Patents by Inventor Yi-Ching Lo

Yi-Ching Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11293973
    Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 5, 2022
    Assignee: MPI CORPORATION
    Inventors: Wen Pin Chuang, Yi Ching Lo
  • Patent number: 11162996
    Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 2, 2021
    Assignee: MPI CORPORATION
    Inventors: Wen Pin Chuang, Yi Ching Lo, Hao Duan
  • Publication number: 20210156903
    Abstract: A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
    Type: Application
    Filed: September 30, 2020
    Publication date: May 27, 2021
    Applicant: MPI CORPORATION
    Inventors: WEN PIN CHUANG, YI CHING LO, HAO DUAN
  • Publication number: 20210156907
    Abstract: An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
    Type: Application
    Filed: November 17, 2020
    Publication date: May 27, 2021
    Applicant: MPI CORPORATION
    Inventors: WEN PIN CHUANG, YI CHING LO
  • Publication number: 20070104803
    Abstract: The present invention relates to a Chinese herbal composition for treating bacterial lipopolysaccharide-induced diseases. The composition is extracted from a mixture of Huang Qui, Huanglian and Dauhuang. The composition is used for treating a lung inflammation and a hypotension.
    Type: Application
    Filed: November 4, 2005
    Publication date: May 10, 2007
    Applicant: Kaohsiung Medical University
    Inventors: Ing-Jun Chen, Yi-Ching Lo, Yang-Chang Wu, Yi-Hung Tsai, Yung-Hsiung Lai