Patents by Inventor Yi-Chia CHOU

Yi-Chia CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10930496
    Abstract: A method for fabricating heteroepitaxial semiconductor material on a mica sheet is disclosed. Firstly, a mica substrate is provided. Then, at least one semiconductor film is deposited on the mica substrate to form a flexible substrate whose flexibility is applied to various applications, such as wearable devices, portable photoelectric equipment, or improving the speed and bandwidth of commercial and military systems, such that the flexible substrate has the competitiveness in the market.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 23, 2021
    Assignee: National Chiao Tung University
    Inventors: Yi-Chia Chou, Wan-Jung Lo, Ying-Hao Chu
  • Publication number: 20200370956
    Abstract: A color sensing module is provided, comprising a substrate, a light emitting component, a sensing component, a light shield and a lens component. The light emitting component is adapted to provide a first beam. The lens component has a diverging portion and a condensing portion, wherein the diverging portion is arranged correspondingly to the light emitting component, and the condensing portion is arranged correspondingly to the sensing component. The first beam is transmitted to the surface of an object through the diverging portion of the lens component and reflected to form a second beam with color information, the second beam is transmitted to the sensing component through the condensing portion of the lens component, and the light shield blocks the first beam that does not pass through the lens component from being transmitted to the sensing component.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 26, 2020
    Applicant: CAL-COMP BIG DATA, INC.
    Inventors: Yi-Chia Chou, Chih-Feng Cheng
  • Publication number: 20200234944
    Abstract: A method for fabricating heteroepitaxial semiconductor material on a mica sheet is disclosed. Firstly, a mica substrate is provided. Then, at least one semiconductor film is deposited on the mica substrate to form a flexible substrate whose flexibility is applied to various applications, such as wearable devices, portable photoelectric equipment, or improving the speed and bandwidth of commercial and military systems, such that the flexible substrate has the competitiveness in the market.
    Type: Application
    Filed: April 17, 2019
    Publication date: July 23, 2020
    Inventors: YI-CHIA CHOU, WAN-JUNG LO, YING-HAO CHU
  • Patent number: 10161054
    Abstract: The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: December 25, 2018
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chih Chen, Wei-Lan Chiu, Yi-Chia Chou
  • Publication number: 20170321339
    Abstract: The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a crystallographic axis orientation.
    Type: Application
    Filed: July 24, 2017
    Publication date: November 9, 2017
    Inventors: Chih CHEN, Wei-Lan CHIU, Yi-Chia CHOU
  • Patent number: 9758886
    Abstract: The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: September 12, 2017
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chih Chen, Wei-Lan Chiu, Yi-Chia Chou
  • Publication number: 20160046099
    Abstract: The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.
    Type: Application
    Filed: March 9, 2015
    Publication date: February 18, 2016
    Inventors: Chih CHEN, Wei-Lan CHIU, Yi-Chia CHOU