Patents by Inventor Yi-Chieh TSAI
Yi-Chieh TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133467Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.Type: ApplicationFiled: January 4, 2023Publication date: April 25, 2024Applicant: SUNREX TECHNOLOGY CORP.Inventors: Yu-Xiang GENG, Chun-Chieh CHEN, Ling-Cheng TSENG, Yi-Wen TSAI, Ching-Yao HUANG
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Patent number: 11956541Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.Type: GrantFiled: January 26, 2023Date of Patent: April 9, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chen-Hsien Fan, Sung-Mao Tsai, Yueh-Lin Lee, Yu-Chiao Lo, Mao-Kuo Hsu, Ching-Chieh Huan, Yi-Chun Cheng
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Publication number: 20240096701Abstract: A device includes: a stack of semiconductor nanostructures; a gate structure wrapping around the semiconductor nanostructures, the gate structure extending in a first direction; a source/drain region abutting the gate structure and the stack in a second direction transverse the first direction; a contact structure on the source/drain region; a backside conductive trace under the stack, the backside conductive trace extending in the second direction; a first through via that extends vertically from the contact structure to a top surface of the backside dielectric layer; and a gate isolation structure that abuts the first through via in the second direction.Type: ApplicationFiled: May 17, 2023Publication date: March 21, 2024Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Ching-Wei TSAI, Shang-Wen CHANG, Yi-Hsun CHIU, Chih-Hao WANG
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Publication number: 20240030184Abstract: An embodiment of the present application provides a semiconductor device, including a substrate, a chip, a latch-up protection circuit, and a redistribution layer. The chip is on the substrate. The latch-up protection circuit is separated from the chip in a direction. The redistribution layer transmits a signal between the latch-up protection circuit and the chip.Type: ApplicationFiled: December 7, 2022Publication date: January 25, 2024Inventors: Kuan-Neng CHEN, Yi-Chieh TSAI, Demin LIU, Han-Wen HU
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Publication number: 20230402744Abstract: An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure is disposed over the first surface of the glass substrate. The plurality of semiconductor chips are mounted over the interconnect structure. The antenna array structure is formed on the second surface of the glass substrate. Furthermore, the plurality of semiconductor chips are coupled to the antenna array structure through the interconnect structure and the glass substrate.Type: ApplicationFiled: December 14, 2022Publication date: December 14, 2023Inventors: KUAN-NENG CHEN, HAN-WEN HU, YI-CHIEH TSAI, YU-JIU WANG, LI HAN CHANG
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Patent number: 11621241Abstract: A bonding element and a method for manufacturing the same thereof are provide, wherein the method comprises the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; forming a first insulating layer on the first metal layer, wherein the first insulating layer includes a first through hole; forming a first passivation layer and a first conductive layer in the first through hole, wherein the first passivation layer and the first conductive layer in the first through hole form a first connecting bump; forming a first substrate on the first connection bump and the first insulating layer; removing the carrier substrate and the first metal layer to form a first sub-bonding element; and connecting the first sub-bonding element and a second sub-bonding element with a surface of the first passivation of the first connection bump to form the bonding element.Type: GrantFiled: September 17, 2021Date of Patent: April 4, 2023Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Han-Wen Hu, Demin Liu, Yi-Chieh Tsai, Kuan-Neng Chen
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Publication number: 20230025936Abstract: A bonding element and a method for manufacturing the same thereof are provide, wherein the method comprises the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; forming a first insulating layer on the first metal layer, wherein the first insulating layer includes a first through hole; forming a first passivation layer and a first conductive layer in the first through hole, wherein the first passivation layer and the first conductive layer in the first through hole form a first connecting bump; forming a first substrate on the first connection bump and the first insulating layer; removing the carrier substrate and the first metal layer to form a first sub-bonding element; and connecting the first sub-bonding element and a second sub-bonding element with a surface of the first passivation of the first connection bump to form the bonding element.Type: ApplicationFiled: September 17, 2021Publication date: January 26, 2023Inventors: Han-Wen HU, Demin LIU, Yi-Chieh TSAI, Kuan-Neng CHEN
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Patent number: 11239141Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.Type: GrantFiled: September 24, 2020Date of Patent: February 1, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ren-Shin Cheng, Shih-Hsien Wu, Yu-Wei Huang, Chih Ming Shen, Yi-Chieh Tsai
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Publication number: 20220005754Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.Type: ApplicationFiled: September 24, 2020Publication date: January 6, 2022Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ren-Shin CHENG, Shih-Hsien WU, Yu-Wei HUANG, Chih Ming SHEN, Yi-Chieh TSAI
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Publication number: 20170312754Abstract: A crushing apparatus includes a tank including a first aperture and a second aperture, a first blower around the first aperture, a grinder disposed within the tank, a separating device including a first hole connected to the second aperture, and a second hole, and a second blower disposed around the second hole.Type: ApplicationFiled: April 29, 2016Publication date: November 2, 2017Inventors: Bao-Hung HUANG, Lin-Shyang TZENG, Chung-Jen CHEN, Yi-Chieh TSAI, Jyh HSIEH, Chun Che HSIEH