Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A bracket is provided. The bracket includes a fixing seat and a holding seat. The fixing seat has a first extending direction and includes at least one first contacting end surface, and a first angle is contained between the at least one first contacting end surface and the first extending direction. The holding seat is detachably connected to the fixing seat with a bend angle to form a bend structure, and the holding seat includes at least one second contacting end surface corresponding to the at least one first contacting end surface. The at least one first contacting end surface and the at least one second contacting end surface are located near or at a bend portion of the bend structure.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body having a topmost surface; a first light-emitting device disposed on the carrier body and having a light-emitting surface; and a light-receiving device comprising a group III-V semiconductor material disposed on the carrier body and having a light-receiving surface. The light-emitting surface is separated from the topmost surface by first distant H1, the light-receiving surface is separated from the topmost surface by a second distance H2, and H1 is different from H2.

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting to an optical element, wherein the optical element has a main axis. The movable portion is movably connected to the fixed portion. The driving assembly is disposed on the movable portion or the fixed portion for driving the movable portion moving relative to the fixed portion.

Abstract: A vertical interconnection structure of a multi-layer substrate includes a first via pad disposed in a first layer of metal interconnect of the multi-layer substrate; a second via pad disposed in a second layer of metal interconnect of the multi-layer substrate; a signal via electrically connecting the first via pad to the second via pad; a non-circular first ground plane disposed in the first layer of metal interconnect of the multi-layer substrate and surrounding the first via pad; and a non-circular first ground pullback region between the first via pad and the non-circular first ground plane for electrically isolating the first via pad from the non-circular first ground plane.

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

Abstract: A bracket is provided. The bracket includes a fixing seat and a holding seat. The fixing seat has a first extending direction and includes at least one first contacting end surface, and a first angle is contained between the at least one first contacting end surface and the first extending direction. The holding seat is detachably connected to the fixing seat with a bend angle to form a bend structure, and the holding seat includes at least one second contacting end surface corresponding to the at least one first contacting end surface. The at least one first contacting end surface and the at least one second contacting end surface are located near or at a bend portion of the bend structure.

Abstract: A waterproof device including a casing structure, a cover structure, a first engaging plate, a second engaging plate, a first elastic member, and a second elastic member is provided. The casing structure, on which the cover structure is disposed, includes a bottom plate, a first side plate, a second side plate, a third side plate, and a fourth side plate. The first engaging plate is disposed adjacent to the first side plate, and the first elastic member is connected therebetween. The second engaging plate is disposed adjacent to the second side plate, and the second elastic member is connected therebetween. The first engaging plate can reciprocate between a first positioning position and a first disengagement position relative to the first side plate, and the second engaging plate can reciprocate between a second positioning position and a second disengagement position relative to the second side plate.

Abstract: A filter circuit includes an input node, an output node, a first filtering element and a second filtering element. The first filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a first signal conducting path toward the second terminal for conducting a first signal received at the input node to the second terminal. The second filtering element has a first terminal coupled to the input node and a second terminal, and is configured to provide a second signal conducting path toward the output node for conducting a second signal received at the input node to the output node. The second terminal of the first filtering element and the second terminal of the second filtering element are open-circuit terminals.

Abstract: The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.

Abstract: An orientation-adjustment mechanism is provided, which is adapted to be affixed to a mounting surface. The orientation-adjustment mechanism includes a base, a rod, a joint unit, and a mounted member. The base is adapted to be affixed to the mounting surface. The rod includes a first section and a second section. The first section of the rod pivots on the base. The joint unit is disposed on the second section of the rod. The joint unit includes a plurality of joint-positioning portions. The joint-positioning portions include a first joint-positioning portion and a second joint-positioning portion. The mounted member is connected to the joint unit and is adapted to be rotated relative to the joint unit. The mounted member includes a member housing. The member housing includes at least one member-positioning portion.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The movable portion is movably connected to fixed portion, wherein the movable portion is used for connecting to an optical element having a main axis. The driving assembly is disposed on the fixed portion or the movable portion to move the movable portion relative to the fixed portion.

Abstract: A driving mechanism for moving an optical element is provided, including a first fixed part, a second fixed part, a movable part, and a driving unit. The movable part is movably connected to the first and second fixed parts for holding the optical element, wherein the optical element has an optical axis. The driving unit drives the movable part to move along the optical axis relative to the first and second fixed parts.

Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is disposed on the second side.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.