Abstract: An electronic device is provided. The electronic device includes a first body, a second body, and a baffle structure. The first body includes a first edge. The second body includes a second edge. The first edge is pivotally connected to the second edge, and an air outlet is provided on the second edge. An air duct is formed between the first edge and the second edge. The baffle structure is disposed in the air duct and located at a position corresponding to the air outlet. The baffle structure selectively closes the air duct according to a temperature of the air outlet, to avoid a rising temperature inside the electronic device due to hot air backflow.

Abstract: The disclosure provides an identification method with multi-type input, which is suitable for multiple type input devices. The identification method includes: capturing a corresponding original data through the input devices, and converting the original data into a plurality of structure units correspondingly. Performing a text integration step, deconstructing a text reference element corresponding to the attributes of the structural units based on the structural units and associated elements thereof, and performing a weight evaluation and reconstruction to generate a candidate content according to the text reference element. Making a decision based on the candidate content, outputting the candidate text as a recommended content when the candidate content includes a unique candidate text, and transmitting it to a corresponding output device. An electronic device using the identification method is also provided.

Abstract: An electronic device is provided. The electronic device includes a first body, a second body, and a baffle structure. The first body includes a first edge. The second body includes a second edge. The first edge is pivotally connected to the second edge, and an air outlet is provided on the second edge. An air duct is formed between the first edge and the second edge. The baffle structure is disposed in the air duct and located at a position corresponding to the air outlet. The baffle structure selectively closes the air duct according to a temperature of the air outlet, to avoid a rising temperature inside the electronic device due to hot air backflow.

Abstract: The disclosure provides an identification method with multi-type input, which is suitable for multiple type input devices. The identification method includes: capturing a corresponding original data through the input devices, and converting the original data into a plurality of structure units correspondingly. Performing a text integration step, deconstructing a text reference element corresponding to the attributes of the structural units based on the structural units and associated elements thereof, and performing a weight evaluation and reconstruction to generate a candidate content according to the text reference element. Making a decision based on the candidate content, outputting the candidate text as a recommended content when the candidate content includes a unique candidate text, and transmitting it to a corresponding output device. An electronic device using the identification method is also provided.

Abstract: An image control method, applied to a mobile device including a camera service platform, wherein the mobile device complies an image transmission protocol and establishes an event queue and an extension unit according to the image transmission protocol, wherein the image control method comprises: receiving at least one control parameter of an image processing function of a camera service platform; generating a control item of the image processing function according to the controlling parameter; mapping the control item to a database and transmitting a notification including the control item to a computer device to transmit an image between the computer device and the mobile device.

Abstract: A fan blade structure applied to a centrifugal fan is provided. The fan blade structure includes a wheel hub and an annular vane. The wheel hub includes a plurality of connecting brackets, and the annular vane includes multiple crests and troughs which interlace to form a continuous curved surface. The continuous curved surface has an outer ring surface and an inner ring surface. The connecting brackets are connected to the inner ring surface and drive the annular vane to rotate.

Abstract: An image control method, applied to a mobile device including a camera service platform, wherein the mobile device complies an image transmission protocol and establishes an event queue and an extension unit according to the image transmission protocol, wherein the image control method comprises: receiving at least one control parameter of an image processing function of a camera service platform; generating a control item of the image processing function according to the controlling parameter; mapping the control item to a data base and transmitting a notification including the control item to a computer device to transmit an image between the computer device and the mobile device.

Abstract: A fan blade structure applied to a centrifugal fan is provided. The fan blade structure includes a wheel hub and an annular vane. The wheel hub includes a plurality of connecting brackets, and the annular vane includes multiple crests and troughs which interlace to form a continuous curved surface. The continuous curved surface has an outer ring surface and an inner ring surface. The connecting brackets are connected to the inner ring surface and drive the annular vane to rotate.

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Abstract: A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.