Abstract: The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature below 500° C. One embodiment of the present invention provides an apparatus for processing semiconductor substrates. The apparatus comprises a target component comprises a material with higher emissivity than the one or more substrates.

Abstract: The present invention provides a non-destructive method for monitoring and calibrating chamber temperature. One embodiment of the present invention provides a method for measuring temperature comprising forming a target film on a test substrate at a first temperature, wherein the target film has one or more properties responsive to thermal exposure, exposing the target film to an environment at a second temperature in a range higher than the first temperature, measuring the one or more properties of the target film after exposing the target film to the environment at the second temperature, and determining the second temperature according to the measured one or more properties.

Abstract: The present invention generally provides an apparatus and method for the processing a plurality of substrates in a batch processing chamber. One embodiment of the present invention provides a method for processing a plurality of substrates comprising positioning the plurality of substrates in an inner volume of a batch processing chamber, wherein the plurality of substrates are arranged in a substantially parallel manner, and at least a portion of the plurality of substrates are positioned with a device side facing downward, and flowing one or more processing gases cross the plurality of substrates.

Abstract: The present invention generally comprises a silicon dioxide atomic layer deposition method. By providing pyridine as a catalyst, water may be utilized as the oxidization source while depositing at a low temperature. Prior to exposing the substrate to the water, the substrate may be exposed to a pyridine soak process. Additionally, the water may be co-flowed to the chamber with the pyridine through separate conduits to reduce interaction prior to entering the chamber. Alternatively, the pyridine may be co-flowed with a silicon precursor that does not react with pyridine.

Abstract: A method for synchronizing the rotation of a substrate boat with material deposition is disclosed. Whenever support rods of the substrate boat rotate past a deposition source, they will block deposition gas from reaching certain portions of the substrate. By stopping the deposition gas whenever the support rods are located between the substrate and the deposition source, a uniform deposition can be achieved.

Abstract: An apparatus for batch processing of a wafer is disclosed. In one embodiment the batch processing apparatus includes a bell jar furnace having a diffuser disposed between gas inlets and the substrate positioned within the furnace to direct flows within the chamber around the perimeter of the substrate.

Abstract: A method and apparatus for compensating for tensile stress on a layer deposited on a substrate. The method includes disposing the substrate between a bladder and a contact ring, and applying pressure against a back side of the substrate toward the contact ring to bend a center region of the substrate until the substrate assumes a convex shape relative to an upward flow of a plating solution.

Abstract: Embodiments of the invention provide a method and apparatus for processing a substrate. The apparatus includes a substrate rinse cell configured to dispense a heated processing fluid onto the substrate prior to an annealing process. The method includes plating a conductive layer onto a substrate, heating the substrate in a cleaning cell via application of a heated cleaning fluid to the substrate, drying the substrate in the cleaning cell, and annealing the substrate at an annealing station at a temperature of between about 150° C. and about 450° C.

Abstract: Method and apparatus for etching an optically transparent layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for etching a substrate comprising placing the reticle on a support member in a processing chamber, positioning the reticle on a support member in a processing chamber, wherein the reticle comprises a patterned metal photomask layer formed on an optically transparent material, and a patterned resist material deposited on the patterned metal photomask layer, introducing a processing gas comprising one or more fluorine containing hydrocarbons and one or more chlorine-containing gases into the processing chamber, delivering power to the processing chamber to generate a plasma by applying a source RF power to a coil and applying a bias power to the support member, and etching exposed portions of the optically transparent material.