Patents by Inventor Yi Chien LIU

Yi Chien LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HYBRID CONDUCTIVE STRUCTURES
    Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Fixing assembly
    Patent number: 10524373
    Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: December 31, 2019
    Assignee: WISTRON CORP.
    Inventors: Yi Chien Liu, Po-Kai Wang, Yu-Hsin Yu, Jung-Shu Hsiao, Ching-Hua Wang
  • FIXING ASSEMBLY
    Publication number: 20190307012
    Abstract: The disclosure provides a fixing assembly adapted to fix an expansion card on an expansion slot of a motherboard. The fixing assembly includes a casing, a first positioning component and a second positioning component. The first positioning component is slidably disposed on the casing so that a distance between the first positioning component and the expansion slot of the motherboard is adjustable. The second positioning component is slidably disposed on the first positioning component. The second positioning component and the first positioning component are configured to press against the expansion card, and sliding directions of the first positioning component and the second positioning component are different from each other.
    Type: Application
    Filed: September 5, 2018
    Publication date: October 3, 2019
    Applicant: WISTRON CORP.
    Inventors: Yi Chien LIU, Po-Kai WANG, Yu-Hsin YU, Jung-Shu HSIAO, Ching-Hua WANG