Abstract: An electronic device is provided. The electronic device includes a substrate and a plurality of units disposed on the substrate. A portion of the plurality of units includes a conductive layer and an insulating layer. The conductive layer has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. Moreover, a width of the first opening of the conductive layer is greater than a width of the second opening of the insulating layer.

Abstract: A micro detector includes a substrate, a fin structure, a floating gate, a sensing gate, a reading gate and an energy sensing film. The fin structure is located on the substrate. The floating gate is located on the substrate, and the floating gate is vertically and crossly arranged with the fin structure. The sensing gate is located at one side of the fin structure. The reading gate is located at the other side of the fin structure. The energy sensing film is located on the sensing gate and is connected with the sensing gate. An induced charge is generated when the energy sensing film is contacted with an external energy source, and the induced charge is stored in the floating gate.

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, a PN junction assembly, and a transistor circuit. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer is formed above the second surface. The second metal layer is formed on the second surface. The PN junction assembly is disposed on the first surface and electrically connected with the first metal layer and the second metal layer. The PN junction assembly includes a variable capacitor. The transistor circuit is electrically connecting with the second metal layer.

Abstract: An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.

Abstract: The disclosure provides an electronic apparatus. The electronic apparatus includes an insulator, a driving unit, an electronic unit, and a circuit unit. The driving unit is overlapped with the insulator. The electronic unit is overlapped with the insulator. The circuit unit is electrically connected to the driving unit. The driving unit receives a signal from the circuit unit and drives the electronic unit.

Abstract: A system of generating data from diffusion-weighted images for pre-processing and a method thereof are disclosed. In the system, a processing parameter set including diffusion information is acquired; after a raw diffusion-weighted image including data images and image information is acquired, the image information is interpreted to set image processing data of the raw diffusion-weighted image, and non-deformation correction and deformation correction are performed on the raw diffusion-weighted image to generate a pre-processed diffusion-weighted image based on the processing parameter set and the image processing data. Therefore, the image processing data can be automatically set based on the raw diffusion-weighted image, to achieve the effect of lowering difficulty for analyzing DWI and saving setup time of image processing data.

Abstract: An integrated circuit (IC) device includes a bottom semiconductor device, a top semiconductor device over the bottom semiconductor device in a thickness direction of the IC device, and a multilayer structure between the bottom semiconductor device and the top semiconductor device in the thickness direction. The multilayer structure includes a lower dielectric layer over the bottom semiconductor device, an upper dielectric layer over the lower dielectric layer, and an interlayer metal structure between the lower dielectric layer and the upper dielectric layer. The interlayer metal structure is electrically coupled to at least one of the bottom semiconductor device or the top semiconductor device.

Abstract: The invention provides a method and associated processor for improving software execution of an electronic device. The method may comprise: by a processor of the electronic device, identifying whether a target program is classified, according to whether the target program relates to an user interface of the electronic device, as one of suppressible programs; and, based on whether at least one suppression condition is satisfied, performing at least one suppressing operation on one or more of the suppressible programs.

Abstract: A method for performing alarm grouping control of an electronic device and an associated apparatus are provided, where the method includes the steps of: shifting the execution timing of at least one alarm of a plurality of alarms to group the plurality of alarms into at least one grouped alarm according to at least one grouping control strategy, wherein the execution timing of the at least one alarm is shifted to the execution timing of the at least one grouped alarm; and according to the at least one grouped alarm, controlling whether to wake up at least a portion of the electronic device.

Abstract: The present invention relates to a method for ternary wafer bonding and the structure thereof. According to the present invention, silver island structures in the second bonding layer are distributed on the first bonding layer deposited on the surface of a single silicon wafer for forming a gold-silver combination structure, which is then bonded with another silicon wafer without any metal layers thereon at a low-temperature thermal process of 250° C. for completing gold-silver-silicon ternary wafer bonding. Thus, the temperature required for gold-silicon bonding is lowered and the process of wafer bonding is simplified as well. In addition, the quality of wafer bonding is also assured.

Abstract: A method for performing alarm grouping control of an electronic device and an associated apparatus are provided, where the method includes the steps of: shifting the execution timing of at least one alarm of a plurality of alarms to group the plurality of alarms into at least one grouped alarm according to at least one grouping control strategy, wherein the execution timing of the at least one alarm is shifted to the execution timing of the at least one grouped alarm; and according to the at least one grouped alarm, controlling whether to wake up at least a portion of the electronic device.

Abstract: A replay device and method thereof with automatic sentence segmentation is provided. A soundwave analysis module receives a soundwave signal and analyzes the soundwave signal to determine plural segmentation points. A replay actuation module receives a replay command and sets a replay endpoint on the soundwave signal. A replay access module sets the nearest segmentation point prior to the replay endpoint as a replay startpoint. A replay module plays the soundwave signal from the replay startpoint to the replay endpoint.

Abstract: A method for fabricating a semiconductor device for preventing a poisoned via is provided. A substrate with a conductive layer formed thereon is provided. A composite layer is formed over the substrate and the conductive layer, wherein the composite layer comprises a dielectric layer and a spin-on-glass layer. A via hole is formed through the composite layer, wherein the via hole exposes a surface of the conductive layer. A protection layer is formed on a sidewall of the via hole so as to prevent out-gassing from the spin-on-glass layer. A barrier layer is formed on the protection layer and the conductive layer within the via hole. And a metal layer is deposited on the barrier layer within the via hole to fill the via hole.

Abstract: A circuit capable of selectively operating in an inspecting mode or a driving mode for a display is formed in an integrated circuit and on a glass substrate. The circuit in the IC has a control circuit, a first input circuit, a second input circuit and a fourth input circuit. Each input circuit has a switch. Two additional switches are respectively connected between the first and the second input circuits, and between the second and the fourth input circuits. The glass substrate forms multiple connecting terminals corresponding to the input circuits. Two connecting terminals on the glass substrate are shorted. The control circuit outputs a signal to control all switches to form a configuration suitable for inspecting mode. When inspecting processes are completed, the control circuit changes the configuration for driving mode. The junction resistance of the display is precisely measured and areas in the IC are effectively used.

Abstract: A replay device and method thereof with automatic sentence segmentation is provided. A soundwave analysis module receives a soundwave signal and analyzes the soundwave signal to determine plural segmentation points. A replay actuation module receives a replay command and sets a replay endpoint on the soundwave signal. A replay access module sets the nearest segmentation point prior to the replay endpoint as a replay startpoint. A replay module plays the soundwave signal from the replay startpoint to the replay endpoint.

Abstract: An optical display module comprises a circuit board, a supporting device and four connecting devices. The connecting devices are bonded on the circuit board by welding. The supporting device has four slots associated with the connecting devices. The supporting device is attached on the circuit board to engage the slots with the connecting devices respectively to bond the supporting device and the circuit board firmly.

Abstract: A transflective liquid crystal display includes a plurality of pixels. Each pixel includes a plurality of primary color sub-pixels and a brightness-enhancing sub-pixel. The reflective region of the transflective liquid crystal display is formed only on the brightness-enhancing sub-pixel.