Abstract: Systems and methods provide for communicating with an interactive voice response system using a graphical user interface. An audio stream that includes a voice content is received. The user device transcribes the audio stream. The user device processes the text to identify one or more options included in the voice content of the audio stream. The one or more options are then displayed. The user device receives a selection from the user and transmits an indication of the user selection.

Abstract: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

Abstract: A three-dimensional oblique microstructure with press down and engagement mechanisms. A pair of corresponding first lugs is disposed on the both sides of the oblique body, and the bottom part of the oblique body has a first push pad. A pair of corresponding second lugs respectively disposed on the inner sides of the two supports of the ?-shaped supporting rack, a second push pad is disposed on the bottom part of the U-shaped supporting rack. Thus, by pressing down the first and the second push pad, the oblique body rotates through the first twist bar and the U-shaped supporting rack rotates through the second twist bar so as to engage the first lugs with the second lugs, such that the three-dimensional microstructures with different angles can be packed to satisfy the needs of varied optical platform applications, and simplify semiconductor fabrication for higher production efficiency and product yield.

Abstract: An optical pickup head is provided, which includes a silicon substrate, in which an aperture and an objective lens are disposed on the silicon substrate; and a laser diode (LD), a 135-degree tilted reflector, and a 135-degree tilted holographic reflector are disposed on the silicon substrate. The two 135-degree tilted reflectors and a holographic optical element (HOE) are fabricated on a slant face structure of an optical platform using a semiconductor process, so all the elements are disposed at a straight zone, and then in combination with bonding of the LD and an optical sensor element, an miniaturization objective is achieved and an optical path is shortened.

Abstract: A dynamic micro-machined optical device is applied in a micro-optical pickup. The micro-optical pickup includes an actuator and a dynamic grating, wherein the actuator may be a cantilever beam electrostatic actuator, a scratch drive actuator, a magnetic actuator or an electromagnetic actuator; and the actuator is controlled by applying an external voltage. The position of the dynamic grating is switchable between on and off the optical axis. When the external voltage is applied, the on-axis dynamic grating splits the light from a laser diode into multi-beams and the micro-optical pickup can rapidly retrieve information on the disk by simultaneously reading multi-tracks on the disk with multi low energy beams. When the external voltage is turned-off, the dynamic grating is off the optical axis and the light from the laser diode will pass directly and write information into the disk with single high energy beam.

Abstract: The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the opaque film on a transparent substrate, and utilizes the self-alignment backside exposure technology to precisely integrate the aperture and the microlens made by macromolecule material without any combination step. The claimed method is simpler than conventional technology and can precisely align and integrate the microlens and the aperture with a continuous batch manufacture. Since the aperture and the circular opening are concentric circles and formed in same step, the microlens and the aperture can be precisely aligned with the backside exposure. The claimed invention can effectively improve the optical resolution and efficiency of the optical access and measurement devices.

Abstract: The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the opaque film on a transparent substrate, and utilizes the self-alignment backside exposure technology to precisely integrate the aperture and the microlens made by macromolecule material without any combination step. The claimed method is simpler than conventional technology and can precisely align and integrate the microlens and the aperture with a continuous batch manufacture. Since the aperture and the circular opening are concentric circles and formed in same step, the microlens and the aperture can be precisely aligned with the backside exposure. The claimed invention can effectively improve the optical resolution and efficiency of the optical access and measurement devices.

Abstract: A dual-tank etch method which is suitable for the stripping of a silicon nitride layer from a pad oxide layer provided on a substrate, and etching of the pad oxide layer to a desired target thickness, is disclosed. The method includes providing a first processing tank containing a silicon nitride-stripping chemical; stripping the silicon nitride layer from the pad oxide layer by placing the substrate in the first processing tank; providing a second processing tank containing an oxide-etching chemical; and etching the pad oxide layer to the desired target thickness by placing the substrate in the second processing tank. By carrying out the pad oxide-etching step and the silicon nitride-stripping step in separate processing tanks, accumulation of silicon oxide precipitates in the second processing tank is avoided.

Abstract: A process for forming a semiconductor device with multiple gate insulator thicknesses, wherein exposed surfaces of a semiconductor substrate are protected during a photoresist stripping procedure, has been developed. After growth of an insulator layer on the entire surface of a semiconductor substrate portions of the insulator layer not covered by a photoresist masking shape are selectively removed. A two step photoresist removal procedure is then employed initiating with an ozone water cycle which partially removes the photoresist shape while forming a thin silicon oxide layer on the portions of bare semiconductor surface. A acid-hydrogen peroxide mixture (SPM), is then used to complete the photoresist removal procedure including removal of photoresist residues, with the thin silicon oxide layer formed during the ozone water cycle protecting the previously bare underlying semiconductor surface.