Abstract: A nitrogen plasma treatment is used on an adhesion layer of a contact plug. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the adhesion layer. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the adhesion layer. A nitrogen plasma treatment is used on an opening in an insulating layer. As a result of the nitrogen plasma treatment, nitrogen is incorporated into the insulating layer at the opening. When a contact plug is deposited in the opening, an interlayer of a metal nitride is formed between the contact plug and the insulating layer.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: A package structure includes a semiconductor device, a molding compound, a first dielectric layer, and a through-via. The molding compound is in contact with a sidewall of the semiconductor device. The first dielectric layer is over the molding compound and the semiconductor device. The through-via is in the molding compound and the first dielectric layer. The through-via is a continuous element and in contact with the first dielectric layer.

Abstract: Methods, systems, and apparatus are described for transferring application data. In one aspect, a method includes causing, by a first component on a first device to establish a wireless connection with a second device; receiving, from a second component on the second device, data specifying one or more applications that are installed on the second device and supported by the second component, each of the applications being separate from the second component; determining, by the first component, that a first application installed on the first device corresponds to one of the applications installed on the second device, the first application being separate from the first component; receiving, by the first component, first application data from the first application; and causing, by the first component, the first device to send the first application data to the second component running on the second device using the wireless connection.

Abstract: The present disclosure relates to a method of forming a device. The method includes depositing a first layer of getter material on a substrate. A first electrode is formed in a first conductive layer deposited on the first layer of getter material. An insulator element is formed in a piezoelectric layer deposited on the first electrode. A second electrode is formed in a second conductive layer deposited on the insulator element. A first input-output electrode is formed to be conductively connected to the first layer of getter material and a second input-output electrode is formed to be conductively connected to the second electrode.

Abstract: A display module and a display device are disclosed. The display module includes a display panel, a heat dissipation film disposed on a side of the display panel facing away from a display side, and an ultrasonic fingerprint module. The heat dissipation film is provided with a first opening, and the ultrasonic fingerprint module includes a sensor disposed within the first opening and fixed on the side of the display panel facing away from the display side by a shading adhesive layer. The display module further includes a light shielding sheet attached on a side of the heat dissipation film facing away from the display panel. The light shielding sheet is provided with a second opening which exposes the sensor. An orthographic projection of the light shielding sheet and the shading adhesive layer on the display panel includes an orthographic projection of the first opening on the display panel.

Abstract: The present disclosure provides a circular stapler including an instrument body, a handle assembly and a staple pushing rod; wherein an indicator and a strike part are disposed in the instrument body, and the indicator is rotatably connected to the instrument body; when the stapler is in an initial state, the indicator is in a first position area and pressed against the strike part; when the stapler is in a firing state, the indicator is moved to a second position area and separated from the strike part; when the stapler being fired, the indicator returns to the first position area from the second position area, strikes the strike part and emits a strike sound. The strike sound prompts an operator that firing has been successfully completed, so that the operator can know the firing state of the stapler in time and user experience of the operator can be improved.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate, and recessing the isolation regions. After the recessing, a portion of a semiconductor material between the isolation region protrudes higher than top surfaces of the isolation regions to form a semiconductor fin. The method further includes forming a gate stack, which includes forming a gate dielectric on sidewalls and a top surface of the semiconductor fin, and depositing a titanium nitride layer over the gate dielectric as a work-function layer. The titanium nitride layer is deposited at a temperature in a range between about 300° C. and about 400° C. A source region and a drain region are formed on opposing sides of the gate stack.

Abstract: A package structure includes a semiconductor die, a redistribution circuit structure, and a metallization element. The semiconductor die has an active side and an opposite side opposite to the active side. The redistribution circuit structure is disposed on the active side and is electrically coupled to the semiconductor die. The metallization element has a plate portion and a branch portion connecting to the plate portion, wherein the metallization element is electrically isolated to the semiconductor die, and the plate portion of the metallization element is in contact with the opposite side.

Abstract: An illuminated keyswitch structure and an illuminating module thereof are provided. The illuminating module includes a drive circuit board having a reflector layer disposed thereon, a light-emitting part disposed on the drive circuit board and proximate to the reflector layer, a covering structure having an island-shaped covering portion, and a spacer adhered between the covering structure and the drive circuit board and having a through hole and an adhesive-less clearance fringe at least partially surrounding the through hole, wherein the island-shaped covering portion covers above the light-emitting part and the through hole.

Abstract: The disclosure aims to provide a chemical synthesis method of a prodelphinidin B9 gallate, in which the prodelphinidin B9 gallate is synthesized by using a proanthocyanidin from Chinese bayberry leaves as a raw material, and using epigallocatechin gallate (EGCG) as a nucleophilic reagent to attack C4 sites of subunits EGCG and epigallocatechin (EGC) of the proanthocyanidin from Chinese bayberry leaves in the presence of hydrochloric acid as a catalyst. Compared with prodelphinidin B9 gallates extracted and separated from materials such as tea leaves, and Chinese bayberry leaves, the prodelphinidin B9 gallate prepared by the method provided in the present disclosure has higher purity and yield, and can be directly used as a nutrient enhancer and a natural antioxidant in the field of food.

Abstract: A method for manufacturing an elastic fiber and the elastic fiber are provided. The method includes: providing a thermoplastic polyester elastomer; drying the thermoplastic polyester elastomer; melting the thermoplastic polyester elastomer by an extruder to form a melt; extruding the melt by a spinneret plate to form a plurality of filamentous streams; feeding the filamentous streams into a spinning channel for cooling and curing to form a plurality of monofilaments; and bundling and oiling the monofilaments by an oil wheel, after extending and guiding the monofilaments by a first godet roller and a second godet roller, and winding the monofilaments by a winder to obtain a thermoplastic polyester elastic fiber.

Abstract: A driving head-changeable tool is provided, including: a main body, including a chamber and an assembling end, the chamber including concave portions and convex portions alternatively arranged circumferentially, the chamber further including at least one receiving hole each receiving a blocking member; an outer sleeve, disposed around the main body, including a recess and a projection protrusive, the outer sleeve being slidable relative to the main body; wherein when the outer sleeve is located in a first position, the projection urges the blocking member to project within the chamber to retain the polygonal ball joint in the chamber; when the outer sleeve is located in a second position, the blocking member is retractable in the recess to be not protrusive within the chamber so that the polygonal ball joint is disengageable from the chamber.

Abstract: The present disclosure provides a SARS-CoV-2 vaccine composition and use thereof. The SARS-CoV-2 vaccine composition includes a mutant SARS-CoV-2 spike protein with N-linked glycosylation in N-terminal domain or receptor binding domain, and can effectively elicit an immune response in an individual against different SARS-CoV-2 variants.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.

Abstract: This application provides an image encoding and decoding method and apparatus. The method may include: reading a first sub-image of a first frame of image from a first memory, and storing the first sub-image into a second memory, where the first memory is an off-chip memory, and the second memory is an on-chip memory; encoding a base layer of the first sub-image based on the first sub-image, to obtain a bitstream of the base layer of the first sub-image and a first reconstructed image; writing the first reconstructed image into the second memory; reading the first reconstructed image and the first sub-image from the second memory; and encoding a first enhancement layer of the first sub-image based on the first reconstructed image and the first sub-image, to obtain a bitstream of the first enhancement layer of the first sub-image and a second reconstructed image.

Abstract: A system for exploiting natural gas hydrate with downhole gas-liquid synergic depressurization includes a casing configured to form an exploitation well. An upper end of the exploitation well is connected to a produced gas collection pipeline, and the produced gas collection pipeline is configured to be connected to a produced gas recovery system. A perforated channel is distributed in a section of the casing located in a natural gas hydrate reservoir. A tubular string component assembly is mounted in the exploitation well, and includes an outer string, a production tubular string and an auxiliary riser. A first check valve is mounted at the bottom of the outer string, a gas supply pipeline is connected into an upper portion of the outer string, and a flow controller is mounted in the gas supply pipeline. The production tubular string is mounted in the outer string.

Abstract: The disclosure includes compounds of Formula (A), (A) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, and R11, h, j m, n, k, v, s, g, V, W, L, Z1, Q1, Q2, Q3, Q4, Q5, Q6 and Q7, are defined herein. Also disclosed is a method for treating a neoplastic disease, an autoimmune disease, or a nerodegenerative disease with these compounds.

Abstract: The present disclosure relates to the fields of a method a kit for molecular diagnostics and genomics. More particularly, this disclosure relates to a method and a kit fir detecting a DNA fragment joining event or distinguishing an alternative splicing event. The present disclosure also relates to a method for administering a subject with proper treatment by steps of determining the risk of a particular cancer type or genotype.

Abstract: A sleep monitoring system and a sleep monitoring method are provided. The sleep monitoring system includes a receiver, a transmitter, a storage and a processing circuit. The receiver and the transmitter are disposed in the target field, and the transmitter transmits a wireless detection signal to the target field. The user is located between the receiver and the transmitter, and the receiver receives the wireless detection signal over multiple communication links. The processing circuit is electrically connected to the receiver and the storage, and analyzes a change of the wireless detection signal within a predetermined time, so as to detect a sleep time of a user within the predetermined time, and obtains a sleep quality of the user within the sleep time.