Patents by Inventor Yi-Ching Hung

Yi-Ching Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME
    Publication number: 20250031435
    Abstract: In an embodiment, a method includes: patterning a lower semiconductor nanostructure, an upper semiconductor nanostructure, and a dummy nanostructure, the dummy nanostructure disposed between the lower semiconductor nanostructure and the upper semiconductor nanostructure, the dummy nanostructure including doped silicon; forming an opening between the lower semiconductor nanostructure and the upper semiconductor nanostructure by etching the doped silicon of the dummy nanostructure; forming an isolation structure in the opening; and depositing a gate dielectric around the isolation structure, the upper semiconductor nanostructure, and the lower semiconductor nanostructure.
    Type: Application
    Filed: July 19, 2023
    Publication date: January 23, 2025
    Inventors: Chun Wei Chen, Zheng Hui Lim, Yen Chuang, Shun-Siang Jhan, Yi-Ching Hung, Ji-Yin Tsai
  • High density electrical connector
    Patent number: 7381061
    Abstract: A high density electrical connector to connect an electronic device and a printed circuit board includes a connector body disposed on the printed circuit board, several terminal channels disposed in the connector body, and several terminals disposed in the terminal channels. The printed circuit board has several contact points. Each terminal has an extending portion to connect with the contact points of the printed circuit board. Another end of the terminal has a joint generated by separating with a carrier. A method for assembling the high density electrical connector is also disclosed.
    Type: Grant
    Filed: December 3, 2006
    Date of Patent: June 3, 2008
    Assignee: Speed Tech Corp.
    Inventors: Yi-Ching Hung, Chien-Yu Hsu, Robert Chiang
  • HIGH DENSITY ELECTRICAL CONNECTOR AND METHOD FOR ASSEMBLING THEREOF
    Publication number: 20080045045
    Abstract: A high density electrical connector to connect an electronic device and a printed circuit board includes a connector body disposed on the printed circuit board, several terminal channels disposed in the connector body, and several terminals disposed in the terminal channels. The printed circuit board has several contact points. Each terminal has an extending portion to connect with the contact points of the printed circuit board. Another end of the terminal has a joint generated by separating with a carrier. A method for assembling the high density electrical connector is also disclosed.
    Type: Application
    Filed: December 3, 2006
    Publication date: February 21, 2008
    Applicant: SPEED TECH CORP.
    Inventors: Yi-Ching Hung, Chien-Yu Hsu, Robert Chiang