Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A method of manufacturing an LED illuminator is provided. At least one flat heat pipe (FHP) is provided, on which a flat surface is formed. A treating tool is provided to fix the FHP. A printed circuit layer is formed on the flat surface, which includes an insulated layer, a conductive layer and a solder mask layer spread on the flat heat pipe in order, to form solder portions. After that, solder paste is applied on the solder portions, and LED elements are disposed on the solder portions correspondingly. Finally, the FHP and the LED elements are passed through a reflow oven, to accomplish an LED illuminator. The FHP further has locating holes, which are used for orientating the FHP and connecting a heat-dissipating module by a concise assembling element.