Patents by Inventor Yi-Chih Wu

Yi-Chih Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11871510
    Abstract: A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: January 9, 2024
    Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu, Feng-Hua Deng, Ming-Fang Chen
  • Patent number: 11596067
    Abstract: An apparatus having stacked circuit boards has been disclosed. The apparatus includes a main circuit board and a sub circuit board disposed over the main circuit board. A plurality of sub components disposed on a bottom face of the sub circuit board penetrates through main circuit board and extends towards a bottom face of the main circuit board. In this say, a compact apparatus is produced.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: February 28, 2023
    Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu
  • Publication number: 20220369474
    Abstract: A circuit board structure includes a rigid circuit board, a flexible circuit board, a plurality of conductive bumps, and a plurality of spacers. The rigid and flexible circuit boards are stacked one above the other. The conductive bumps are formed between the rigid and flexible circuit boards. The spacers are formed between the rigid and flexible circuit boards and spaced apart from the conductive bumps.
    Type: Application
    Filed: May 31, 2021
    Publication date: November 17, 2022
    Inventors: HOU-YUAN CHOU, XIAO-CHU JIN, SHI ZHANG, BO WU, ZHI-HONG XU, MEI-WEN KAO, YI-CHIH WU
  • Publication number: 20220232701
    Abstract: An apparatus having stacked circuit boards has been disclosed. The apparatus includes a main circuit board and a sub circuit board disposed over the main circuit board. A plurality of sub components disposed on a bottom face of the sub circuit board penetrates through main circuit board and extends towards a bottom face of the main circuit board. In this say, a compact apparatus is produced.
    Type: Application
    Filed: April 23, 2020
    Publication date: July 21, 2022
    Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: HOU-YUAN CHOU, YI-CHIH WU
  • Publication number: 20200323080
    Abstract: A circuit board optimized for a denser component population within a standard size of footprint includes a mother board and a plurality of sub-board layers stacked on and connected to the mother board. Each of the sub-board layers has a plurality of daughter boards. The sub-board layers are composed of a first sub-board layer and a second sub-board layer. The daughter boards of the first sub-board layer are arranged on a side of the mother board, and the daughter boards of the second sub-board layer are arranged on the daughter boards of the first sub-board layer.
    Type: Application
    Filed: May 7, 2019
    Publication date: October 8, 2020
    Inventors: HOU-YUAN CHOU, YI-CHIH WU
  • Patent number: 10785873
    Abstract: A circuit board optimized for a denser component population within a standard size of footprint includes a mother board and a plurality of sub-board layers stacked on and connected to the mother board. Each of the sub-board layers has a plurality of daughter boards. The sub-board layers are composed of a first sub-board layer and a second sub-board layer. The daughter boards of the first sub-board layer are arranged on a side of the mother board, and the daughter boards of the second sub-board layer are arranged on the daughter boards of the first sub-board layer.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: September 22, 2020
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., I, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu
  • Patent number: 10470308
    Abstract: A circuit board assembly comprising a printed circuit main board and a printed circuit sub-board, to avoid layout constraints, can support components on either board. The printed circuit main board includes first signal layer, and first and second through holes in the first signal layer. A first wire electrically couples a first electronic component and the first through hole. A second signal layer with third and fourth through holes is found on the printed circuit sub-board. The third through hole is electrically coupled to the first through hole, and the fourth through hole is electrically coupled to the second through hole.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: November 5, 2019
    Assignees: HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hou-Yuan Chou, Ming-Fang Chen, Yi-Chih Wu
  • Patent number: 10390430
    Abstract: A circuit board includes a board defining a holding slot and a connector. The connector includes a conductive column and a pad fixed to one end of the conductive column. The pad is received within the holding slot. The conductive column is fixed within the board. The pad is soldered to a connecting portion of an electrical component. The pad defines a first through hole receiving solder when the connecting portion of the electrical component is soldered to the pad.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: August 20, 2019
    Assignees: HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu