Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

Abstract: The present invention provides a method of food advertising which includes the following steps of: to form a vender marking region, at least one third-party marking region and a merchandise name marking region on the packaging material; a food vendor marks food information of the food in the vender marking region and marks merchandise name of the food in the merchandise name marking region; at least one third-party company pays the food vendor a certain amount of fee to obtain the right of using the third-party marking region; and the third-party company marks an advertisement content in the third-party marking region. Whereby, the payment paid by the third-party company can serve as a subsidy of the cost of the packaging material, so that consumers can purchase the food with lower expense or for free.