Patents by Inventor Yi-Cheng Hsu

Yi-Cheng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230349993
    Abstract: In a method for quantitative detection of parameters in MRI, first and second spoiled gradient echo images and at least one multi-echo steady-state first/second magnetization image are acquired; based on the extended phase graph theory, signal equations are obtained corresponding to the first and second spoiled gradient echo images, the at least one multi-echo steady-state first magnetization image and the at least one multi-echo steady-state second magnetization image; based on the signal equations of the first and second spoiled gradient echo images, the signal equation of the at least one multi-echo steady-state first magnetization image and the signal equation of the at least one multi-echo steady-state second magnetization image, a spoiled gradient echo proton density map, a multi-echo steady-state proton density map, a longitudinal relaxation time map and a transverse relaxation time map of the target tissue are obtained.
    Type: Application
    Filed: March 29, 2023
    Publication date: November 2, 2023
    Applicant: Siemens Healthineers Digital Technology (Shanghai) Co., Ltd.
    Inventors: Yi-Cheng Hsu, Ying Hua Chu, Patrick Liebig
  • Publication number: 20230314535
    Abstract: A method and device for radio-frequency field inhomogeneity correction in magnetic resonance imaging. The method includes: obtaining a first MR image by scanning a target tissue using a first pulse sequence; obtaining a B1+ field map of the target tissue; obtaining a B1?: field map of the target tissue based on the first MR image and the B1+ field map; and performing B1 field inhomogeneity correction on a second MR image of the target tissue based on the B1+ field map and the B1? field map, where the second MR image is an MR image obtained after scanning of the target tissue using any imaging protocol and any pulse sequence.
    Type: Application
    Filed: March 29, 2023
    Publication date: October 5, 2023
    Applicant: Siemens Healthineers Digital Technology (Shanghai) Co., Ltd.
    Inventors: Yi-Cheng Hsu, Ying Hua Chu, Patrick Liebig
  • Patent number: 11726159
    Abstract: The disclosure relates to techniques for perming chemical exchange saturation transfer (CEST) imaging correction. The present disclosure improves the speed of correcting CEST images.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: August 15, 2023
    Assignee: Siemens Healthcare GmbH
    Inventors: Yi-Cheng Hsu, Patrick Liebig
  • Patent number: 11450596
    Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: September 20, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
  • Publication number: 20210389404
    Abstract: The disclosure relates to techniques for perming chemical exchange saturation transfer (CEST) imaging correction. The present disclosure improves the speed of correcting CEST images.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 16, 2021
    Applicant: Siemens Healthcare GmbH
    Inventors: Yi-Cheng Hsu, Patrick Liebig
  • Patent number: 11139225
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu
  • Publication number: 20210159155
    Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 27, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
  • Publication number: 20200395275
    Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 17, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
  • Patent number: 10622900
    Abstract: Architecture and design techniques for a single inductor multiple-output (SIMO) DC-DC converter are presented. The SIMO DC-DC converter is based on ordered-power-distributive-control (OPDC) scheme with several novel control mechanism to optimize the performance of the power delivery capability, conversion efficiency and voltage ripple. In addition to buck mode outputs, the new SIMO DC-DC converter can also have an output channel operating at auto-buck-boost mode for the input voltage varying with the usage time.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 14, 2020
    Assignee: BravoTek Electronics Co., Ltd.
    Inventors: Wei-Hsin Wei, Yi-Cheng Hsu, Wei-Lun Hsieh
  • Patent number: 10291126
    Abstract: A single inductor multiple-output DC-DC converter includes an inductor coupled to a first input switch and a second input switch to store energy from supply source, wherein the first input switch is coupled to an input supply node, and the second input switch is coupled to ground, the first and the second switches controlling current through the inductor; a plurality of output switches, each output switch coupled to a common inductor node and to a corresponding output supply node, each of the output supply node having a voltage converted from an input voltage received at an input supply node; a freewheel switch coupled between the common inductor node and ground; a control circuit receiving a sensed inductor current and a plurality of feedback signals indicating error signals between output voltages and their corresponding reference voltages, the control circuit being configured to control timing and charging current of the inductor.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: May 14, 2019
    Assignee: BravoTek Electronics Co., Ltd.
    Inventors: Wei-Hsin Wei, Yi-Cheng Hsu, Wei-Lun Hsieh
  • Patent number: 9829556
    Abstract: The present invention provides a method and apparatus for generating a specific flip angle distribution in magnetic resonance imaging; the method uses a plurality of RF transmission coils combined with linear and nonlinear spatial encoding magnetic fields to generate a homogeneous flip angle distribution.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: November 28, 2017
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Yi-Cheng Hsu, I-Liang Chern, Fa-Hsuan Lin
  • Publication number: 20170090000
    Abstract: A method for detecting dynamic magnetic field distributions is provided and includes: generating a dephasing gradient magnetic field and a rephasing gradient magnetic field, wherein the dephasing and rephasing gradient magnetic fields are generated after a radio frequency pulse has been generated, and the magnetic resonance signal of the signal source sample of a magnetic field detector is acquired after the dephasing gradient magnetic field has been generated, wherein the rephasing gradient magnetic field is generated after the magnetic resonance signal of the signal source sample of the magnetic field detector has been acquired but before a magnetic resonance signal of an imaging object is acquired. The magnetic resonance signal of the signal source sample of magnetic field detectors and the magnetic resonance signal of the imaging object are obtained without interferencing between each other. Magnetic resonance images of the imaging object are corrected according the dynamic magnetic field distribution.
    Type: Application
    Filed: October 28, 2015
    Publication date: March 30, 2017
    Inventors: FA-HSUAN LIN, YING-HUA CHU, YI-CHENG HSU
  • Publication number: 20150185301
    Abstract: The present invention provides a method and apparatus for generating a specific flip angle distribution in magnetic resonance imaging; the method uses a plurality of RF transmission coils combined with linear and nonlinear spatial encoding magnetic fields to generate a homogeneous flip angle distribution.
    Type: Application
    Filed: July 1, 2014
    Publication date: July 2, 2015
    Inventors: Yi-Cheng HSU, I-Liang CHERN, Fa-Hsuan LIN
  • Patent number: 8304865
    Abstract: A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: November 6, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yueh-Chen Hsu, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu
  • Publication number: 20110062567
    Abstract: A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.
    Type: Application
    Filed: August 19, 2010
    Publication date: March 17, 2011
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yueh-Chen Hsu, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu
  • Patent number: 7333158
    Abstract: A three-dimensional (3D) display system includes a liquid crystal display and a directional backlight module. The backlight module disposed behind the liquid crystal display includes a light-guide plate, a focusing layer, a left backlight source, a right backlight source, and a first V-shaped micro-grooved and a second V-shaped micro-grooved structures of the light-guide plate. The focusing layer is disposed between the light-guide plate and the liquid crystal display. The 3D display method is to instantly switch on and off the left and the right backlight sources to alternately emit the light from the left side and right side of light-guide plate. By means of the first and the second V-shaped micro-grooved structure, the light transmitted from the light-guide plate is focused by the focusing layer within a particular range of angles and passing through the liquid crystal layer for being alternately projected to form a 3D image.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: February 19, 2008
    Assignee: AU Optronics Corp.
    Inventors: Ko-Wei Chien, Han-Ping Shieh, Yu-Mioun Chu, Ching-Yu Tsai, Yung-Lun Lin, Chih-Jen Hu, Chih-Ming Chang, Yi-Cheng Hsu, Po-Lun Chen
  • Patent number: 7327929
    Abstract: A backlight module including a first light guide plate, a first light source, a second light guide plate, and a second light source. The first light guide plate includes a first side, a second side opposite to the first side, and a first surface with a micro-groove structure. The first light source is disposed on the first side of the first light guide plate. The second light guide plate is disposed on the first light guide plate, and includes a third side, a fourth side opposite to the third side, and a second surface with a micro-groove structure. The fourth side and the second side are located at the same side. The second light source is disposed on the fourth side of the second light guide plate.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: February 5, 2008
    Assignee: Au Optronics Corp.
    Inventors: Ko-Wei Chien, Yu-Mioun Chu, Han-Ping Shieh, Chih-Jen Hu, Ching-Sang Yang, Yi-Cheng Hsu, Chieh-Ting Chen, Chih-Ming Chang, Yung-Lun Lin, Meng-Chang Tsai, Ching-Huan Lin, Mu-Jen Su, Hsiu-Chi Tung
  • Patent number: 7292353
    Abstract: The present invention relates to a method and apparatus for measuring the position of a ferrule of a laser module. The apparatus comprises an XYZ stage, a base, a receiving portion and a laser displacement meter (LDM). The XYZ stage is used for moving in three-dimensional directions. The base has a first slot by which the base is detachably connected to the XYZ stage. The receiving portion is fixed to the base and has a second slot. The laser displacement meter is used for measuring the distance between the ferrule and the laser displacement meter. The laser displacement meter is detachably connected to the receiving portion in the second slot. Whereby, the quantitative measurement and correction to the effect of the postweld-shift (PWS) on the fiber alignment shifts in laser-welded laser module packaging is achieved. Therefore, the reliable laser modules with high yield and high performance used in low-cost lightwave transmission systems may be developed and fabricated.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: November 6, 2007
    Assignee: National Sun Yat-Sen University
    Inventors: Wood-Hi Cheng, Yi-Cheng Hsu
  • Publication number: 20070017275
    Abstract: The present invention relates to a method and apparatus for measuring the position of a ferrule of a laser module. The apparatus comprises an XYZ stage, a base, a receiving portion and a laser displacement meter (LDM). The XYZ stage is used for moving in three-dimensional directions. The base has a first slot by which the base is detachably connected to the XYZ stage. The receiving portion is fixed to the base and has a second slot. The laser displacement meter is used for measuring the distance between the ferrule and the laser displacement meter. The laser displacement meter is detachably connected to the receiving portion in the second slot. Whereby, the quantitative measurement and correction to the effect of the postweld-shift (PWS) on the fiber alignment shifts in laser-welded laser module packaging is achieved. Therefore, the reliable laser modules with high yield and high performance used in low-cost lightwave transmission systems may be developed and fabricated.
    Type: Application
    Filed: January 27, 2006
    Publication date: January 25, 2007
    Inventors: Wood-Hi Cheng, Yi-Cheng Hsu
  • Publication number: 20060164862
    Abstract: A backlight module including a first light guide plate, a first light source, a second light guide plate, and a second light source. The first light guide plate includes a first side, a second side opposite to the first side, and a first surface with a micro-groove structure. The first light source is disposed on the first side of the first light guide plate. The second light guide plate is disposed on the first light guide plate, and includes a third side, a fourth side opposite to the third side, and a second surface with a micro-groove structure. The fourth side and the second side are located at the same side. The second light source is disposed on the fourth side of the second light guide plate.
    Type: Application
    Filed: June 7, 2005
    Publication date: July 27, 2006
    Inventors: Ko-Wei Chien, Yu-Mioun Chu, Han-Ping Shieh, Chih-Jen Hu, Ching-Sang Yang, Yi-Cheng Hsu, Chieh-Ting Chen, Chih-Ming Chang, Yung-Lun Lin, Meng-Chang Tsai, Ching-Huan Lin, Mu-Jen Su, Hsiu-Chi Tung