Patents by Inventor Yi-Chen Yeh

Yi-Chen Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12213577
    Abstract: A combined support belt and storage pack is a multi-purpose weightlifting belt having adjustable foam fill, an ergonomic back panel, a dual clip adjustment system, a storage pack and abdominal strap. When used as a weightlifting belt the storage pack is removed and the abdominal strap is utilized to secure about the waist of a user via the dual clip adjustment system. When not in use as a weightlifting belt, the device may operate as a shoulder pack having the storage pack secured to the ergonomic back and abdominal strap.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: February 4, 2025
    Inventors: Ashley Lopez, Braiddey Ruzicka, Malyna Sanchez, Matthew Hsu, Yi Chen Yeh, Barry Phothong
  • Patent number: 11527564
    Abstract: A manufacturing method of an image sensor including the following steps is provided. A substrate is provided. A light sensing device is formed in the substrate. A storage node is formed in the substrate. The storage node and the light sensing device are separated from each other. A buried gate structure is formed in the substrate. The buried gate structure includes a buried gate and a first dielectric layer. The buried gate is disposed in the substrate and covers at least a portion of the storage node. The first dielectric layer is disposed between the buried gate and the substrate. A first light shielding layer is formed on the buried gate. The first light shielding layer is located above the storage node and electrically connected to the buried gate.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: December 13, 2022
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Pin-Chieh Huang, Jui-Hung Hung, Yi-Chen Yeh, Cheng-Han Yang, Wen-Hao Huang
  • Publication number: 20210134864
    Abstract: A manufacturing method of an image sensor including the following steps is provided. A substrate is provided. A light sensing device is formed in the substrate. A storage node is formed in the substrate. The storage node and the light sensing device are separated from each other. A buried gate structure is formed in the substrate. The buried gate structure includes a buried gate and a first dielectric layer. The buried gate is disposed in the substrate and covers at least a portion of the storage node. The first dielectric layer is disposed between the buried gate and the substrate. A first light shielding layer is formed on the buried gate. The first light shielding layer is located above the storage node and electrically connected to the buried gate.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 6, 2021
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Pin-Chieh Huang, Jui-Hung Hung, Yi-Chen Yeh, Cheng-Han Yang, Wen-Hao Huang
  • Patent number: 10937819
    Abstract: An image sensor including a substrate, a light sensing device, a storage node, a buried gate structure, and a first light shielding layer is provided. The light sensing device is disposed in the substrate. The storage node is disposed in the substrate. The storage node and the light sensing device are separated from each other. The buried gate structure includes a buried gate and a first dielectric layer. The buried gate is disposed in the substrate and covers at least a portion of the storage node. The first dielectric layer is disposed between the buried gate and the substrate. The first light shielding layer is disposed on the buried gate and is located above the storage node. The first light shielding layer is electrically connected to the buried gate.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 2, 2021
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Shih-Ping Lee, Pin-Chieh Huang, Jui-Hung Hung, Yi-Chen Yeh, Cheng-Han Yang, Wen-Hao Huang
  • Publication number: 20200075648
    Abstract: An image sensor including a substrate, a light sensing device, a storage node, a buried gate structure, and a first light shielding layer is provided. The light sensing device is disposed in the substrate. The storage node is disposed in the substrate. The storage node and the light sensing device are separated from each other. The buried gate structure includes a buried gate and a first dielectric layer. The buried gate is disposed in the substrate and covers at least a portion of the storage node. The first dielectric layer is disposed between the buried gate and the substrate. The first light shielding layer is disposed on the buried gate and is located above the storage node. The first light shielding layer is electrically connected to the buried gate.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 5, 2020
    Applicant: Powerchip Technology Corporation
    Inventors: Shih-Ping Lee, Pin-Chieh Huang, Jui-Hung Hung, Yi-Chen Yeh, Cheng-Han Yang, Wen-Hao Huang