Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A method and an electronic device for enhancing efficiency of searching for a region of interest in a virtual environment are provided. The virtual environment includes a visible scene and an invisible scene. A picture-in-picture (PIP) is displayed in the visible scene as a directional guidance or distance hint related to the region of interest in the invisible scene, thereby saving time and enhancing efficiency of searching for the region of interest.

Abstract: A method and an electronic device for enhancing efficiency of searching for a region of interest in a virtual environment are provided. The virtual environment includes a visible scene and an invisible scene. A picture-in-picture (PIP) is displayed in the visible scene as a directional guidance or distance hint related to the region of interest in the invisible scene, thereby saving time and enhancing efficiency of searching for the region of interest.

Abstract: A system for displaying images including a display panel and a fabrication method of a display panel are provided. The display panel includes a first substrate and a second substrate opposite to the first substrate, wherein a total thickness of assembling the first and the second substrates is reduced by a thinning process, and by utilizing an acrylic-based or an epoxy acrylic-based polymer film to cover the outer surfaces of the first and the second substrates.

Abstract: A method for forming an interconnect structure. A substrate is provided with a low-k dielectric layer thereon. At least one conductive feature is then formed in the low-k dielectric layer. A cap layer is formed overlying the low-k dielectric layer, and the conductive feature and the low-k dielectric layer is then subjected to an energy source to reduce a dielectric constant thereof.

Abstract: A method of fabricating a semiconductor device. A semiconductor substrate with a patterned conductive layer on a top surface of the substrate is first provided. A dielectric layer is then formed to cover the substrate. Thereafter, an electron beam irradiation procedure is performed to anneal the patterned conductive layer and reduce resistance of the patterned conductive layer.

Abstract: A method for forming an interconnect structure. A substrate is provided with a low-k dielectric layer thereon. At least one conductive feature is then formed in the low-k dielectric layer. A cap layer is formed overlying the low-k dielectric layer, and the conductive feature and the low-k dielectric layer is then subjected to an energy source to reduce a dielectric constant thereof.

Abstract: A method of fabricating a semiconductor device. A semiconductor substrate with a patterned conductive layer on a top surface of the substrate is first provided. A dielectric layer is then formed to cover the substrate. Thereafter, an electron beam irradiation procedure is performed to anneal the patterned conductive layer and reduce resistance of the patterned conductive layer.