Abstract: The present disclosure provides a semiconductor device including a first epitaxial stack and a first contact electrode. The first epitaxial stack includes a first semiconductor, a second semiconductor, and a first active region disposed between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a first capping layer having a first thickness. The second semiconductor structure includes a second capping layer having a second thickness larger than the first thickness. The first active region includes a light-emitting stack, a first confinement structure located between the light-emitting stack and the first capping layer, and a second confinement structure located between the light-emitting stack and the second capping layer. The first confinement structure has a third thickness, and the second confinement has a fourth thickness less than the third thickness.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A heat sink unit includes a first plate portion and a second plate portion. The first plate portion is integrally formed and includes an outer surface, an inner surface and at least one protrusion. The second plate portion is connected to the first plate portion. A first angle between the first plate portion and the second plate portion is between 5 degrees and 175 degrees. The outer surface of the first plate portion is farther from the second plate portion than the inner surface therefrom, and the protrusion is located on the outer surface.

Abstract: The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.

Abstract: The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the second pad. The at least one ESD component is positioned outside the die.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate. The substrate includes a core, a conductive material, a high-k dielectric material, and a redistribution layer. The core has a first hole, a second hole, and a third hole passing through it. The conductive material disposed in the first hole acts as a first electrode of a capacitor, the conductive material disposed in the second hole acts as a second electrode of the capacitor. The high-k dielectric material is disposed in the third hole and acts as a dielectric material of the capacitor. The dielectric constant of the high-k dielectric material is higher that the dielectric constant of the core. The redistribution layer is disposed on the core and connected to at least one of the conductive material in the first hole and the conductive material in the second hole.

Abstract: A semiconductor device includes a base and a semiconductor stack located on the base. The semiconductor stack includes a first semiconductor structure adjacent to the base, a second semiconductor structure located on the first semiconductor structure, and a first active region located between the first semiconductor structure and the second semiconductor structure to emits a light with peak wavelength between 900 nm to 1000 nm. The first active region is undoped or unintentionally doped, and includes a first zone and a second zone located between the first zone and the first semiconductor structure. Each of the first zone and the second zone includes a pair of a first barrier layer and a first well layer, and the first well layer of the second zone has a thickness larger than that of the first well layer of the first zone.

Abstract: A semiconductor device is provided, which includes a base, a semiconductor stack located on the base, and a first semiconductor layer located on the semiconductor stack. The semiconductor stack includes a first semiconductor structure adjacent to the base, a second semiconductor structure located on the first semiconductor structure, and a first active region located between the first semiconductor structure and the second semiconductor structure. The first semiconductor layer is located on the second semiconductor structure, and includes Alx1Ga1?x1As, where 0.005?x1<0.2. And the first semiconductor structure has a second thickness in a range of 3 ?m to 8 ?m. The semiconductor device outputs a first power corresponding to a light with a wavelength equal to or larger than 900 nm and less than 1100 nm, and a second power corresponding to a light with a wavelength less than 900 nm and larger than 700 nm. A ratio of the second power to a sum of the first power and the second power is equal to or less than 30%.

Abstract: Embodiments provide a mouse device that includes with a plurality of touch areas on one or more mouse buttons. The mouse device includes a touch panel, a press switch, a button cover and a control panel. The touch panel triggers a corresponding touch signal when any one of the plurality of touch areas respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to receive a pressing operation of pressing, toward inside, the touch panel, and press the press switch via the touch panel. When receiving the touch signal and the switch signal, the control panel triggers the input event of the pressed touch area.

Abstract: A mouse device includes a multi-touch region on a button. The mouse device includes a touchpad, a press switch, a button cover and a control board. The touchpad triggers a corresponding touch signal when any one of a plurality of touch regions respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to accept a pressing operation of pressing toward an inner side to press the touchpad, and to press the press switch through the touchpad. When receiving the touch signal and the switch signal, the control board triggers the input event of the pressed touch region.

Abstract: A semiconductor device is provided, which includes an epitaxial structure. The epitaxial structure includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure has a first conductivity type and includes a first intermediate layer and a first cladding layer. The second semiconductor structure has a second conductivity type. The active region is located between the first semiconductor structure and the second semiconductor structure. The first intermediate layer is located between the active region and the first cladding layer. The first intermediate layer includes P or As. The first intermediate layer and the first cladding layer include a first dopant. A maximum concentration of the first dopant in the first intermediate layer is greater than a maximum concentration of the first dopant in the first cladding layer.

Abstract: A semiconductor package and a method for forming the same are provided. The semiconductor package includes a substrate. The substrate includes a core and a redistribution layer structure and an inductor. The redistribution layer structure is disposed on the core. The inductor is embedded in redistribution layer structure. The inductor includes a first conductive layer, a conductive post and a second conductive layer. The first conductive layer is disposed on the core. The conductive post is disposed on the first conductive layer. The second conductive layer is disposed on the conductive post. The conductive post and a via of the redistribution layer structure are located at the same level. In a plan view, a first area of the conductive post is greater than a second area of the via.

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

Abstract: A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.

Abstract: A mouse device includes a multi-touch region on a button. The mouse device includes a touchpad, a press switch, a button cover and a control board. The touchpad triggers a corresponding touch signal when any one of a plurality of touch regions respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to accept a pressing operation of pressing toward an inner side to press the touchpad, and to press the press switch through the touchpad. When receiving the touch signal and the switch signal, the control board triggers the input event of the pressed touch region.

Abstract: Embodiments provide a mouse device that includes with a plurality of touch areas on one or more mouse buttons. The mouse device includes a touch panel, a press switch, a button cover and a control panel. The touch panel triggers a corresponding touch signal when any one of the plurality of touch areas respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to receive a pressing operation of pressing, toward inside, the touch panel, and press the press switch via the touch panel. When receiving the touch signal and the switch signal, the control panel triggers the input event of the pressed touch area.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, a circuit assembly, and a connecting element. The movable part is for connecting an optical element. The fixed part includes an outer frame and a base, wherein the movable part is movable relative to the fixed part. The driving assembly is for generating a driving force to drive the movable part to move relative to the fixed part. The circuit assembly is for connecting to an external circuit. The circuit assembly includes a first terminal. The outer frame is fixedly connected to the base via the connecting element.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, a first driving assembly, and a circuit assembly. The movable portion is used for connecting to an optical element. The movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The circuit assembly is used for connecting to an external circuit, and is affixed on the fixed portion.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is for connecting the optical element. The movable part is movable relative to the fixed part. The driving assembly is used for generating a driving force to drive the movable part to move relative to the fixed part. The driving assembly further includes a first reinforcement element, for strengthening the driving force.

Abstract: An optical driving mechanism is provided, including a movable portion, a fixed portion, a driving component and a first stopper component. The movable portion is configured to connect an optical element. The movable portion is movable relative to the fixed portion. The driving component is configured to drive the movable portion to move relative to the fixed portion. The first stopper component is configured to limit the range of movement of the movable portion relative to the fixed portion.