Abstract: A test strip detecting system includes a test strip, a test strip detecting carrier and a mobile communication apparatus. The test strip detecting carrier includes a container structure, positioning markers and colorimetric calibrating blocks, and the colorimetric calibrating blocks are embedded inside the positioning markers. The test strip is placed in the container structure and reacts with a specimen to generate color blocks. The mobile communication apparatus controls an image capture unit to capture an original image of the test strip placed in the test strip detecting carrier; detects the positioning markers in the original image to obtain a plurality of coordinates of the positioning markers; performs image coordinate calibration according to the plurality of coordinates to generate a calibrated image; and performs a colorimetric calibration for the color blocks and the colorimetric calibrating blocks according to the calibrated image so as to generate a test result.

Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.

Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.

Abstract: In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.

Abstract: A risk control system for traffic devices includes a light emitting device, a processing element and a user prompting element. The processing element is electrically connected with the light emitting device, and outputs a prompt signal. The user prompting element is electrically connected with the processing element, and receives the prompt signal.

Abstract: An optical engine module and a projection device are provided. The optical engine module includes a light source unit, a first diffusion element, a polarizing beam splitting element, a second diffusion element, and a light valve. The light source unit emits a light beam. The first diffusion element is disposed on a transmission path of the light beam. The polarizing beam splitting element is disposed on the transmission path of the light beam. The first diffusion element is disposed between the polarizing beam splitting element and the light source unit. The second diffusion element has at least one optical surface to reflect and diffuse the light beam. The light beam forms an illumination beam after passing through the second diffusion element, and the illumination beam has an optical image matching angle. The light valve is disposed on a transmission path of the illumination beam. The light valve converts the illumination beam to an image beam.

Abstract: An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. Further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. Therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.

Abstract: A wrapper layer over a target interface receives requests from client devices over a different interface, converts the requests into a format that is compatible with the target interface, and transmits each converted request over the target interface for processing by a service. The wrapper layer also processes a request by a client device to subscribe to a certain type of update made via the target interface by verifying that the client device is authorized to access a resource associated with that type of update and creating a subscription that identifies the client device and the type of update. When the wrapper layer subsequently receives a request corresponding to that type of update, the wrapper layer matches attributes of the request to the subscription by the client device and transmits a message notifying the client device of the request.

Abstract: A display panel with a less costly backup arrangement for failed light-emitting elements and a driving method thereof are disclosed. The display panel includes a plurality of pixels. Each pixel includes a plurality of main sub-pixels and a backup sub-pixel. For any one of the pixels, if there is a failed main sub-pixel, the backup sub-pixel is activated and configured for cooperating with non-failed main sub-pixels to output metamerized light of a desired target color in order that no change in color or brightness is perceived by a viewer.

Abstract: A one-coil multi-core inductor-capacitor (LC) oscillator is provided. The one-coil multi-core LC oscillator includes a main coil and at least one mode suppression device. The main coil includes an outer wire and a central wire, wherein the outer wire is coupled to a first core circuit and a second core circuit, and the central wire is coupled between a first node and a second node of the outer wire. More particularly, an outer loop formed by the outer wire corresponds to a first mode of the one-coil multi-core LC oscillator, and inner loops formed by the outer wire and the central wire correspond to a second mode of the one-coil multi-core LC oscillator, where the at least one mode suppression device is configured to suppress one of the first mode and the second mode.

Abstract: Described herein are techniques for integrating external sensors to an edge device, such as for ingesting data into a data intake and query system. The edge device has an internal message broker for communicating with internal (e.g., preconfigured, recognized) sensors, and an external message broker for communicating with external (e.g., customer-configured, otherwise unrecognized) sensors. The external message broker provides access to customer configuration of external sensors, but is logically quarantined from the internal message broker to prevent unwanted customer access to internal configurations. The internal and external message brokers interface only via a bridging service that transforms external sensor data into data based on customer-configurable transformations. The transformed data can be handled by the edge device and/or downstream components (e.g., a data intake and query system) in the same manner as internal sensor data.

Abstract: The present disclosure provides a structure and method of fabricating the structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: Various embodiments of the present disclosure are directed towards a method for nondestructive inspection of cell etch redeposition. In some embodiments of the method, a grayscale image of a plurality of cells on a wafer is captured. The grayscale image provides a top down view of the cells and, in some embodiments, is captured in situ after etching to form the cells. The cells are identified in the grayscale image to determine non-region of interest (non-ROI) pixels corresponding to the cells. The non-ROI pixels are subtracted from the grayscale image to determine ROI pixels. The ROI pixels are remaining pixels after the subtracting and correspond to material on sidewalls of, and in recesses between, the cells. An amount of etch redeposition on the sidewalls and in the recesses is then scored based on gray levels of the ROI pixels. Further, the wafer is processed based on the score.

Abstract: A power storage device has a first power storage unit, a second power storage unit, a third power storage unit, and a fourth power storage unit. The power storage device is provided with a common electrode being integrated molding to make the first power storage unit and the second power storage unit connected in series, the third power storage unit and the fourth power storage unit connected in series, the first power storage unit and the third power storage unit connected in parallel, and the second power storage unit and the fourth power storage unit connected in parallel, so inside of the power storage device can have high potential and high capacitance, and avoid the problem of increasing the overall impedance caused by the conventional welding process. Further, the power storage device uses both surfaces of the common electrode at the same time to save electrode material.

Abstract: A projection apparatus including an illumination system and a projection imaging system is provided. The illumination system is adapted to emit an illumination beam, and the illumination system includes a light source module and a light shaping module. The light source module is adapted to emit at least one beam. The light shaping module is disposed on the transmission path of the at least one beam. The at least one beam forms an illumination beam after passing through the light shaping module, and the illumination beam has a light imaging matching angle. The light shaping module includes at least one first lens element. The at least one first lens element is disposed on the transmission path of the at least one beam. The projection imaging system is disposed on a transmission path of the illumination beam. The projection apparatus is suitable for eliminating stray light and crosstalk of images.

Abstract: Optical modules and methods of forming the same are provided. In an embodiment, an exemplary method includes forming multiple first optical elements over a first wafer, forming multiple second optical elements over a second wafer, forming multiple third optical elements over a third wafer, aligning the first wafer with the second wafer such that, upon the aligning of the first wafer with the second wafer, each first optical element is vertically overlapped with a corresponding second optical element. The method also includes bonding the first wafer with the second wafer to form a first bonded structure, aligning the second wafer with the third wafer such that, and upon bonding the second wafer of the first bonded structure to the third wafer, where upon the aligning of the second wafer with the third wafer, each second optical element is vertically overlapped with a corresponding third optical element.