Patents by Inventor Yi An

Yi An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177950
    Abstract: A lighting keyboard is provided with at least one keyswitch, a support plate and a backlight module. The keyswitch has a keycap and a switch under the keycap. The support plate connects beneath the keycap by a support mechanism. The backlight module has a lighting board configured underneath the support plate and corresponding to the keycap. The lighting board includes a board, a first reflective layer and a circuit layer. The circuit layer is disposed on the board and includes a concave-convex structure and circuit traces. The circuit traces electrically connects with a light emitting unit. The first reflective layer covers the concave-convex structure to form microstructure regions.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 30, 2024
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Po-Yueh Chou
  • Publication number: 20240178152
    Abstract: The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking material is less than 50%, which is suitable for forming the mark on the semiconductor device by laser sintering, and the marking material is sintered to make the resin cross-link and cure to form a cured product. In addition, in one embodiment, the cured product formed by the marking material can be used as a deflector to guide the flow of the underfill and control the flow rate of underfill, so as to effectively solve the problem of uneven flow rate of the underfill.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Wei CHEN, Po-Yuan TENG, Chiahung LIU, HAO-YI TSAI
  • Publication number: 20240178090
    Abstract: A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. The electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.
    Type: Application
    Filed: February 7, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Tzu-Sung Huang, Hao-Yi Tsai, Ming-Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin
  • Publication number: 20240179725
    Abstract: A first wireless device receives sidelink control information (SCI) indicating a resource reservation of first resources and an identifier (ID) indicating that a second wireless device is an intended receiver of a sidelink transmission by a third wireless device. The first wireless device transmits, to the third wireless device, coordination information indicating second resources for the sidelink transmission, wherein the second resources are selected for the coordination information based on the second wireless device being the intended receiver of the sidelink transmission.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Applicant: Ofinno, LLC
    Inventors: Bing Hui, Hyukjin Chae, Esmael Hejazi Dinan, Yunjung Yi
  • Publication number: 20240178120
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.
    Type: Application
    Filed: February 8, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Tzu-Sung Huang, Wei-Kang Hsieh, Hao-Yi Tsai, Ming-Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Chu-Chun Chueh
  • Publication number: 20240174413
    Abstract: A water bottle cap includes a cap body including a space, an upper hole member through a top and communicating with the space of the cap body, a plurality of apertures spaced around and through the top, and a lower through hole communicating with both the space of the cap body and an internal space of a bottle, and a valve moveably disposed in the cap body and comprising an axial flow channel, a tube disposed through the hole member into the space of the cap body, an annular flange extending outward from an outer surface of the tube into the space of the cap body, and a bottom extension extending downward from a joining portion of the tube and the annular flange into the through hole. The valve is configured to move to a closed position, a spraying position, or an open position relative to the cap body.
    Type: Application
    Filed: November 25, 2022
    Publication date: May 30, 2024
    Inventor: YI-JEN HUANG
  • Publication number: 20240177319
    Abstract: Many unsupervised domain adaptation (UDA) methods have been proposed to bridge the domain gap by utilizing domain invariant information. Most approaches have chosen depth as such information and achieved remarkable successes. Despite their effectiveness, using depth as domain invariant information in UDA tasks may lead to multiple issues, such as excessively high extraction costs and difficulties in achieving a reliable prediction quality. As a result, we introduce Edge Learning based Domain Adaptation (ELDA), a framework which incorporates edge information into its training process to serve as a type of domain invariant information. Our experiments quantitatively and qualitatively demonstrate that the incorporation of edge information is indeed beneficial and effective, and enables ELDA to outperform the contemporary state-of-the-art methods on two commonly adopted benchmarks for semantic segmentation based UDA tasks.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ting-Hsuan Liao, Huang-Ru Liao, Shan-Ya Yang, Jie-En Yao, Li-Yuan Tsao, Hsu-Shen Liu, Bo-Wun Cheng, Chen-Hao Chao, Chia-Che Chang, Yi-Chen Lo, Chun-Yi Lee
  • Publication number: 20240176116
    Abstract: An optical lens assembly includes: a first element group including: a first lens group with positive refractive power, including one or two lenses; a second element group including: a second lens group with positive refractive power, including two or three lenses; an optical element including, in order from a visual side to an image source side: an absorptive polarizer, a reflective polarizer and a first phase retarder; and a partial-reflective-partial-transmissive element; and a third element group including an image source plane. The first element group, the second element group and the third element group are arranged in order from the visual side to the image source side. When the optical lens assembly satisfies a specific condition, the weight of the device can be reduced, the zoom function can be provided, and the image quality can be ensured.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 30, 2024
    Inventors: Ping-Yi CHEN, Fei-Hsin TSAI, Cong GE
  • Publication number: 20240177661
    Abstract: An array substrate is provided. The array substrate includes K number of reset signal lines respectively configured to provide reset signals to reset transistors in K columns pixel driving circuits of the array substrate. The K number of reset signal lines includes a plurality of third reset signal lines in (2k?1)-th columns of K columns, K and k being positive integers, 1?k?(K/2), and a plurality of fourth reset signal lines in (2k)-th columns of the K columns. A respective third reset signal line and a respective fourth reset signal line have different line patterns.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 30, 2024
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Tinghua Shang, Biao Liu, Siyu Wang, Yuge Chu, Yi Zhang
  • Publication number: 20240175962
    Abstract: An electronic device is provided. The electronic device includes an ultra-wideband (UWB) communication circuit including at least one antenna for acquiring signals from an external electronic device, a processor operatively connected with the UWB communications circuit, and memory operatively connected with the processor. The memory may store one or more instructions which, when executed, cause the processor to obtain at least one signal from the at least one antenna, determine a phase-difference-of-arrival of the at least one signal, obtain information related to the state of the electronic device, obtain a calibration value corresponding to the obtained state information of the electronic device from the memory, and determine the angle-of-arrival of the at least one signal based on the phase-difference-of-arrival of the at least one signal and the calibration value.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 30, 2024
    Inventors: Kunyoung CHOI, Doosuk KANG, Moonseok KANG, Hyunchul KIM, Yi YANG
  • Publication number: 20240179627
    Abstract: A wireless device receives parameters, including a first discontinuous reception (DRX) configuration associated with unicast transmissions in a cell and a second DRX configuration associated with multicast and broadcast services (MBS) in the cell. The wireless device may also receive a power saving (PS) indication indicating not to start a DRX on duration timer. The PS indication may be applied for the first DRX configuration; and it may not be applied for the second DRX configuration. The wireless device may further skip monitoring, in a first DRX on duration of the first DRX configuration, first physical downlink control channels (PDCCHs) for the unicast transmissions based on receiving the PS indication. The wireless device may also monitor, in a second DRX on duration of the second DRX configuration and while skipping monitoring the first PDCCHs in the first DRX on duration, second PDCCHs for the MBS.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 30, 2024
    Applicant: Ofinno, LLC
    Inventors: Hua Zhou, Esmael Hejazi Dinan, Yunjung Yi, Ali Cagatay Cirik, Jonghyun Park, Hyoungsuk Jeon, Hyukjin Chae, Kai Xu
  • Publication number: 20240178321
    Abstract: A method of forming a semiconductor device includes forming a fin protruding above a substrate; forming a liner over the fin; performing a surface treatment process to convert an upper layer of the liner distal to the fin into a conversion layer, the conversion layer comprising an oxide or a nitride of the liner; forming isolation regions on opposing sides of the fin after the surface treatment process; forming a gate dielectric over the conversion layer after forming the isolation regions; and forming a gate electrode over the fin and over the gate dielectric.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 30, 2024
    Inventors: Wan-Yi Kao, Chung-Chi Ko
  • Publication number: 20240175938
    Abstract: An electric-electric-leakage detection device includes an electric-leakage detection module, a switch module and an indicator. The electric-leakage detection module is configured for converting an AC electric-leakage voltage into a DC electric-leakage voltage. The switch module is electrically connected to the electric-leakage detection module and configured for being turned on or turned off according to the DC electric-leakage voltage. The indicator is electrically connected to the switch module and configured for outputting an indication signal according to conduction of the switch module.
    Type: Application
    Filed: February 16, 2023
    Publication date: May 30, 2024
    Inventor: Po-Yi KU
  • Publication number: 20240177836
    Abstract: Disclosed herein are systems, methods, and software for providing a platform for artificial intelligence-assisted image analysis.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 30, 2024
    Inventors: David Seungwon PAIK, Cameron ANDREWS, Mark D. LONGO, Jesse LIEMAN-SIFRY, Jaclynn PETERS, Sumedha KUCHERLAPATI, Jennifer KLOCKENBRINK, Jeffrey C. LERMAN, Samir MEHTA, Atreyee MUKHERJEE, Aaron LONG, Darvin YI
  • Publication number: 20240176941
    Abstract: Signal lines in the pin field of a printed circuit board layout are modified to reduce line impedance and improve signal integrity. The widths of signal lines are extended in the pin field to take full advantage of the available routing space between pads and adjacent signal lines. The signal line extension can be considered a subtractive approach in that the signal lines are extended to occupy the available muting space, with signal line extensions that would otherwise cause design rule violations being subtracted out. The edge of a signal line is extended to a keep-out region associated with a centerline that extends through a plurality of pads arranged in a line and located adjacent to the signal line. The edge of the signal line is also extended to keep-out regions associated with pads in the pin fields.
    Type: Application
    Filed: June 23, 2021
    Publication date: May 30, 2024
    Applicant: Intel Corporation
    Inventors: Xiaoning Ye, Jorge A. Alvarez, Jose de Jesus Jauregui Ruelas, Vijaya K. Kunda, Hong-Yi Luoh, Yanwu Wang, Chunfei Ye
  • Publication number: 20240178406
    Abstract: A solid oxide cell includes a fuel electrode, an air electrode, and an electrolyte disposed between the fuel electrode and the air electrode. The fuel electrode may include a porous metal body having pores and a barrier portion disposed in the pores of the porous metal body, and the barrier portion has a shape of at least one of a sheet shape and a flake shape.
    Type: Application
    Filed: July 3, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Suong Yang, Byung Chul Jang, Jung Deok Park, Hyeg Soon An, Su Beom Park, Jae Seok Yi, Jung Hyun Lee
  • Publication number: 20240178151
    Abstract: Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Inventors: Minglu LIU, Alexander AGUINAGA, Gang DUAN, Jung Kyu HAN, Yosuke KANAOKA, Yi LI, Robin MCREE, Hong Seung YEON
  • Publication number: 20240177714
    Abstract: In general, this disclosure describes techniques for generating and evaluating automatic transcripts of audio recordings containing human speech. In some examples, a computing system is configured to: generate transcripts of a plurality of audio recordings; determine an error rate for each transcript by comparing the transcript to a reference transcript of the audio recording; receive, for each transcript, a subjective ranking selected from a plurality of subjective rank categories; determine, based on the error rates and subjective rankings, objective rank categories defined by error-rate ranges; and assign an objective ranking to a new machine-generated transcript of a new audio recording, based on the objective rank categories and an error rate of the new machine-generated transcript.
    Type: Application
    Filed: February 6, 2024
    Publication date: May 30, 2024
    Inventors: Yong Yi Bay, Yang Angelina Yang, Menglin Cao
  • Publication number: 20240179902
    Abstract: A semiconductor device fabrication method includes providing a processing wafer. The processing wafer has core and staircase structure (SS) regions, and includes a bottom conductor layer, conductor/dielectric tier(s) over the bottom conductor layer, and a channel hole (CH) in the core region and extending approximately vertically through the conductor/dielectric tier(s). The CH includes a channel layer and a memory film surrounding the channel layer. A protrusion portion of the channel layer and a protrusion portion of the memory film extend into the bottom conductor layer. The method further includes patterning the bottom conductor layer to remove a portion of the bottom conductor layer in the core region to expose the protrusion portion of the memory film, performing etching to remove the protrusion portion of the memory film to expose the protrusion portion of the channel layer, performing impurity implantation, and performing laser activation.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 30, 2024
    Inventors: Lina MIAO, Liang XIAO, Yi ZHAO, Shu WU
  • Publication number: 20240173207
    Abstract: The present disclosure relates to a method of displaying locations of acupuncture points in the human body using artificial intelligence and may provide a method of displaying locations of acupuncture points in the human body, which may convert the sizes of the joint points from an artificial intelligence deep-learning model (e.g., MediaPipe, etc.) to fit the subject body, calculate locations of acupuncture points on the hands, feet, face, body, etc. through vector calculation of the joint points, and display the same in real-time image on the subject body in augmented reality.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 30, 2024
    Inventors: Myunggi YI, Jaewoong HAN, Byeong-Il LEE