Patents by Inventor Yi-Ching Ho

Yi-Ching Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153884
    Abstract: An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 9, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min FU, Hung-Kai WANG, Chi-Ching HO, Yih-Jenn JIANG, Yu-Po WANG
  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Publication number: 20100261265
    Abstract: This invention provides a method and device for testing cell responses to polymer particles in vitro. Cells and culture medium are added to a 24-well plate and incubated for 24 hours to make the cells adhere to the interior bottom surface of the plate. The old medium is then drained out and fresh medium and polymer particles are added to fill up the wells. The plate was covered with a light and transparent film such as polyvinyl chloride (PVC) with small holes for ventilation and inverted carefully. The polymer particles float and contact with the cells adhered to the interior bottom surface of the plate. Then the cells are incubated for an intended period for further experiments.
    Type: Application
    Filed: April 10, 2009
    Publication date: October 14, 2010
    Inventors: Hsu-Wei Fang, Yi-Ching Ho
  • Publication number: 20070281290
    Abstract: This invention provides a method and device for testing cell responses to polymer particles in vitro. Cells and culture medium are added to a 24-well plate and incubated for 24 hours to make the cells adhere to the interior bottom surface of the plate. The old medium is then drained out and fresh medium and polymer particles are added to fill up the wells. The pate was covered with a light and transparent film such as polyvinyl chloride (PVC) with small holes for ventilation and inverted carefully. The polymer particles float and contact with the cells adhered to the interior bottom surface of the plate. Then the cells are incubated for an intended period for further experiments.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 6, 2007
    Inventors: Hsu-Wei Fang, Yi-Ching Ho