Abstract: A semiconductor structure includes: a base, a first and a second electrode layer, where the first electrode layer is located on the base and includes a first comb handle part and a plurality of first comb tooth parts connected to the first comb handle part and arranged in parallel, one end of the first comb handle part is configured to access an input signal, and the other end is configured to access an output signal; and the second electrode layer is located on the base and located on the same layer with the first electrode layer, and includes a second comb handle part and a plurality of second comb tooth parts connected to the second comb handle part and arranged in parallel, the second comb tooth parts and the first comb tooth parts are parallel in a crossed manner, and the second comb handle part is configured to be grounded.

Abstract: In one form, a method includes: providing a base, where a bottom film layer structure is formed on the base and includes a plurality of discrete first regions and a plurality of second regions located among the first regions; forming top conductive layers on the bottom film layer structure of the first regions, where openings are enclosed between the adjacent top conductive layers and the bottom film layer structure; forming grooves in the bottom film layer structure at bottoms of the openings, where bottoms of the grooves are lower than bottoms of the top conductive layers; and forming a first dielectric layer on the top conductive layers, where the first dielectric layer is further located in the grooves, seals tops of the openings and encloses air gaps together with the openings, and bottoms of the air gaps are lower than the bottoms of the top conductive layers.

Abstract: Provided are an interaction method and apparatus in a live streaming room, and a device and a storage medium. The method comprises: in response to a trigger operation for a preset duet entry on a live streaming room page, jumping from the live streaming room page to a camera capture page, wherein a host portrait cutout corresponding to the live streaming room page is displayed on the camera capture page and a capture control is provided on the camera capture page acquiring multimedia information captured by a camera, in response to a trigger operation for the capture control on the camera capture page, wherein the multimedia information comprises an image or a video; and synthesizing the multimedia information with the host portrait cutout to obtain a duet multimedia product.

Abstract: A semiconductor device includes: a substrate; a plurality of first conductive layers disposed at the substrate, the plurality of first conductive layers being arranged in a first direction, each of the plurality of first conductive layers being parallel to a second direction, and the first direction being perpendicular to the second direction; a conductive plug disposed at the plurality of first conductive layers, the conductive plug being parallel to the first direction, and a bottom surface of the conductive plug being in contact with surfaces of the plurality of first conductive layers; and a second conductive layer disposed at the conductive plug, a bottom surface of the second conductive layer being in contact with a top surface of the conductive plug.

Abstract: Provided are an interaction method and apparatus in a live streaming room, a device, and a storage medium. The method comprises: in response to a trigger operation for a preset drawing entry on a live streaming room page, jumping to a graphic drawing page from the live streaming room page, a drawing trajectory set for a preset object being displayed on the graphical drawing page; when a drawing stroke on the graphic drawing page is received, matching the drawing stroke with the drawing trajectory; and if it is determined that the drawing stroke is successfully matched with the drawing trajectory, displaying prompt information about successful participation in a preset activity, the preset activity and the preset drawing entry having a correspondence.

Abstract: A semiconductor structure includes a substrate, a bottom metal structure located on the substrate, a first dielectric layer located on the bottom metal structure, first plug structures, second plug structures, and first metal structures. The substrate includes a base, a device structure located on the base, and conductive layers located on the device structure. The bottom metal structure is electrically connected to the conductive layers. The first dielectric layer includes a first opening structure and a second opening structure. The first opening structure includes first grooves and second grooves on top of the first grooves, and the second opening structure includes third grooves and fourth grooves on top of the third grooves. The first plug structures are located in the first grooves, and the second plug structures are located in the third grooves. The first metal structures are located in the second grooves and the fourth grooves.

Abstract: A bus is provided, including: a frame assembly including a front frame, a rear frame and a hinge turntable therebetween; carriages including a front carriage having a front carriage body and a front carriage floor, and a rear carriage having a rear carriage body and a rear carriage floor; a front axle and a middle axle disposed at a bottom of the front frame; a rear axle disposed at a bottom of the rear frame; a first group of battery packs including a first battery pack disposed within a rear cabin in the rear of the rear carriage body and a second battery pack disposed on the rear frame; a second group of battery packs disposed on upper surfaces of top roof of the front and rear carriage bodies; a third group of battery packs disposed on the front carriage floor and between the front axle and the hinge turntable.

Abstract: A bus is provided, including: a frame assembly including a front frame, a rear frame and a hinge turntable therebetween; carriages including a front carriage having a front carriage body and a front carriage floor, and a rear carriage having a rear carriage body and a rear carriage floor; a front axle and a middle axle disposed at a bottom of the front frame; a rear axle disposed at a bottom of the rear frame; a first group of battery packs including a first battery pack disposed within a rear cabin in the rear of the rear carriage body and a second battery pack disposed on the rear frame; a second group of battery packs disposed on upper surfaces of top roof of the front and rear carriage bodies; a third group of battery packs disposed on the front carriage floor and between the front axle and the hinge turntable.