Patents by Inventor Yew Yuen

Yew Yuen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8911179
    Abstract: The invention relates to a jack-up rig. The inventive rig would work like a conventional jack-up rig while in open water with the hull jacked up out of the water. However, in the event of ice conditions, the hull is lowered into the water into an ice defensive configuration. The hull is specifically shaped with a lower portion that is an ice-bending surface to bend and break up ice that comes in contact with the hull while in the ice defensive configuration. Furthermore, the jack-up rig comprises at least two derricks.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: December 16, 2014
    Assignees: ConocoPhillips Company, Keppel Offshore & Marine Technology
    Inventors: Peter G. Noble, Randall S. Shafer, Dominique P. Berta, Yew Yuen Chow, Tak On Cheung, Kok Seng Foo, Chin Kau Quah, Cynthia Wang
  • Patent number: 8888410
    Abstract: A single heavy lift system is made of modular units, each of which has a pair of supporting legs carrying a transverse beam therebetween. The beam is engaged to the supporting legs through jackup units that allow the transverse beams of several modular units move in unison and thus increase lifting capacity of the system. The modular units can be formed as modular, self-propelled units, transported to the site, where the lifting task is to be performed if necessary. The system can be positioned in a dry dock or offshore.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: November 18, 2014
    Assignee: Keppel Offshore & Marine USA, Inc.
    Inventors: Yew Yuen Chow, Tak On Cheung
  • Publication number: 20130101357
    Abstract: The invention relates to an ice worthy jack-up rig that may extend the drilling season in shallow water off shore Arctic or ice prone locations. The inventive rig would work like a conventional jack-up rig while in open water with the hull jacked up out of the water. However, in the event of ice conditions, the hull is lowered into the water into an ice defensive configuration. The hull is specifically shaped with a lower portion that is an ice-bending surface to bend and break up ice that comes in contact with the hull while in the ice defensive configuration. Furthermore, the ice worthy jack-up rig that comprises at least two derricks so as to double the exploration efficiency and lower the relating costs.
    Type: Application
    Filed: February 14, 2012
    Publication date: April 25, 2013
    Applicants: Keppel Offshore & Marine Technology Centre PTE Ltd., ConocoPhillips Company
    Inventors: Peter G. NOBLE, Randall S. SHAFER, Dominique P. BERTA, Yew Yuen CHOW, Tak On CHEUNG, Kok Seng FOO, Chin Kau QUAH, Cynthia WANG
  • Publication number: 20110142590
    Abstract: A single heavy lift system is made of modular units, each of which has a pair of supporting legs carrying a transverse beam therebetween. The beam is engaged to the supporting legs through jackup units that allow the transverse beams of several modular units move in unison and thus increase lifting capacity of the system. The modular units can be formed as modular, self-propelled units, transported to the site, where the lifting task is to be performed if necessary. The system can be positioned in a dry dock or offshore.
    Type: Application
    Filed: April 15, 2009
    Publication date: June 16, 2011
    Applicant: Keppel Offshore & Marine USA, Inc.
    Inventors: Yew Yuen Chow, Tak On Cheung
  • Publication number: 20060160267
    Abstract: An integrated circuit package and method of manufacture is provided. A substrate having a number of contact pads exposed through a passivation layer thereon has a first under bump metallurgy layer over at least one of the contact pads. A top under bump metallurgy layer of copper having a thickness of less than about 800 angstroms is formed over the first under bump metallurgy layer.
    Type: Application
    Filed: January 14, 2005
    Publication date: July 20, 2006
    Applicant: STATS ChipPAC Ltd.
    Inventors: Hyeong Hur, Yew Yuen, See Lim, Puay Chua, Kah Gan, Jae-Yong Song, Yonggang Jin, Kyaw Aung