Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A spacer fabric having removable yarns is provided. The spacer fabric includes a first fabric layer, a second fabric layer, and a middle fabric layer. The first fabric layer is formed of general-purpose yarns and the removable yarns wherein the general-purpose yarns and the removable yarns are arranged to a weft-knitted loop construction according to a predetermined pattern The middle fabric layer is formed of wave-like fibers interlocked with the first fabric layer and the second fabric layer. The predetermined pattern appears on the first fabric layer after the removable yarns are removed.

Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A wireless system is provided and includes a first coil, a second coil, and a capacitance adjusting unit. The second coil is configured to sense the first coil. The capacitance adjusting unit is connected to the first coil, the capacitance adjusting unit includes at least one closed loop and a connecting wire, and the connecting wire is connected between the first coil and the closed loop.

Abstract: A method, a mixed reality (MR) system, and a recording medium for detecting a real-world light source in MR are provided. The method is applicable to the MR system having a computing apparatus and a head-mounted display (HMD). In the method, a plurality of light regions of a plurality of continuous images is analyzed, and each of the light regions is projected according to a coordinate position of the HMD corresponding to the plurality of continuous images to generate three-dimensional vectors. Then, the three-dimensional vectors are clustered to predict a directional light in a current image. Finally, a plurality of intersection points between the three-dimensional vectors is calculated, and a point light in the current image is predicted according to the intersection points.

Abstract: A surface extraction method that includes the steps outlined below is provided. (A) Raw input depth data of 3D child nodes are received that includes positions and distances of first 3D child nodes and positions of second 3D child nodes. (B) The neighboring 3D child nodes are grouped into 3D parent nodes. (C) For each 3D parent nodes, propagated distances of the second 3D child nodes are generated. (D) The 3D parent nodes are treated as the 3D child nodes to perform the steps (B)-(D) to generate a tree including a plurality levels of nodes such that a surface extraction processing is performed on the tree to extract at least one surface of the scene.

Abstract: A method, a system and a recording medium for building environment map are provided. In the method, a plurality of captured images are captured by using a head-mounted display (HMD). Then, a viewing direction and a translation direction of the HMD are calculated, and an importance map corresponding to the captured images is determined according to the viewing direction and the translation direction of the HMD. Finally, the captured images are stitched to generate a panoramic image according to the importance map.

Abstract: An integral spacer fabric provided with adaptive thickness and a method of fabricating the same are provided. The spacer fabric includes a first fabric layer and a second fabric layer and a central fabric layer which is intertwined with the first fabric layer and the second fabric layer and formed of a plurality of wave-like fibers. The central fabric layer is formed with adaptive thicknesses in accordance with a predetermined thickness pattern by means of a flat knitting machine.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

Abstract: A multi-color spacer fabric and a garment made of the same are disclosed. The multi-color space fabric in accordance with the present invention provides includes a first fabric layer, a second fabric layer and a central fabric layer. The first and second fabric layers are both made of yarns. The central fabric layer is intertwined with the first fabric layer and the second fabric layer and formed of a plurality of wave-like fibers. The first fabric layer has a color different from the second fabric layer. The first fabric layer is arranged to have a relatively-dense region and a relatively-dilute region such the color of the second fabric layer is partially transparent through the central fabric layer and the portion of first fabric layer within the relatively-dilute region.

Abstract: A surface extraction method that includes the steps outlined below is provided. (A) Raw input depth data of 3D child nodes are received that includes positions and distances of first 3D child nodes and positions of second 3D child nodes. (B) The neighboring 3D child nodes are grouped into 3D parent nodes. (C) For each 3D parent nodes, propagated distances of the second 3D child nodes are generated. (D) The 3D parent nodes are treated as the 3D child nodes to perform the steps (B)-(D) to generate a tree including a plurality levels of nodes such that a surface extraction processing is performed on the tree to extract at least one surface of the scene.

Abstract: A wireless system is provided and includes a first coil, a second coil, and a capacitance adjusting unit. The second coil is configured to sense the first coil. The capacitance adjusting unit is connected to the first coil, the capacitance adjusting unit includes at least one closed loop and a connecting wire, and the connecting wire is connected between the first coil and the closed loop.

Abstract: A fabric includes an inner textile layer, an outer textile layer, and a middle textile layer. The inner textile layer includes a plurality of microfiber yarns and a plurality of elastic fiber yarns. The outer textile layer includes a plurality of composite yarns. The middle textile layer is between the inner textile layer and the outer textile layer and has a plurality of wave-like polyester fiber yarns. Further, the outer textile layer includes a first weaving region and a second weaving region. The content of the composite yarns in the first weaving region is greater than the content of the composite yarns in the second weaving region.

Abstract: A fabric includes a first textile layer, a second textile layer, and a middle textile layer. The first textile layer includes a plurality of first fiber yarns. The second textile layer is separated from the first textile layer, and the second textile layer includes a plurality of second fiber yarns. The middle textile layer is between the first textile layer and the second textile layer, and the middle textile layer includes a plurality of middle fiber yarns. One or more of the middle fiber yarns has one or more peak and one or more valley. The peak is knitted with the first textile layer and the valley is knitted with the second textile layer. Sizes of the fiber yarns are 30 deniers, weaving densities of the fiber yarns are less than 28 and the opacity rate of the fabric is less than 15%.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Abstract: A light emitting diode package including a circuit layer, a light-shielding layer, a plurality of light emitting diodes and an encapsulation layer is provided. A thickness of the circuit layer is less than 100 ?m. The light-shielding layer is disposed on a first surface of the circuit layer and the light-shielding layer has a plurality of apertures. The light emitting diodes are disposed on the first surface of the circuit layer and in the apertures of the light-shielding layer. The light emitting diodes are electrically connected to the circuit layer. The encapsulation layer covers the light-shielding layer. A refractive index of the encapsulation layer is 1.4 and to 1.7. The Young's modulus of the encapsulation layer is larger than or equal to 1 GPa. A thickness of the encapsulation layer is greater than thicknesses of the light emitting diodes.

Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.