Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.

Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.

Abstract: One or more embodiments are directed to leadframes and leadframe semiconductor packages. One embodiment is directed to copper leadframes with one or more die pads and one more leads with a roughened surface. Covering the roughened surface of the die pad of the leadframe is nanolayer of Silver (Ag). The thickness of the nanolayer preferably has a thickness that corresponds to the roughened surface of the copper leadframe. For instance, in one embodiment, the copper leadframe is roughened to have peaks and valleys that approximately average 10 nanometers and the thickness of the nanolayer is 10 nanometers. Covering a portion of the nanolayer of Ag is a microlayer of Ag, which provides a suitable bonding surface for coupling a semiconductor die to the die pad by an adhesive material.

Abstract: Embodiments of the present disclosure are directed to a leadframe packages that include a leadframe having a surface that is selectively treated with chemicals that reduce the wettability of the surface and thereby reduce adhesive flow on the surface and methods of forming a packing comprising same. In one embodiment there is provided a leadframe having an upper surface that includes a first portion that is treated with an anti-epoxy bleed out chemical and a second portion that was not treated with the anti-epoxy bleed out chemical. A semiconductor die is attached to the upper surface of the leadframe at the second portion via an epoxy adhesive.