Patents by Inventor Yi-Chang Huang
Yi-Chang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145691Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.Type: ApplicationFiled: March 14, 2023Publication date: May 2, 2024Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
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Publication number: 20240136191Abstract: A method of forming a semiconductor device includes forming source/drain regions on opposing sides of a gate structure, where the gate structure is over a fin and surrounded by a first dielectric layer; forming openings in the first dielectric layer to expose the source/drain regions; selectively forming silicide regions in the openings on the source/drain regions using a plasma-enhanced chemical vapor deposition (PECVD) process; and filling the openings with an electrically conductive material.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Min-Hsiu Hung, Chien Chang, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang
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Publication number: 20240112945Abstract: In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Inventors: Anhthu NGO, Zuoming ZHU, Balasubramanian RAMACHANDRAN, Paul BRILLHART, Edric TONG, Anzhong CHANG, Kin Pong LO, Kartik SHAH, Schubert S. CHU, Zhepeng CONG, James Francis MACK, Nyi O. MYO, Kevin Joseph BAUTISTA, Xuebin LI, Yi-Chiau HUANG, Zhiyuan YE
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Publication number: 20240079278Abstract: A method includes forming a pad layer. The pad layer includes a first portion over a first part of a semiconductor substrate, and a second portion over a second part of the semiconductor substrate. The first portion has a first thickness, and the second portion has a second thickness smaller than the first thickness. The semiconductor substrate is then annealed to form a first oxide layer over the first part of the semiconductor substrate, and a second oxide layer over the second part of the semiconductor substrate. The pad layer, the first oxide layer, and the second oxide layer are removed. A semiconductor layer is epitaxially grown over and contacting the first part and the second part of the semiconductor substrate.Type: ApplicationFiled: January 6, 2023Publication date: March 7, 2024Inventors: Jhih-Yong Han, Wen-Yen Chen, Yi-Ting Wu, Tsai-Yu Huang, Huicheng Chang, Yee-Chia Yeo
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Publication number: 20240079524Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.Type: ApplicationFiled: September 6, 2023Publication date: March 7, 2024Inventors: Wei-Jen HSUEH, Shih-Chang LEE, Kuo-Feng HUANG, Wen-Luh LIAO, Jiong-Chaso SU, Yi-Chieh LIN, Hsuan-Le LIN
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Patent number: 11923200Abstract: An integrated circuit includes a gate structure over a substrate. The integrated circuit includes a first silicon-containing material structure in a recess. The first silicon-containing material structure includes a first layer below a top surface of the substrate and in direct contact with the substrate. The first silicon-containing material structure includes a second layer over the first layer, wherein an entirety of the second layer is above the top surface of the substrate, a first region of the second layer closer to the gate structure is thinner than a second region of the second layer farther from the gate structure. The first silicon-containing material structure includes a third layer between the first layer and the second layer, wherein at least a portion of the third layer is below the top surface of the substrate.Type: GrantFiled: May 25, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Hsien Huang, Yi-Fang Pai, Chien-Chang Su
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Publication number: 20240069606Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.Type: ApplicationFiled: November 3, 2023Publication date: February 29, 2024Applicants: Acer Incorporated, Sinher Technology Inc.Inventors: Yi-Ta Huang, Cheng-Nan Ling, Chih-Chun Liu, Yung-Chang Chiang
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Patent number: 10437737Abstract: A data storage device includes a flash memory and a flash memory controller. The flash memory controller operates the flash memory to store data, and stores a mapping table to record the mapping information between a plurality of logical addresses and a plurality of physical addresses of the flash memory. The mapping table is divided into a plurality of groups. Some of the groups are categorized into a first type of trim group and some of the logical addresses of each of the groups of the first type of trim group are included in a trim command. The flash memory controller performs the trim on the groups of the first type of trim group.Type: GrantFiled: January 12, 2018Date of Patent: October 8, 2019Assignee: SILICON MOTION, INC.Inventors: Chien-Chung Chung, Kuan-Hui Li, Yi-Chang Huang
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Patent number: 10234915Abstract: A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.Type: GrantFiled: September 9, 2015Date of Patent: March 19, 2019Assignee: HTC CorporationInventors: Chin-Kai Sun, Jen-Cheng Lai, Jia-Yuan Hsu, Yi-Chang Huang, Chieh-Pei Chou
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Publication number: 20180373643Abstract: A data storage device includes a flash memory and a flash memory controller. The flash memory controller operates the flash memory to store data, and stores a mapping table to record the mapping information between a plurality of logical addresses and a plurality of physical addresses of the flash memory. The mapping table is divided into a plurality of groups. Some of the groups are categorized into a first type of trim group and some of the logical addresses of each of the groups of the first type of trim group are included in a trim command. The flash memory controller performs the trim on the groups of the first type of trim group.Type: ApplicationFiled: January 12, 2018Publication date: December 27, 2018Inventors: Chien-Chung CHUNG, Kuan-Hui LI, Yi-Chang HUANG
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Publication number: 20170067701Abstract: A graphite thermal conductor includes graphite bands laminated in the thickness direction. The thermal conductivity coefficient of each graphite band in the extending path is greater than the thermal conductivity coefficient thereof in the thickness direction. The extending path of each graphite band has at least one first bend in a plane which is perpendicular to the thickness direction. An electronic device applying the above graphite thermal conductor and a method for manufacturing graphite thermal conductor are also provided.Type: ApplicationFiled: September 9, 2015Publication date: March 9, 2017Inventors: Chin-Kai Sun, Jen-Cheng Lai, Jia-Yuan Hsu, Yi-Chang Huang, Chieh-Pei Chou
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Patent number: 8385070Abstract: A portable electronic device comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing. The heat-conduction structure is disposed in the housing and contacts the circuit board. The heat-dissipation structure is disposed outside the housing and connected to the heat-conduction structure, wherein heat is transmitted from the circuit board, passing the heat-conduction structure and the heat-dissipation structure to be dissipated out of the housing.Type: GrantFiled: May 1, 2006Date of Patent: February 26, 2013Assignee: HTC CorporationInventors: Yi-Chang Huang, Yao-Chung Lin
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Patent number: 7778035Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.Type: GrantFiled: February 13, 2009Date of Patent: August 17, 2010Assignee: HTC CorporationInventors: Yi-Chang Huang, Yao-Chung Lin
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Publication number: 20090215508Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.Type: ApplicationFiled: February 13, 2009Publication date: August 27, 2009Inventors: Yi-Chang Huang, Yao-Chung Lin
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Patent number: 7522419Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.Type: GrantFiled: May 1, 2006Date of Patent: April 21, 2009Assignee: HTC CorporationInventors: Yi-Chang Huang, Yao-Chung Lin
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Patent number: 7375967Abstract: A heat-dissipation method comprises providing a heat-transfer module and a heat-dissipation module, wherein the heat-transfer module is disposed in a portable electronic device, and the heat-dissipation module is disposed in a battery charger. The heat-dissipation module then contacts the heat-transfer module to remove heat from the electronic device via conduction. Finally, the heat-dissipation module dissipates heat via conduction or convection.Type: GrantFiled: November 23, 2005Date of Patent: May 20, 2008Assignee: High Tech Computer, Corp.Inventors: Yi-Chang Huang, Yao-Chung Lin
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Patent number: 7301766Abstract: A transmission device of a handheld electronic device including a housing having an inlet and an outlet, a fan installed within the housing for generating airflow from the inlet to the outlet and a guide tube installed on the housing having a first opening and a second opening, the first opening is located at the outlet side, the second opening is coupled to an opening of the handheld electronic device in a detachable manner to allow airflow generated by the fan into the handheld electronic device, the guide tube can improve cooling effect of the transmission device and the transmission device is capable of cooling the handheld electronic device to solve the heating problem while the handheld electronic device is being utilized.Type: GrantFiled: July 19, 2005Date of Patent: November 27, 2007Assignee: High Tech Computer Corp.Inventors: Yi-Chang Huang, Yao-Chung Lin
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Publication number: 20060274506Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.Type: ApplicationFiled: May 1, 2006Publication date: December 7, 2006Inventors: Yi-Chang Huang, Yao-Chung Lin
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Publication number: 20060262500Abstract: A portable electronic device comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing. The heat-conduction structure is disposed in the housing and contacts the circuit board. The heat-dissipation structure is disposed outside the housing and connected to the heat-conduction structure, wherein heat is transmitted from the circuit board, passing the heat-conduction structure and the heat-dissipation structure to be dissipated out of the housing.Type: ApplicationFiled: May 1, 2006Publication date: November 23, 2006Inventors: Yi-Chang Huang, Yao-Chung Lin
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Publication number: 20060232929Abstract: A heat-dissipation method comprises providing a heat-transfer module and a heat-dissipation module, wherein the heat-transfer module is disposed in a portable electronic device, and the heat-dissipation module is disposed in a battery charger. The heat-dissipation module then contacts the heat-transfer module to remove heat from the electronic device via conduction. Finally, the heat-dissipation module dissipates heat via conduction or convection.Type: ApplicationFiled: November 23, 2005Publication date: October 19, 2006Inventors: Yi-Chang Huang, Yao-Chung Lin