Patents by Inventor Yew Yap

Yew Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050020098
    Abstract: A land grid array connector includes a housing having a plurality of passageways therethrough and a conductive contact provided in each passageway. A recess is formed in each passageway. Each contact has a deformable portion having a tip provided at an end thereof. The deformable portion is capable being in an undeformed position and in a deformed position. When a lateral force is placed on the deformable portion of each contact, at least a portion of the tip is maintained within the recess. The recess is sized and configured to limit lateral deflection of the tip upon deformation of the deformable portion in a lateral direction.
    Type: Application
    Filed: July 24, 2003
    Publication date: January 27, 2005
    Inventors: Samuel Ramey, Lily Chang, Yew Yap