Patents by Inventor Yi-Chieh LO

Yi-Chieh LO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260088599
    Abstract: A bus bar connection assembly includes a bus bar body, a first conductive terminal set, a second conductive terminal set and a third conductive terminal set. The bus bar body includes a first configuration area, a second configuration area and a connecting portion connected to the first configuration area and the second configuration area. The first conductive terminal set is arranged on the first configuration area and electrically connected to the bus bar body. The second conductive terminal set is arranged on the second configuration area, electrically connected to the bus bar body, and provided with a first protruding length. The third conductive terminal set is arranged on the second configuration area, electrically connected to the bus bar body, and has a second protruding length different from the first protruding length.
    Type: Application
    Filed: August 12, 2025
    Publication date: March 26, 2026
    Inventor: Yi-Chieh LO
  • Publication number: 20250354543
    Abstract: Embodiments of the present disclosure provide a method for semiconductor processing, including: loading, into a process chamber, a semiconductor substrate; operating a cryogenic pump coupled to the process chamber to cause a pressure in the process chamber to satisfy a first threshold pressure, the cryogenic pump including: a body having a flange, coupled to the process chamber, and an opening defined at a first end of the body, wherein a longitudinal axis of the body is defined from the first end of the body to a second end of the body, and wherein the body has a non-cylindrical shape with sides sloping radially outward, in relation to the longitudinal axis, in a direction away from the first end and towards the second end; and processing the semiconductor substrate enclosed in the process chamber.
    Type: Application
    Filed: July 31, 2025
    Publication date: November 20, 2025
    Inventors: Yu Min CHI, Yi-Chieh LO, Kuo-Lung HOU, Wei-Jen CHEN, Su-Yu YEH
  • Publication number: 20240337265
    Abstract: Embodiments of the present disclosure provide a cryogenic pump for semiconductor processing, including a body having a flange, configured to be coupled to a process chamber, and an opening defined at a first end of the body; one or more capture plate modules disposed in the body; and a cold header thermally coupled to the one or more capture plate modules. A longitudinal axis of the body is defined from the first end of the body to a second end of the body. A first lateral dimension of the opening is less than a second lateral dimension of the body, the first and second lateral dimensions being defined perpendicular to the longitudinal axis. The second lateral dimension is defined at a position between the opening and the second end.
    Type: Application
    Filed: April 6, 2023
    Publication date: October 10, 2024
    Inventors: Yu Min CHI, Yi-Chieh LO, Kuo-Lung HOU, Wei-Jen CHEN, Su-Yu YEH