Abstract: A conductive composition, conductive layer and electronic device employing the same are provided. The conductive composition includes 3-7 parts by weight of a component (A) and 93-97 parts by weight of a component (B). The component (A) is an epoxy compound, wherein the epoxy compound is a compound having at least one glycidyloxycarbonyl group. The component (B) includes a first metal particle, wherein the first metal particle has a particle size distribution D90 that is less than or equal to 1 ?m. The total weight of the component (A) and component (B) is 100 parts by weight.

Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.

Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.

Abstract: The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.

Abstract: The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.

Abstract: The present invention provides an electrochemical biosensor. The biosensor includes a substrate; a metal layer disposed on the substrate, wherein a first end of the metal layer is formed with a reaction region by a working electrode and a reference electrode provided on the metal layer, the reaction region is applied with an enzyme so that an electrical response is generated when the enzyme and a test sample form a chemical reaction, and a second end of the metal layer is provided with an integrated information unit to provide both test sample information and coding information.