Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: The disclosure provides a power supply and an operation method thereof. The power supply includes a power factor correction (PFC) circuit, a resonant conversion circuit and a dead zone control circuit. The PFC circuit performs power factor correction to output a corrected voltage. The resonant conversion circuit is coupled to the PFC circuit to receive the corrected voltage. The resonant conversion circuit converts the corrected voltage into a converted voltage. The dead zone control circuit is coupled to the resonant conversion circuit to receive the switch voltage. The dead zone control circuit controls the PFC circuit to adjust the corrected voltage. The dead zone control circuit observes the change trend of the falling time of the switch voltage in the deadtime by adjusting the corrected voltage. The dead zone control circuit determines the corrected voltage according to the change trend of the switch voltage.

Abstract: The disclosure provides a power supply and an operation method thereof. The power supply includes a power factor correction (PFC) circuit, a resonant conversion circuit and a dead zone control circuit. The PFC circuit performs power factor correction to output a corrected voltage. The resonant conversion circuit is coupled to the PFC circuit to receive the corrected voltage. The resonant conversion circuit converts the corrected voltage into a converted voltage. The dead zone control circuit is coupled to the resonant conversion circuit to receive the switch voltage. The dead zone control circuit controls the PFC circuit to adjust the corrected voltage. The dead zone control circuit observes the change trend of the falling time of the switch voltage in the deadtime by adjusting the corrected voltage. The dead zone control circuit determines the corrected voltage according to the change trend of the switch voltage.

Abstract: The present disclosure relates to a power converter device including a power factor correction circuit, a resonance converter circuit, and a zero voltage switching circuit. The power factor correction circuit is coupled to the primary side rectifier circuit, and includes a first switching circuit, a first control circuit and a first output circuit. The resonance converter circuit includes a second switching circuit and a second control circuit. The second switching circuit is coupled to the first output circuit, and the second control circuit is coupled to the secondary side rectifier circuit. The zero voltage switching circuit is coupled between the first control circuit and the second control circuit. The zero voltage switching circuit is configured to obtain a switching voltage of a switch element in the second switching circuit, and output an adjustment signal to the first control circuit according to the switching voltage.

Abstract: A power supply system with identification code updating capability is used for providing an electric power to an electronic device having a first identification (ID) code. The power supply system includes a power supply device and an ID code updating module. The power supply device is configured to provide the electric power to the electronic device and includes a memory unit. The memory unit is configured to store a look-up table including at least one second ID code. The ID code updating module is electrically connected to the power supply device. When the second ID code listed in the look-up table does not match with the first ID code of the electronic device, the ID code updating module updates a second ID code matching with the first ID code in the look-up table. A charging method is further disclosed.

Abstract: A multi-output control system includes a power conversion module, a first active linear module, a second active linear module, a control module and a feedback control module. The control module controls the feedback control module to adjust an output power based on current signals. The first active linear module and the second active linear module determine whether a difference value between a current value of a first output power and a current value of a second output power is greater than a current difference predetermined value based on the current signals, and the control module adjusts a voltage value of the first output power and a voltage value of the second output power to respectively be within a predetermined voltage range based on the current signals.

Abstract: A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering pads are electrically connected to the first and the second electrodes respectively. Moreover, a first and a second grooves are defined on the first surface of the insulating substrate, the first and the second grooves are spaced from each other and disposed between the first and the second soldering pads. The invention further provides a LED flip chip package structure including the package substrate, a LED flip chip and fluorescent glue. The invention adds the grooves in the spacing between the soldering pads as a buffer space for melted solder flowing during reflow soldering process and therefore can relieve short-circuit phenomenon.

Abstract: A package substrate includes: an insulating substrate, a first and a second soldering pads spacedly disposed on a first surface of the insulating substrate, a first and a second electrodes spacedly disposed on an opposite second surface of the insulting substrate. The first and the second soldering pads are electrically connected to the first and the second electrodes respectively. Moreover, a first and a second grooves are defined on the first surface of the insulating substrate, the first and the second grooves are spaced from each other and disposed between the first and the second soldering pads. The invention further provides a LED flip chip package structure including the package substrate, a LED flip chip and fluorescent glue. The invention adds the grooves in the spacing between the soldering pads as a buffer space for melted solder flowing during reflow soldering process and therefore can relieve short-circuit phenomenon.

Abstract: A power supply system with identification code updating capability is used for providing an electric power to an electronic device having a first identification (ID) code. The power supply system includes a power supply device and an ID code updating module. The power supply device is configured to provide the electric power to the electronic device and includes a memory unit. The memory unit is configured to store a look-up table including at least one second ID code. The ID code updating module is electrically connected to the power supply device. When the second ID code listed in the look-up table does not match with the first ID code of the electronic device, the ID code updating module updates a second ID code matching with the first ID code in the look-up table. A charging method is further disclosed.