Patents by Inventor Yi-Cheng Hsu
Yi-Cheng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240339467Abstract: Some embodiments relate to an IC device, including a first chip comprising a plurality of pixel blocks respectively including one of a first plurality of conductive pads, the plurality of pixel blocks arranged in rows extending in a first direction and columns extending in a second direction perpendicular to the first direction; a second chip bonded to the first chip at a bonding interface, where the second chip comprises a second plurality of conductive pad recessed and contacting the first plurality of conductive pads along the bonding interface; and a first corrugated shield line having outermost edges set-back along the second direction from outermost edges of a first row of the plurality of pixel blocks, the first corrugated shield line being arranged within a first dielectric layer and laterally separating neighboring ones of the first plurality of conductive pads within the first row of the plurality of pixel blocks.Type: ApplicationFiled: April 7, 2023Publication date: October 10, 2024Inventors: Chi-Hsien Chung, Tzu-Jui Wang, Chia-Chi Hsiao, Kuan-Chieh Huang, Wei-Cheng Hsu, Hao-Lin Yang, Yi-Han Liao, Chen-Jong Wang, Dun-Nian Yaung
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Patent number: 12104316Abstract: A manufacturing method for an antibacterial fiber includes the following steps. A dipping step is performed to soak a conductive fiber in a solution, in which the solution includes an ionic compound, and the ionic compound includes a metal cation. An oxidation step is performed by using the conductive fiber as an anode, such that an antibacterial material produced by the solution is adhered to a surface of the conductive fiber, in which the antibacterial material includes a metal oxide.Type: GrantFiled: June 29, 2022Date of Patent: October 1, 2024Assignee: FORMOSA PLASTICS CORPORATIONInventors: Chih-Hsiang Liang, Yu-Cheng Hsu, Tang-Chun Kao, Chien-Hsu Chou, Yi-Chuan Chang, Chih-Hsuan Ou, Han-Chang Wu, Long-Tyan Hwang
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Patent number: 12087579Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.Type: GrantFiled: May 4, 2021Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chung-Yang Huang, Hao-Ming Chang, Ming Che Li, Yu-Hsin Hsu, Po-Cheng Lai, Kuan-Shien Lee, Wei-Hsin Lin, Yi-Hsuan Lin, Wang Cheng Shih, Cheng-Ming Lin
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Publication number: 20240264405Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: ApplicationFiled: April 16, 2024Publication date: August 8, 2024Inventors: Chao-Chang HU, Liang-Ting HO, Chen-Er HSU, Yi-Liang CHAN, Fu-Lai TSENG, Fu-Yuan WU, Chen-Chi KUO, Ying-Jen WANG, Wei-Han HSIA, Yi-Hsin TSENG, Wen-Chang LIN, Chun-Chia LIAO, Shou-Jen LIU, Chao-Chun CHANG, Yi-Chieh LIN, Shang-Yu HSU, Yu-Huai LIAO, Shih-Wei HUNG, Sin-Hong LIN, Kun-Shih LIN, Yu-Cheng LIN, Wen-Yen HUANG, Wei-Jhe SHEN, Chih-Shiang WU, Sin-Jhong SONG, Che-Hsiang CHIU, Sheng-Chang LIN
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Patent number: 12048916Abstract: The present invention relates to carbon fiber composites and a method for producing the same. By reducing specific transition metal ions with a specific concentration, the method for producing the carbon fiber composites can form nanoparticles of a transition metal on an outer surface of a titanium dioxide layer encapsulating a carbon fiber to produce the carbon fiber composites. The nanoparticles of the transition metal directionally contact the titanium dioxide layer, so that the carbon fiber composites have synergistically photocatalytic activity.Type: GrantFiled: July 29, 2022Date of Patent: July 30, 2024Assignee: FORMOSA PLASTICS CORPORATIONInventors: Yu-Cheng Hsu, Tang-Chun Kao, Long-Tyan Hwang, Chih-Hsiang Liang, Chien-Hsu Chou, Yi-Chuan Chang, Chih-Hsuan Ou, Han-Chang Wu
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Publication number: 20240251530Abstract: The invention provides an immersion fluid module including a tank, a heat exchanger, a condenser, and at least one pipe. The tank contains a first fluid. An electronic device is disposed in the tank and is at least partially immersed in the first fluid in a liquid state. The heat exchanger is disposed in the tank and is at least partially immersed in the first fluid in the liquid state. The condenser is disposed in the tank. The pipe connects the heat exchanger and the condenser. A second fluid is provided to the pipe, and a temperature of the second fluid is higher than a preset value. When an ambient temperature of the electronic device is lower than the preset value, the second fluid flows through the heat exchanger to raise the ambient temperature of the electronic device. The invention also provides a server system.Type: ApplicationFiled: October 3, 2023Publication date: July 25, 2024Applicant: Wiwynn CorporationInventors: Zi Ping Wu, Jun Da Chen, Ting-Yu Pai, Yi Cheng, Chin-Hao Hsu
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Method and Apparatus for Quantitative Detection of Parameters in MRI, and Magnetic Resonance Scanner
Publication number: 20230349993Abstract: In a method for quantitative detection of parameters in MRI, first and second spoiled gradient echo images and at least one multi-echo steady-state first/second magnetization image are acquired; based on the extended phase graph theory, signal equations are obtained corresponding to the first and second spoiled gradient echo images, the at least one multi-echo steady-state first magnetization image and the at least one multi-echo steady-state second magnetization image; based on the signal equations of the first and second spoiled gradient echo images, the signal equation of the at least one multi-echo steady-state first magnetization image and the signal equation of the at least one multi-echo steady-state second magnetization image, a spoiled gradient echo proton density map, a multi-echo steady-state proton density map, a longitudinal relaxation time map and a transverse relaxation time map of the target tissue are obtained.Type: ApplicationFiled: March 29, 2023Publication date: November 2, 2023Applicant: Siemens Healthineers Digital Technology (Shanghai) Co., Ltd.Inventors: Yi-Cheng Hsu, Ying Hua Chu, Patrick Liebig -
Publication number: 20230314535Abstract: A method and device for radio-frequency field inhomogeneity correction in magnetic resonance imaging. The method includes: obtaining a first MR image by scanning a target tissue using a first pulse sequence; obtaining a B1+ field map of the target tissue; obtaining a B1?: field map of the target tissue based on the first MR image and the B1+ field map; and performing B1 field inhomogeneity correction on a second MR image of the target tissue based on the B1+ field map and the B1? field map, where the second MR image is an MR image obtained after scanning of the target tissue using any imaging protocol and any pulse sequence.Type: ApplicationFiled: March 29, 2023Publication date: October 5, 2023Applicant: Siemens Healthineers Digital Technology (Shanghai) Co., Ltd.Inventors: Yi-Cheng Hsu, Ying Hua Chu, Patrick Liebig
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Patent number: 11726159Abstract: The disclosure relates to techniques for perming chemical exchange saturation transfer (CEST) imaging correction. The present disclosure improves the speed of correcting CEST images.Type: GrantFiled: June 9, 2021Date of Patent: August 15, 2023Assignee: Siemens Healthcare GmbHInventors: Yi-Cheng Hsu, Patrick Liebig
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Patent number: 11450596Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: GrantFiled: November 22, 2019Date of Patent: September 20, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
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Publication number: 20210389404Abstract: The disclosure relates to techniques for perming chemical exchange saturation transfer (CEST) imaging correction. The present disclosure improves the speed of correcting CEST images.Type: ApplicationFiled: June 9, 2021Publication date: December 16, 2021Applicant: Siemens Healthcare GmbHInventors: Yi-Cheng Hsu, Patrick Liebig
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Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
Patent number: 11139225Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: GrantFiled: June 14, 2019Date of Patent: October 5, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu -
Publication number: 20210159155Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: ApplicationFiled: November 22, 2019Publication date: May 27, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
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Publication number: 20200395275Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
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Patent number: 10622900Abstract: Architecture and design techniques for a single inductor multiple-output (SIMO) DC-DC converter are presented. The SIMO DC-DC converter is based on ordered-power-distributive-control (OPDC) scheme with several novel control mechanism to optimize the performance of the power delivery capability, conversion efficiency and voltage ripple. In addition to buck mode outputs, the new SIMO DC-DC converter can also have an output channel operating at auto-buck-boost mode for the input voltage varying with the usage time.Type: GrantFiled: June 20, 2019Date of Patent: April 14, 2020Assignee: BravoTek Electronics Co., Ltd.Inventors: Wei-Hsin Wei, Yi-Cheng Hsu, Wei-Lun Hsieh
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Patent number: 10291126Abstract: A single inductor multiple-output DC-DC converter includes an inductor coupled to a first input switch and a second input switch to store energy from supply source, wherein the first input switch is coupled to an input supply node, and the second input switch is coupled to ground, the first and the second switches controlling current through the inductor; a plurality of output switches, each output switch coupled to a common inductor node and to a corresponding output supply node, each of the output supply node having a voltage converted from an input voltage received at an input supply node; a freewheel switch coupled between the common inductor node and ground; a control circuit receiving a sensed inductor current and a plurality of feedback signals indicating error signals between output voltages and their corresponding reference voltages, the control circuit being configured to control timing and charging current of the inductor.Type: GrantFiled: October 18, 2018Date of Patent: May 14, 2019Assignee: BravoTek Electronics Co., Ltd.Inventors: Wei-Hsin Wei, Yi-Cheng Hsu, Wei-Lun Hsieh
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Patent number: 9829556Abstract: The present invention provides a method and apparatus for generating a specific flip angle distribution in magnetic resonance imaging; the method uses a plurality of RF transmission coils combined with linear and nonlinear spatial encoding magnetic fields to generate a homogeneous flip angle distribution.Type: GrantFiled: July 1, 2014Date of Patent: November 28, 2017Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Yi-Cheng Hsu, I-Liang Chern, Fa-Hsuan Lin
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Publication number: 20170090000Abstract: A method for detecting dynamic magnetic field distributions is provided and includes: generating a dephasing gradient magnetic field and a rephasing gradient magnetic field, wherein the dephasing and rephasing gradient magnetic fields are generated after a radio frequency pulse has been generated, and the magnetic resonance signal of the signal source sample of a magnetic field detector is acquired after the dephasing gradient magnetic field has been generated, wherein the rephasing gradient magnetic field is generated after the magnetic resonance signal of the signal source sample of the magnetic field detector has been acquired but before a magnetic resonance signal of an imaging object is acquired. The magnetic resonance signal of the signal source sample of magnetic field detectors and the magnetic resonance signal of the imaging object are obtained without interferencing between each other. Magnetic resonance images of the imaging object are corrected according the dynamic magnetic field distribution.Type: ApplicationFiled: October 28, 2015Publication date: March 30, 2017Inventors: FA-HSUAN LIN, YING-HUA CHU, YI-CHENG HSU
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Publication number: 20150185301Abstract: The present invention provides a method and apparatus for generating a specific flip angle distribution in magnetic resonance imaging; the method uses a plurality of RF transmission coils combined with linear and nonlinear spatial encoding magnetic fields to generate a homogeneous flip angle distribution.Type: ApplicationFiled: July 1, 2014Publication date: July 2, 2015Inventors: Yi-Cheng HSU, I-Liang CHERN, Fa-Hsuan LIN
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Patent number: D1044812Type: GrantFiled: December 21, 2021Date of Patent: October 1, 2024Assignee: Sunrex Technology Corp.Inventors: Shih-Pin Lin, Chun-Chieh Chen, Yi-Wen Tsai, Ling-Cheng Tseng, Ching-Yao Huang, Yu-Shuo Yang, Yu-Xiang Geng, Cheng-Yu Chuang, Chi-Shu Hsu