Balakrishnan, Omkar Karhade, Robert A. Stingel, Nitin Deshpande
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Patent number: 11699664Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.Type: GrantFiled: November 5, 2020Date of Patent: July 11, 2023Assignee: Intel CorporationInventors: Eng Huat Goh, Tin Poay Chuah, Yew San Lim, Min Suet Lim
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Publication number: 20230123645Abstract: There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements.Type: ApplicationFiled: October 14, 2021Publication date: April 20, 2023Inventors: Tin Poay CHUAH, Jeff KU, Yew San LIM, Boon Ping KOH, Min Suet LIM
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Patent number: 11596052Abstract: The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.Type: GrantFiled: August 10, 2020Date of Patent: February 28, 2023Assignee: Intel CorporationInventors: Wei Cheang Lau, Yew San Lim, Min Suet Lim
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Patent number: 11589460Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.Type: GrantFiled: November 6, 2020Date of Patent: February 21, 2023Assignee: INTEL CORPORATIONInventors: Tin Poay Chuah, Min Suet Lim, Chee Chun Yee, Yew San Lim, Eng Huat Goh
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Publication number: 20230017925Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.Type: ApplicationFiled: September 16, 2022Publication date: January 19, 2023Inventors: Jeff Ku, Min Suet Lim, Tin Poay Chuah, Yew San Lim, Twan Sing Loo
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Patent number: 11556157Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.Type: GrantFiled: November 5, 2020Date of Patent: January 17, 2023Assignee: INTEL CORPORATIONInventors: Min Suet Lim, Chee Chun Yee, Yew San Lim, Jeff Ku, Tin Poay Chuah
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Patent number: 11487326Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.Type: GrantFiled: November 4, 2020Date of Patent: November 1, 2022Assignee: Intel CorporationInventors: Jeff Ku, Tin Poay Chuah, Yew San Lim, Min Suet Lim, Chee Chun Yee
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Patent number: 11481001Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.Type: GrantFiled: November 4, 2020Date of Patent: October 25, 2022Assignee: INTEL CORPORATIONInventors: Chee Chun Yee, Tin Poay Chuah, Yew San Lim, Min Suet Lim, Jeff Ku
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Patent number: 11445608Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.Type: GrantFiled: June 17, 2020Date of Patent: September 13, 2022Assignee: Intel CorporationInventors: Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Min Suet Lim, Tin Poay Chuah, Yew San Lim
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Publication number: 20220110229Abstract: Particular embodiments described herein provide for an electronic device that includes an electronic component, a support structure that includes a radiation source, a radiation shield on the support structure. The radiation shield includes a wall and the wall is not continuous around the radiation source and includes a radiation shield gap, where the electronic component covers the radiation shield gap to complete the radiation shield wall.Type: ApplicationFiled: December 17, 2021Publication date: April 7, 2022Applicant: Intel CorporationInventors: Boon Ping Koh, Yew San Lim, Min Suet Lim
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Publication number: 20220078911Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.Type: ApplicationFiled: November 6, 2020Publication date: March 10, 2022Inventors: Tin Poay CHUAH, Min Suet LIM, Chee Chun YEE, Yew San LIM, Eng Huat GOH
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Publication number: 20220075410Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.Type: ApplicationFiled: November 5, 2020Publication date: March 10, 2022Inventors: Min Suet LIM, Chee Chun YEE, Yew San LIM, Jeff KU, Tin Poay CHUAH
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Publication number: 20220066506Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.Type: ApplicationFiled: November 4, 2020Publication date: March 3, 2022Inventors: Jeff KU, Tin Poay CHUAH, Yew San LIM, Min Suet LIM, Chee Chun YEE
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Publication number: 20220066509Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.Type: ApplicationFiled: November 4, 2020Publication date: March 3, 2022Inventors: Chee Chun YEE, Tin Poay CHUAH, Yew San LIM, Min Suet LIM, Jeff KU
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Publication number: 20220068834Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.Type: ApplicationFiled: November 5, 2020Publication date: March 3, 2022Inventors: Eng Huat GOH, Tin Poay CHUAH, Yew San LIM, Min Suet LIM