Abstract: A label printing and attaching system includes a label printing device and a label attaching device. The label printing device has an ink tape supply mechanism for supplying an ink tape with a label pattern. A label tape supply mechanism of the label printing device is adapted to supply a label tape that includes a carrier tape and blank label paper adhered to the carrier tape. The label printing device further includes a heat transfer machine adapted to heat transfer the label pattern on the ink tape onto the blank label paper of the label tape to obtain a desired label. The label attaching device has a label picker adapted to pick up the label with the printed label pattern from the label tape, and a moving device adapted to move the label picker to place the picked label with the printed label pattern onto a product.

Abstract: The present disclosure relates to an electronic device, a wireless communication method and a computer-readable storage medium. The electronic device for a vehicle according to the present disclosure comprises a processing circuit configured to: determine load information of the vehicle; generate vehicle information, with the vehicle information comprising the load information of the vehicle; and send the vehicle information to a server for the server to determine, according to the vehicle information, road planning information for the vehicle. By using the electronic device, the wireless communication method and the computer-readable storage medium according to the present disclosure, the load information of the vehicle can be taken into consideration during road planning and decision planning, thereby better managing the load of the vehicle and more rationally planning a road.

Abstract: A platform for processing a workpiece includes a transmission mechanism, a plurality of workstations and a plurality of movable vehicles. The transmission mechanism transports the workpiece to be processed to one of the plurality of workstations. Each movable vehicle includes a processing module and a docking interface adapted to connect with a docking station of each workstation. The movable vehicles are each adapted to move in and out of each workstation, and each processing module is adapted to process the workpiece transmitted to the workstation after the movable vehicle is moved in and positioned in the workstation.

Abstract: Disclosed are a power supply circuit, power supply method, audio power amplifier and integrated circuit. The power supply circuit applied to an audio power amplifier may include: a measurement sub-circuit used for measuring a voltage of an audio signal input to the audio power amplifier, which corresponds to output power of the audio power amplifier; a control sub-circuit used for determining a target reference voltage range according to a voltage range of the audio signal within a predetermined time period, which is selected from a plurality of predetermined reference voltage ranges, wherein the voltage range of audio signal within the predetermined time period is included in the target reference voltage range; and a power supply sub-circuit used for generating, based on the target reference voltage range, a power supply voltage that matches the output power of the audio power amplifier, so as to supply power to the audio power amplifier.

Abstract: An optical element and a method for manufacturing the optical element are described. The optical element includes a transparent substrate, an optical layer, and an adhesive layer. The optical layer is located on a surface of the transparent substrate. The optical layer has a first surface and a second surface, which are opposite to each other. The first surface is set with various diffracting optical structures. A refractive index of the optical layer is equal to or greater than 1.4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.

Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.

Abstract: An object pickup system includes an object pickup device and a calculation device. The object pickup device includes a first bracket, a suction cup installed on the first bracket and adapted to be affixed to a top surface of an object, and a distance sensor installed on the first bracket and adapted to rotate with the first bracket to scan the top surface of the object. The calculation device is operatively connected to the distance sensor. The calculation device is adapted to calculate a distance from the top surface of the object to the distance sensor and a position of an edge of an opening on the top surface of the object based on the distance data collected by the distance sensor during a scanning operation.

Abstract: An access point (AP) and a station (STA) communicate with each other, with the AP indicating to the STA either or both of a preamble detection (PD) channel and a signaling (SIG) content channel and with the STA being initially monitoring a primary frequency segment of a plurality of frequency segments in an operating bandwidth of the AP. A downlink (DL) or triggered uplink (UL) communication is performed between the AP and the STA during a transmission opportunity (TXOP) such that: (i) during the TXOP, the STA monitors a preamble on the PD channel and decodes a SIG content on the SIG content channel; and (ii) after an end of the TXOP, the STA switches to the primary frequency segment.

Abstract: A biochemical analysis system capable of sample preparation and processing can include at least one inlet channel having a non-fouling, slippery surface to autonomously transport a fluid sample to a chamber by a geometry of the at least one inlet channel. The at least one inlet channel can include a first end, which is open and exposed, and a second end connected to the chamber for mixing and reaction of the fluid sample, and the at least one inlet channel can include a converging or diverging angle.

Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: A semiconductor device and method of manufacture are provided. In embodiments a first liner is deposited to line a recess between a first semiconductor fin and a second semiconductor fin, the first liner comprising a first material. The first liner is annealed to transform the first material to a second material. A second liner is deposited to line the recess, the second liner comprising a third material. The second liner is annealed to transform the third material to a fourth material.

Abstract: A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a semiconductor protruding structure over a substrate and surrounding the semiconductor protruding structure with an insulating layer. The method also includes forming a dielectric layer over the insulating layer. The method further includes partially removing the dielectric layer and insulating layer using a planarization process. As a result, topmost surfaces of the semiconductor protruding structure, the insulating layer, and the dielectric layer are substantially level with each other. In addition, the method includes forming a protective layer to cover the topmost surfaces of the dielectric layer. The method includes recessing the insulating layer after the protective layer is formed such that the semiconductor protruding structure and a portion of the dielectric layer protrude from a top surface of a remaining portion of the insulating layer.

Abstract: Disclosed herein are related to devices and methods for communication. In one aspect, a device includes a first processor and a second processor. The first processor may be configured to generate a first set of packets associated with an application data unit in a first layer corresponding to content data. Each packet of the first set of packets may include a flag indicative of an association with the application data unit. The second processor may be configured to generate a second set of one or more packets in a second layer for transmission, in response to determining that the first set of packets is associated with the application data unit according to flags of the first set of packets. The second processor may be configured to schedule to transmit the second set of one or more packets in the second layer within a defined time period.

Abstract: This disclosure relates to anti-TNFRSF9 (tumor necrosis factor receptor superfamily member 9) antibodies, antigen-binding fragments, and the uses thereof.

Abstract: The present invention relates to the field of pharmaceutical and chemical engineering, and specifically relates to a weakly acidic microenvironment-sensitive aptamer for tumors, a triptolide conjugate. The conjugate is formed by conjugation between the 14-position hydroxyl group of triptolide and the aptamer via an acetal ester linking bond, which is an acid-sensitive linking bond with a cleavage condition of (pH=3.5-6.5), which is much less pH-sensitive and is more likely to cleave under the tumor microenvironment. Based on the characteristics of the aptamer targeting the highly expressed proteins on the membrane surface of tumor cells, the conjugate delivered triptolide targeted to tumor cells and mediated endocytosis to reach the lysosome; based on the characteristics of the acidic environment of lysosomes, the acetal ester linking bond released intact triptolide in the lysosomal acidic environment, targeting and killing of tumor cells.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A layered semiconductor device comprises at least one particle structure disposed on an underlying layer that comprises a particle material in contact with a contact material selected from: a seed material, a co-deposited dielectric material and/or at least one patterning material. A method for controllably selecting formation of the at least one particle structure on an underlying layer during manufacture of the device comprises depositing at least one layer, including the underlying layer, and exposing its surface to a flux of a particle material such that it comes into contact with the contact material, and coalesces to dispose the at least one particle structure on the underlying layer.

Abstract: In a method for forming an integrated semiconductor device, a first inter-layer dielectric (ILD) layer is formed over a semiconductor device that includes a first transistor structure, a two-dimensional (2D) material layer is formed over and in contact with the first ILD layer, the 2D material layer is patterned to form a channel layer of a second transistor structure, a source electrode and a drain electrode of the second transistor structure are formed over the patterned 2D material layer and laterally spaced apart from each other, a gate dielectric layer of the second transistor structure is formed over the patterned 2D material layer, the source electrode and the drain electrode, and a gate electrode of the second transistor structure is formed over the gate dielectric layer and laterally between the source electrode and the drain electrode.

Abstract: A detection device for detecting a workpiece with multiple surfaces includes a rotary table carrying the workpiece and moving the workpiece by rotation and a plurality of photographing devices arranged at a plurality of different positions around the rotary table. Each photographing device has an image capture device capturing an image of a corresponding surface of the workpiece that is moved to the image capture device. An orientation of the image capture device is defined by a first offset angle and a second offset angle when the image capture device captures the image of the corresponding surface of the workpiece.