Abstract: The present invention discloses scalarane sesterterpenoids represented by formula (I) and meroditerpenoid represented by formula (II), which are extracted from Carteriospongia sp. sponge: where R1 is —CH3 or —C2H5. The compounds of formula (I) can be used to be an anticancer, act as an inhibitor targeting to topoisomerase II and hsp90 and a pharmaceutical composition for anticancer.

Abstract: A method for processing a semiconductor wafer is provided. The method includes transferring the semiconductor wafer from an interface tool to a Chemical Mechanical Polishing (CMP) tool. The method further includes polishing the semiconductor wafer with the CMP tool. The method also includes transferring the semiconductor wafer back to the interface tool from the CMP tool. In addition, the method includes converting a mixture to a mist spray and discharging the mist spray over the semiconductor wafer in the interface tool after the semiconductor wafer is polished by the CMP tool.

Abstract: A chemical mechanical polish (CMP) system is provided. The CMP system includes a platen rotatable about a rotation axis. The CMP system further includes a polishing pad positioned on the platen. The CMP system also includes a detecting module having a base portion and a number of pins positioned over the polishing pad. The pins are movable relative to the platen and have their bottom end in direct contact with the polishing pad to detect the planarity of the polishing pad.

Abstract: The present invention discloses scalarane sesterterpenoids represented by formula (I) and meroditerpenoid represented by formula (II), which are extracted from Carteriospongia sp. sponge: where R1 is —CH3 or —C2H5. The compounds of formula (I) can be used to be an anticancer, act as an inhibitor targeting to topoisomerase II and hsp90 and a pharmaceutical composition for anticancer.

Abstract: A chemical mechanical polish (CMP) system is provided. The CMP system includes a platen rotatable about a rotation axis. The CMP system further includes a polishing pad positioned on the platen. The CMP system also includes a detecting module having a base portion and a number of pins positioned over the polishing pad. The pins are movable relative to the platen and have their bottom end in direct contact with the polishing pad to detect the planarity of the polishing pad.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: Method for preparing 2,5-furan dicarboxylic acid is provided, which includes contacting a furan composition with an oxidant in the presence of a catalyst system. The furan composition includes a first compound and a second compound. The first compound is a compound of Formula 1: In Formula 1, R1 is C1-9 alkyl group. The second compound is a compound of Formula 2, a compound of formula 3, a compound of Formula 4, a compound of Formula 5, or combinations thereof. In Formula 3, R2 is C1-9 alkyl group. The 2,5-furan dicarboxylic acid is a compound of Formula 6.

Abstract: The present invention provides a method and apparatus reporting a channel quality indicator (CQI) of a communication system, including: detecting a first measurement reflecting a first communication quality of the communication system, providing first reference(s) respectively corresponding to indicator level(s), providing CQI according to the indicator level(s) and a relation between the first measurement and the first reference(s), and updating one (or more) first reference according to a second measurement reflecting a second communication quality of the communication system. For example, the first measurement can represent signal to interference ratio or mutual information, and the second measurement can represent data error rate or throughput. First reference(s) can be further adjusted according to a third measurement, e.g., a power scheduling of base station, such that CQI can be updated if base station schedules additional transmission power.

Abstract: A decoding apparatus has an on-chip buffer, an external buffer interface, and a turbo decoder. The on-chip buffer is arranged for buffering each code block to be decoded. The external buffer interface is arranged for accessing an off-chip buffer. The turbo decoder is arranged for decoding a specific code block read from the on-chip buffer. The specific code block is not transmitted from the on-chip buffer to the off-chip buffer via the external buffer interface unless decoding fail of the specific code block is identified.

Abstract: A communications apparatus. Multiple antennas are arranged to receive downlink signals and transmit uplink signals. A transceiver module is arranged to receive the downlink signals from the antennas and pass the uplink signals to an antenna selection device. The antenna selection device is coupled between the antennas and the transceiver module and arranged to receive the uplink signals to be transmitted from the transceiver module and dynamically pass the uplink signals to one of the antennas according to an antenna selection signal. A processor is arranged to receive the downlink signals from the transceiver module, calculate short-term signal qualities of the downlink signals and generate the antenna selection signal according to the short-term signal qualities.

Abstract: A decoding apparatus has an on-chip buffer, an external buffer interface, and a turbo decoder. The on-chip buffer is arranged for buffering each code block to be decoded. The external buffer interface is arranged for accessing an off-chip buffer. The turbo decoder is arranged for decoding a specific code block read from the on-chip buffer. The specific code block is not transmitted from the on-chip buffer to the off-chip buffer via the external buffer interface unless decoding fail of the specific code block is identified.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: The present invention provides a method and apparatus reporting a channel quality indicator (CQI) of a communication system, including: detecting a first measurement reflecting a first communication quality of the communication system, providing first reference(s) respectively corresponding to indicator level(s), providing CQI according to the indicator level(s) and a relation between the first measurement and the first reference(s), and updating one (or more) first reference according to a second measurement reflecting a second communication quality of the communication system. For example, the first measurement can represent signal to interference ratio or mutual information, and the second measurement can represent data error rate or throughput. First reference(s) can be further adjusted according to a third measurement, e.g., a power scheduling of base station, such that CQI can be updated if base station schedules additional transmission power.

Abstract: A communications apparatus. Multiple antennas are arranged to receive downlink signals and transmit uplink signals. A transceiver module is arranged to receive the downlink signals from the antennas and pass the uplink signals to an antenna selection device. The antenna selection device is coupled between the antennas and the transceiver module and arranged to receive the uplink signals to be transmitted from the transceiver module and dynamically pass the uplink signals to one of the antennas according to an antenna selection signal. A processor is arranged to receive the downlink signals from the transceiver module, calculate short-term signal qualities of the downlink signals and generate the antenna selection signal according to the short-term signal qualities.

Abstract: A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: Purge bars for blowing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: A thermal module (1) includes a base (30), a fin group (40), a heat pipe (50) and a connective interface. The fin group comprises a plurality of closely-spaced parallel fins (42). A first end of the heat pipe is attached to the base, and an opposite second end of the heat pipe is received in a slot defined in the fin group. The connective interface is disposed between the second end of the heat pipe and the fin group. The connective interface has high thermal conductivity, and readily connects with the heat pipe and the fin group.