Patents by Inventor YI-CHENG TSENG

YI-CHENG TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240133467
    Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 25, 2024
    Applicant: SUNREX TECHNOLOGY CORP.
    Inventors: Yu-Xiang GENG, Chun-Chieh CHEN, Ling-Cheng TSENG, Yi-Wen TSAI, Ching-Yao HUANG
  • Patent number: 8559170
    Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: October 15, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yao-Tsung Lee, Yi-Cheng Tseng, Chun-Hsien Tsai, Feng-Ming Chang
  • Publication number: 20130021742
    Abstract: A central processing unit (CPU) expansion card may be inserted into a first connector of a motherboard. The CPU expansion card includes a board, a CPU socket mounted on the board, a number of memory slots mounted on the board and electrically connected to the CPU socket, and a second connector electrically connected to the CPU socket and mounted on the bottom side of the board to be inserted into the first connector of the motherboard.
    Type: Application
    Filed: August 11, 2011
    Publication date: January 24, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YAO-TSUNG LEE, YI-CHENG TSENG, CHUN-HSIEN TSAI, FENG-MING CHANG
  • Publication number: 20110197005
    Abstract: A motherboard expansion device includes a motherboard having a expansion slot conforming a first standard, an expansion card conforming a second standard, a converter card positioned between the motherboard and the expansion card, and the converter card connects to the expansion slot and the expansion card, respectively; a converter chip is mounted on the converter card for converting signals between the expansion slot and the expansion card, and one or more motherboard components mounted on the motherboard. The expansion card is mounted vertically above the motherboard, and is supported by the converter card, and the converter card defines a cutout between the converter card and the motherboard to partially receive the motherboard component.
    Type: Application
    Filed: September 28, 2010
    Publication date: August 11, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: TSUNG-KUEL LIAO, YI-CHENG TSENG, HSUAN-FU LEE