Abstract: A method for preparing eye-tracking glasses, comprising the following steps: providing a substrate assembly, the substrate assembly comprising a functional film, the functional film being arranged on a surface of the substrate assembly, and electronic components being arranged on the surface of the functional film. Pressing an injection mold against the substrate assembly to form an injection cavity, and making the surface of the functional film with the electronic components face an interior of the injection cavity. Injecting and molding an optical adhesive in the injection cavity to form a lens, with the electronic components embedded in the lens. Demolding the injection mold from the lens, separating the functional film from the substrate assembly to obtain the eye-tracking glasses.

Abstract: A method includes forming a first semiconductor channel region and a second semiconductor channel region, with the second semiconductor channel region overlapping the first semiconductor channel region, forming a first gate dielectric on the first semiconductor channel region, and forming a second gate dielectric on the second semiconductor channel region. A dipole dopant is incorporated into a first one of the first gate dielectric and the second gate dielectric to a higher atomic percentage, and a second one of the first gate dielectric and the second gate dielectric has a lower atomic percentage of the dipole dopant. A gate electrode is formed on both of the first gate dielectric and the second gate dielectric. The gate electrode and the first gate dielectric form parts of a first transistor, and the gate electrode and the second gate dielectric form parts of a second transistor.

Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.

Abstract: A method for preparing eye-tracking glasses: providing a substrate assembly, the substrate assembly comprising a functional film, the functional film being located on an outermost surface of the substrate assembly as a first surface, the first surface is provided with electronic components. Spraying a matching material towards the first surface, the matching material accumulating at least at a gap difference between the first surface and the electronic component. Providing a sealing layer, the sealing layer covering the first surface and the electronic components and the matching material disposed on the first surface. Providing a lens, the lens being connected to the functional film and the electronic components by the sealing layer.

Abstract: Disclosed are systems and techniques for training personalized language models. The techniques include applying a plurality of first machine learning models to a first input prompt. Each of the plurality of first machine learning models generates a respective reward value of a first plurality of reward values. The techniques include applying a second machine learning model to the first plurality of reward values to obtain first reward value embeddings; applying a third machine learning model to the first reward value embeddings and the first input prompt to obtain a first output response; calculating a first loss based on a comparison between the first output response and the first input prompt; and causing the second machine learning model to be modified based on the first loss.

Abstract: Methods for fabricating semiconductor devices are provided. An exemplary method includes forming fins in a dense region and in an isolated region of a semiconductor substrate; performing a plasma dry etch process to remove a portion of at least one selected fin to form a first trench in the dense region and to remove a portion of at least one selected fin in the isolated region to form a second trench in the isolated region, wherein the plasma dry etch process includes: performing a passivation-oriented process and an etchant-oriented process; and controlling the passivation-oriented process and the etchant-oriented process to form the first trench with a desired first critical dimension and first depth and to form the second trench with a desired second critical dimension and second depth.

Abstract: A head-mounted device may have an inner display that displays images for a user and an outer display that informs nearby people of the status of the user and inner display. For example, the outer display may display an image of a face, an abstract layer, or both, depending on whether the inner display is operating in passthrough mode, mixed reality mode, or virtual reality mode. An ambient light sensor in the head-mounted device may be used to measure the brightness and color of ambient light. The white point of the face layer on the outer display may be adapted to the color of ambient light, whereas the white point of the abstract layer on the outer display may remain fixed. The white point of a display may be a correlated color temperature setting (e.g., measured in degrees Kelvin) that determines the warmth or coolness of displayed colors.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A metal-integrated suspended line includes multiple metal substrates stacked from top to bottom and connected by rivets or screws to form a self-encapsulating structure. At least two of the metal substrates except a top metal substrate and a bottom metal substrate are spaced apart from each other, and each of the at least two metal substrates defines an air-filled hollow cavity. One of the metals substrates disposed between hollow cavities of the two metal substrates is provided with a circuit structure. The metal-integrated suspended line can give full play to advantages of all-metal-integrated suspended line platform, and achieve the circuit structure with high Q value, good electromagnetic shielding and excellent heat dissipation performance; meanwhile, a slotline structure can be designed by etching slots on the metal substrate disposed between the two hollow cavities of two of the at least two metal substrates.

Abstract: An assembly alignment structure for optical component includes an optical fiber, comprising: a combined fiber segment and a plurality of bare fiber segments; a cover plate, having a first installation surface disposed with a plurality of guide grooves, an installation groove, and at least one first coupling groove, the bare fiber segments being in the corresponding in the guide grooves; a lens, arranged in the installation groove; a chip, having a signal receiving surface; a carrier plate, having a second installation surface disposed with at least one second coupling groove, the chip being fixed on the second installation surface; and at least one positioning post; wherein when the cover plate and carrier plate are aligned, the positioning post is located in the first and second coupling grooves, and the optical fiber and the lens are fixed and aligned between the carrier plate and the cover plate.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: A method includes bonding a first package to a second package to form a third package. The first package is an Integrated Fan-Out (InFO) package including a plurality of package components, and an encapsulating material encapsulating the plurality of package components therein. The plurality of package components include device dies. The method further includes placing at least a portion of the third package into a recess in a Printed Circuit Board (PCB). The recess extends from a top surface of the PCB to an intermediate level between the top surface and a bottom surface of the PCB. Wire bonding is performed to electrically connect the third package to the PCB.

Abstract: A method for improving skin condition, hair health, anti-inflammation activity, cardiovascular health, anti-oxidation activity, anti-aging activity, and/or relieving body fatigue in a subject in need thereof is provided. The method includes administering to the subject a composition comprising yeast powder having at least 5000 ppm of nicotinamide mononucleotide.

Abstract: A method includes forming a redistribution structure on a carrier, attaching an integrated passive device on a first side of the redistribution structure, attaching an interconnect structure to the first side of the redistribution structure, the integrated passive device interposed between the redistribution structure and the interconnect structure, depositing an underfill material between the interconnect structure and the redistribution structure, and attaching a semiconductor device on a second side of the redistribution structure that is opposite the first side of the redistribution structure.

Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.

Abstract: Circuit board includes conductive plate, core dielectric layer, metallization layer, first build-up stack, second build-up stack. Conductive plate has channels extending from top surface to bottom surface. Core dielectric layer extends on covering top surface and side surfaces of conductive plate. Metallization layer extends on core dielectric layer and within channels of conductive plate. Core dielectric layer insulates metallization layer from conductive plate. First build-up stack is disposed on top surface of conductive plate and includes conductive layers alternately stacked with dielectric layers. Conductive layers electrically connect to metallization layer. Second build-up stack is disposed on bottom surface of conductive plate. Second build-up stack includes bottommost dielectric layer and bottommost conductive layer. Bottommost dielectric layer covers bottom surface of conductive plate.

Abstract: A pre-mold direct bond copper substrate includes a ceramic board, a copper layer eutectic-bonded onto a surface of the ceramic board, and a pre-encapsulation layer formed on the ceramic board. A part of the surface of the ceramic board not in contact with the copper layer is defined as a layout region. The pre-encapsulation layer is formed on the layout region and covers the copper layer, so that at least part of an outer surface of the copper layer is exposed from the pre-encapsulation layer. A coefficient of thermal expansion (CTE) of the pre-encapsulation layer is between a CTE of the ceramic board and a CTE of the copper layer. A top side of the pre-encapsulation layer is not lower than the outer surface of the copper layer, and a surrounding lateral side of the pre-encapsulation layer is flush with a surrounding lateral surface of the ceramic board.

Abstract: Semiconductor devices and fabrication methods are provided. In one example, a semiconductor device includes: a substrate, a fin formed on the substrate, a gate structure formed on the fin, a metal contact formed on the fin and adjacent to the gate structure. The fin extends along a first horizontal direction, the gate structure and the metal contact extend along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction. The gate structure further includes a gate electrode coupled to the fin and a dielectric gate isolation section separated from the gate electrode. The dielectric gate isolation section includes a dielectric material. A portion of the dielectric gate isolation section is aligned with a portion of the metal contact adjacent and proximate to the dielectric gate isolation section in the first horizontal direction.

Abstract: Semiconductor devices and methods of manufacture are described herein. The methods include forming a local organic interconnect (LOI) by forming a stack of conductive traces embedded in a passivation material, forming first and second local contacts over the passivation material, the second local contact being electrically coupled to the first local contact by a first conductive trace of the stack. The methods further include forming a backside redistribution layer (RDL) and a front side RDL on opposite sides of the LOI with TMVs electrically coupling the backside and front side RDLs to one another. First and second external contacts are formed over the backside RDL for mounting of semiconductor devices, the first and second external contacts being electrically connected to one another by the LOI. An interconnect structure is attached to the front side RDL for further routing. External connectors electrically coupled to the external contacts at the backside RDL.

Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.