Patents by Inventor Yi-Cheng Chen

Yi-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031255
    Abstract: A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: June 8, 2021
    Assignee: CYNTEC CO., LTD.
    Inventors: Bau-Ru Lu, Da-Jung Chen, Yi-Cheng Lin
  • Patent number: 11022264
    Abstract: A headlight optical system and a lamp using the same are provided. The headlight optical system is implemented with the refractive optical system of a single lens. The headlight optical system includes a first incident surface, a second incident surface, and an exit surface. The first incident surface is a horizontal plane. The second incident surface surrounds the first incident surface. The inner edge of the second incident surface is connected with the outer edge of the first incident surface. The second incident surface has an inclined angle with respect to the first incident surface. After the light emitted from the polycrystalline light source is incident on the first incident surface or the second incident surface, the refractive optical system refracts and emits the light from the exit surface.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: June 1, 2021
    Assignee: Automotive Research & Testing Center
    Inventors: Chun-Yao Shih, Yi-Cheng Chen
  • Publication number: 20210159155
    Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
  • Publication number: 20210159334
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Application
    Filed: January 6, 2021
    Publication date: May 27, 2021
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun Lin Tsai
  • Patent number: 11018182
    Abstract: A pixel structure includes a light emitting diode chip and a light blocking structure. The light emitting diode chip includes a P-type semiconductor layer, an active layer, an N-type semiconductor layer, a first electrode, and K second electrodes. The active layer is located on the P-type semiconductor layer. The N-type semiconductor layer is located on the active layer. The N-type semiconductor layer has a first top surface that is distant from the active layer. The first electrode is electrically connected to the P-type semiconductor layer. The light blocking structure is located in the light emitting diode chip and defines K sub-pixel regions. The active layer and the N-type semiconductor layer are divided into K sub-portions respectively corresponding to the K sub-pixel regions by the light blocking structure. The K sub-pixel regions share the P-type semiconductor layer.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 25, 2021
    Assignee: Lextar Electronics Corporation
    Inventors: Yi-Jyun Chen, Li-Cheng Yang, Yu-Chun Lee, Shiou-Yi Kuo, Chih-Hao Lin
  • Publication number: 20210150689
    Abstract: A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range.
    Type: Application
    Filed: April 30, 2020
    Publication date: May 20, 2021
    Inventors: YI-CHENG JUAN, HAN-HSING CHEN
  • Patent number: 11009916
    Abstract: A touch input device includes a frame unit, a circuit unit and a touch pad. The circuit unit includes a circuit board, a dome-shaped actuating member including an actuating portion and a resilient metal sheet connected between the actuating portion and the circuit board, and a noise reduction member having a main body connected to the resilient metal sheet, made of an elastic material and formed with a recess surrounding the actuating portion. A touch surface of the touch pad is touchable to push the circuit unit toward the block member, such that the actuating portion contacts the block member to deform the resilient metal sheet to electrically connect the actuating portion with the circuit board.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: May 18, 2021
    Assignee: SUNREXTECHNOLOGY CORP.
    Inventors: Chun-Chieh Chen, Yi-Wen Tsai, Ching-Yao Huang, Ling-Cheng Tseng
  • Publication number: 20210144017
    Abstract: A method for replacing an identity certificate in a blockchain network includes a service subnet, a consensus subnet, and a routing layer used for isolating the service subnet from the consensus subnet. The method includes: receiving a root certificate replacement notification transmitted by a certificate authentication center; obtaining a public key corresponding to the certificate authentication center; verifying the root certificate replacement notification by using the obtained public key; forwarding the root certificate replacement notification to a consensus node in the consensus subnet after the validation succeeds, so that the consensus node records the root certificate replacement notification into a latest data block after a consensus on the root certificate replacement notification is reached; and requesting, when the data block is received, the certificate authentication center to replace an identity certificate.
    Type: Application
    Filed: January 21, 2021
    Publication date: May 13, 2021
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Mao Cai LI, Geng Liang ZHU, Hu LAN, Zong You WANG, Li KONG, Kai Ban ZHOU, Chang Qing YANG, Qiu Ping CHEN, Qu Cheng LIU, Yi Fang SHI, Jin Song ZHANG, Pan LIU
  • Patent number: 11004997
    Abstract: An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: May 11, 2021
    Assignees: GODSMITH SENSOR INC., OPTO TECH CORPORATION
    Inventors: Jin-Shown Shie, Yi-Chun Liao, Chieh-Yi Chen, Chung-Cheng Lin, Cheng-Wei Yang, Chi-Tseng Chang
  • Publication number: 20210136704
    Abstract: An auxiliary Bluetooth circuit of a multi-member Bluetooth device for communicating data with a source Bluetooth device acting as a master in a first piconet. A main Bluetooth circuit of the multi-member Bluetooth device acts as a slave in the first piconet, acts as a master in a second piconet, and generates a first slave clock and a second main clock according to a first main clock generated by the source Bluetooth device, with which both the first slave clock and the second main clock are synchronized. The auxiliary Bluetooth circuit acts as a slave in the second piconet and generates a second slave clock and a third slave clock according to the second main clock, with which both the second slave clock and the third slave clock are synchronized. The auxiliary Bluetooth circuit sniffs Bluetooth packets transmitted through the first piconet from the source Bluetooth device.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 6, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Hung-Chuan CHANG, Chin-Wen WANG
  • Publication number: 20210136711
    Abstract: A multi-member Bluetooth device for communicating data with a source Bluetooth device acting as a master in a first piconet. The multi-member Bluetooth device includes a main Bluetooth circuit acting as a slave in the first piconet and as a master in a second piconet, and an auxiliary Bluetooth circuit acting as a slave in the second piconet. The main Bluetooth circuit generates a first slave clock and a second main clock according to a first main clock generated by the source Bluetooth device, with which both the first slave clock and the second main clock are synchronized. The auxiliary Bluetooth circuit generates a second slave clock and a third slave clock according to the second main clock, with which both the second slave clock and the third slave clock are synchronized. The auxiliary Bluetooth circuit sniffs Bluetooth packets transmitted through the first piconet from the source Bluetooth device.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 6, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Hung-Chuan CHANG, Chin-Wen WANG
  • Publication number: 20210136705
    Abstract: A main Bluetooth circuit and an auxiliary Bluetooth circuit of a multi-member Bluetooth device are disclosed. The multi-member Bluetooth device is utilized for communicating data with a source Bluetooth device, and the source Bluetooth device acts as a master in a first piconet. The main Bluetooth circuit acts as a slave in the first piconet, and acts as a master in a second piconet. The auxiliary Bluetooth circuit acts as a slave in the second piconet. The main Bluetooth circuit generates a first slave clock and a second main clock synchronized with a first main clock generated by the source Bluetooth device, and samples a first audio data to be playback. The auxiliary Bluetooth circuit generates a second slave clock and a third slave clock synchronized with the second main clock, and samples a second audio data to be playback.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 6, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Hung-Chuan CHANG, Yi-Cheng CHEN, Kuan-Chung HUANG, Chin-Wen WANG
  • Publication number: 20210136551
    Abstract: A multi-member Bluetooth device for communicating data with a source Bluetooth device, wherein the source Bluetooth device acts as a master in a first piconet. The multi-member Bluetooth device includes a main Bluetooth circuit and an auxiliary Bluetooth circuit. The main Bluetooth circuit acts as a slave in the first piconet, and acts as a master in a second piconet. The auxiliary Bluetooth circuit acts as a slave in the second piconet. The main Bluetooth circuit generates a first slave clock and a second main clock synchronized with a first main clock generated by the source Bluetooth device, and samples a first audio data to be playback. The auxiliary Bluetooth circuit generates a second slave clock and a third slave clock synchronized with the second main clock, and samples a second audio data to be playback.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 6, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Hung-Chuan CHANG, Yi-Cheng CHEN, Kuan-Chung HUANG, Chin-Wen WANG
  • Patent number: 10999728
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 4, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Patent number: 10999727
    Abstract: A main Bluetooth circuit and an auxiliary Bluetooth circuit of a multi-member Bluetooth device for communicating data with a remote Bluetooth device are disclosed. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 4, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Patent number: 10992356
    Abstract: A main Bluetooth circuit of a multi-member Bluetooth device includes: a Bluetooth communication circuit; a data transmission circuit; and a control circuit arranged to operably conduct bidirectional packet transmission with a remote Bluetooth device through the Bluetooth communication circuit by utilizing a Bluetooth wireless transmission approach, and arranged to operably communicate data with other devices through the data transmission circuit. During the period in which the Bluetooth communication circuit conducts packet transmission with the remote Bluetooth device, an auxiliary Bluetooth circuit of the multi-member Bluetooth device sniffs packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: April 27, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chin-Wen Wang, Pei-Yuan Hsieh, Hou Wei Lin
  • Patent number: 10992060
    Abstract: A small-scale antenna structure with high gain and with controllable polarization direction includes a motherboard, an antenna array thereon, and antenna units. An array of lens units is superimposed directly over and covers the antenna units. A wireless communication device using the antenna structure is also provided. The wireless communication device includes a main body and the antenna structure. The main body receives the antenna structure.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: April 27, 2021
    Assignee: Shenzhen Next Generation Communications Limited
    Inventors: Kuo-Cheng Chen, Yi-Ming Chen, Siang-Yu Siao, Yi-Kuo Chen, Hsi-Hsing Hsu
  • Publication number: 20210116413
    Abstract: A bioFET device includes a semiconductor substrate having a first surface and an opposite, parallel second surface and a plurality of bioFET sensors on the semiconductor substrate. Each of the bioFET sensors includes a gate formed on the first surface of the semiconductor substrate and a channel region formed within the semiconductor substrate beneath the gate and between source/drain (S/D) regions in the semiconductor substrate. The channel region includes a portion of the second surface of the semiconductor substrate. An isolation layer is disposed on the second surface of the semiconductor substrate. The isolation layer has an opening positioned over the channel region of more than one bioFET sensor of the plurality of bioFET sensors. An interface layer is disposed on the channel region of the more than one bioFET sensor in the opening.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Cheng HUANG, Yi-Hsien CHANG, Chin-Hua WEN, Chun-Ren CHENG, Shih-Fen HUANG, Tung-Tsun CHEN, Yu-Jie HUANG, Ching-Hui LIN, Sean CHENG, Hector CHANG
  • Publication number: 20210105602
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device, and the auxiliary Bluetooth circuit does not sniff packets transmitted from the remote Bluetooth device. But the auxiliary Bluetooth circuit switches from the relay mode to a sniffing mode if the data type of packets transmitted from the remote Bluetooth device changes. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device while the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 8, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Chia Chun HUNG, Hou Wei LIN
  • Publication number: 20210105692
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit; the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device, but will switch to a sniffing mode if a signal reception quality indicator of the auxiliary Bluetooth circuit is superior to a predetermined indicator value. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Application
    Filed: September 21, 2020
    Publication date: April 8, 2021
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng CHEN, Kuan-Chung HUANG, Chia Chun HUNG, Hou Wei LIN