Patents by Inventor Yi-Ching CHUO

Yi-Ching CHUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe head of vertical probe card
    Patent number: 10041974
    Abstract: A probe head includes a probe base, a film, and a probe assembly. The probe base includes first, second, and third guiding boards. The second guiding board is fixed between the first and third guiding boards. The film is fixed to the probe base and has a hole. The probe assembly passes through the first, second, and third guiding boards and the hole, and includes a probe and an outer spring sleeve. The probe has a tip passing out through the third guiding board. The outer spring sleeve is sleeved at the exterior of the probe and has a spring area and a plurality of non-spring areas. The spring area is disposed between adjacent two of the non-spring areas. One of the non-spring areas has a bonding section mounted to the probe and retained between the third guiding board and the film.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 7, 2018
    Assignee: MPI Corporation
    Inventors: Tien-Chia Li, Yi-Ching Chuo
  • PROBE HEAD
    Publication number: 20170122978
    Abstract: A probe head includes a probe base, a film, and a probe assembly. The probe base includes first, second, and third guiding boards. The second guiding board is fixed between the first and third guiding boards. The film is fixed to the probe base and has a hole. The probe assembly passes through the first, second, and third guiding boards and the hole, and includes a probe and an outer spring sleeve. The probe has a tip passing out through the third guiding board. The outer spring sleeve is sleeved at the exterior of the probe and has a spring area and a plurality of non-spring areas. The spring area is disposed between adjacent two of the non-spring areas. One of the non-spring areas has a bonding section mounted to the probe and retained between the third guiding board and the film.
    Type: Application
    Filed: September 9, 2016
    Publication date: May 4, 2017
    Inventors: Tien-Chia LI, Yi-Ching CHUO