Patents by Inventor Yi-Chih Yang

Yi-Chih Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9147954
    Abstract: A connector connecting a main circuit board and a sub circuit board has two bases, two electrical contacting sets, two resilient bar sets and two mounting brackets. The bases are mounted on the main circuit board. The electrical contacting sets are mounted respectively in the bases and each electrical contacting set has multiple electrical contacting elements. The resilient bar sets are mounted respectively on the bases. The mounting brackets are mounted respectively on the bases and cover the electrical contacting sets and the resilient bar sets. Circuit-board-receiving channels are defined between the bases and the mounting brackets for receiving the sub circuit board such that combination of the main circuit board and the sub circuit board are parallel and flat.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: September 29, 2015
    Assignee: Teecons Technology Ltd.
    Inventor: Yi-Chih Yang
  • Publication number: 20150011102
    Abstract: A connector connecting a main circuit board and a sub circuit board has two bases, two electrical contacting sets, two resilient bar sets and two mounting brackets. The bases are mounted on the main circuit board. The electrical contacting sets are mounted respectively in the bases and each electrical contacting set has multiple electrical contacting elements. The resilient bar sets are mounted respectively on the bases. The mounting brackets are mounted respectively on the bases and cover the electrical contacting sets and the resilient bar sets. Circuit-board-receiving channels are defined between the bases and the mounting brackets for receiving the sub circuit board such that combination of the main circuit board and the sub circuit board are parallel and flat.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 8, 2015
    Inventor: Yi-Chih Yang
  • Patent number: 7955092
    Abstract: A connection base assembly for an IC testing apparatus has a base, a top cap and a conductive assembly. The base has a bottom board and an outer frame provided with multiple grooves. The grooves are defined in the top of and extend to the bottom of the outer frame to form multiple through holes in the bottom of the outer frame. The conductive assembly is mounted between the base and the top cap and has multiple conductive elements, multiple top resilient elements and multiple bottom resilient elements. The conductive elements are mounted respectively in the grooves in the outer frame of the base, and each conductive element has a contacting segment and a connecting segment. The top resilient elements and the bottom resilient elements are respectively mounted on and abut with the tops and the bottoms of the conductive elements.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: June 7, 2011
    Inventors: Yi-Chih Yang, Ming-Jui Lin
  • Publication number: 20100178782
    Abstract: A connection base assembly for an IC testing apparatus has a base, a top cap and a conductive assembly. The base has a bottom board and an outer frame provided with multiple grooves. The grooves are defined in the top of and extend to the bottom of the outer frame to form multiple through holes in the bottom of the outer frame. The conductive assembly is mounted between the base and the top cap and has multiple conductive elements, multiple top resilient elements and multiple bottom resilient elements. The conductive elements are mounted respectively in the grooves in the outer frame of the base, and each conductive element has a contacting segment and a connecting segment. The top resilient elements and the bottom resilient elements are respectively mounted on and abut with the tops and the bottoms of the resilient elements.
    Type: Application
    Filed: December 21, 2009
    Publication date: July 15, 2010
    Inventors: Yi-Chih Yang, Ming-Jui Lin