Patents by Inventor Yi Chou

Yi Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133934
    Abstract: A capacitance measure circuit includes a charge to voltage converter (CVC), and the CVC includes an excitation signal generation circuit that is arranged to generate and connect an excitation signal to a first terminal of a capacitance sensor, a differential amplifier, a first switch circuit, and at least one first variable capacitor. The inverting input terminal of the differential amplifier is arranged to receive a sensing capacitance value from a second terminal of the capacitance sensor. The first switch circuit is coupled between the inverting input terminal and the non-inverting output terminal of the differential amplifier, and is connected in parallel with the at least one first variable capacitor at the inverting input terminal and the non-inverting output terminal of the differential amplifier.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 25, 2024
    Applicant: Elite Semiconductor Microelectronics Technology Inc.
    Inventor: Yi-Chou Huang
  • Publication number: 20240128324
    Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.
    Type: Application
    Filed: November 21, 2022
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chih Lai, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Chung-Yi Chiu
  • Patent number: 11960141
    Abstract: Provided is a lens assembly driving module including a photographing lens assembly, a first driving mechanism and a second driving mechanism. The photographing lens assembly includes N lens elements and has an optical axis passing through the N lens elements. The first driving mechanism drives at least N/2 said lens elements to move along the optical axis of the photographing lens assembly. The second driving mechanism enables a relative distance along the optical axis of two adjacent ones of the N lens elements to vary. Therefore, any specific one of the lens elements is capable of being driven to optimize optical imaging resolution of various fields of view independently within a real shot at different object distances.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 16, 2024
    Assignee: LARGAN DIGITAL CO., LTD.
    Inventors: Heng-Yi Su, Hao-Jan Chen, Ming-Ta Chou, Te-Sheng Tseng
  • Patent number: 11956869
    Abstract: A display driver circuit for controlling a display panel having a plurality of light-emission diode (LED) strings includes a plurality of current regulators and a control circuit. Each of the plurality of current regulators is configured to control one of the plurality of LED strings. The control circuit, coupled to the plurality of current regulators, is configured to generate a plurality of pulses in a plurality of pulse width modulation (PWM) signals and output each of the plurality of PWM signals to a respective current regulator among the plurality of current regulators. Wherein, the plurality of pulses are scrambled.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: April 9, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Chih-Hsien Chou, Jhih-Siou Cheng, Jin-Yi Lin, Ren-Chieh Yang
  • Patent number: 11952656
    Abstract: A physical vapor deposition (PVD) system is disclosed. The PVD system includes a pedestal configured to hold a semiconductor wafer, a cover plate configured to hold a target, and a collimator between the pedestal and the cover plate. The collimator includes a plurality of passages configured to pass source material travelling from the cover plate toward the pedestal at an angle less than a threshold angle with respect to a line perpendicular to a surface of the pedestal facing the cover plate, where the collimator is configured to block source material travelling from the cover plate toward the pedestal at an angle greater than the threshold angle, where a first passage of the plurality of passages has a first passage length, where a second passage of the plurality of passages has a second passage length, and where the first passage length is less than the second passage length.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Lin Chen, Tsung-Yi Chou, Wei-Der Sun, Hao-Wei Kang
  • Publication number: 20240111133
    Abstract: An imaging lens assembly module includes a lens carrier, a rotatable component, an imaging surface and a holder portion. At least one lens element of the imaging lens assembly module is disposed on the lens carrier, and the lens carrier includes an assembling structure. The rotatable component includes a blade set and a rotating element. The blade set includes rotatable blades surrounding an optical axis to form a through hole. The rotating element is connected to the blade set. The imaging surface is located on an image side of the lens carrier. The holder portion is configured to keep a fixed distance between the lens carrier and the imaging surface. The blade set and the rotating element are disposed on the assembling structure, and the blade set and the rotating element rotate relatively to the assembling structure, so that the dimension of the through hole is variable.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Tzu CHANG, Hsiu-Yi HSIAO, Ming-Ta CHOU, Te-Sheng TSENG
  • Publication number: 20240113187
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Jhu-Min Song, Ying-Chou Chen, Yi-Kai Ciou, Chien-Chih Chou, Fei-Yun Chen, Yu-Chang Jong, Chi-Te Lin
  • Patent number: 11947150
    Abstract: A backlit-module-embedded illuminated keyswitch structure includes a baseplate, a mask film disposed below the baseplate and having a first coating configured to substantially reflect a light, a light guide sheet disposed at one side of the mask film and having a light source hole, a reflective layer disposed at one side of the light guide sheet opposite to the mask film and having an opening communicating with the light source hole, a top glue configured to connect the mask film and the light guide sheet around the light source hole, and a bottom glue configured to connect the light guide sheet and the reflective layer around the light source hole. The first coating covers the light source hole. In a stacked direction of the mask film, the light guide sheet, and the reflective layer, at least one of the top glue and the bottom glue overlaps the first coating.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: April 2, 2024
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Po-Yueh Chou
  • Patent number: 11944970
    Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 2, 2024
    Assignees: INSTANT NANOBIOSENSORS, INC., INSTANT NANOBIOSENSORS CO., LTD.
    Inventors: Yu-Chung Huang, Yi-Li Sun, Ting-Chou Chang, Jhy-Wen Wu, Nan-Kuang Yao, Lai-Kwan Chau, Shau-Chun Wang, Ying Ting Chen
  • Publication number: 20240103342
    Abstract: A variable aperture module includes a blade assembly, a positioning element, a driving part and pressing structures. The blade assembly includes movable blades disposed around an optical axis to form a light passable hole with an adjustable size. Each movable blade has a positioning hole and a movement hole adjacent thereto. The positioning element includes positioning structures disposed respectively corresponding to the positioning holes. The driving part includes a rotation element disposed corresponding to the movement holes and is rotatable with respect to the positioning element. The pressing structures are disposed respectively corresponding to the movable blades. Each pressing structure is at least disposed into at least one of the positioning hole and the movement hole of the corresponding movable blade. Each pressing structure at least presses against at least one of the corresponding one positioning structure and the rotation element.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 28, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Chia-Cheng TSAI, Hsiu-Yi HSIAO, Ming-Ta CHOU, Te-Sheng TSENG
  • Publication number: 20240106171
    Abstract: An electrical connector assembly includes: a male connector, provided with a conductive shell; a first substrate, accommodated in the conductive shell and used to transmit receiving signals; a second substrate, accommodated in the conductive shell and used to transmit sending signals; a shielding sheet, located between the first substrate and the second substrate; a female connector, provided with a first conductive body and a second conductive body; a plurality of first signal terminals, accommodated in the first conductive body and used to transmit receiving signals; and a plurality of second signal terminals, accommodated in the second conductive body and used to transmit sending signals. The first signal terminals and the first substrate are electrically contacted to each other. The second signal terminals and the second substrate are electrically contacted to each other. The first conductive body and/or the second conductive body are used to lap joint with the shielding sheet.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Inventors: Po Jui Chou, Zhi Guo Peng, Chien Chih Ho, Hui Yi
  • Publication number: 20240102162
    Abstract: A method includes following steps. A first precursor is pulsed over a substrate such that first precursor adsorbs on a first region and a second region of the substrate. A first plurality of the first precursor adsorbing on the first region is then removed using a plasma, while leaving a second plurality of the first precursor adsorbing on the second region. A second precursor is then pulsed to the substrate to form a monolayer of a film on the second region and a material on the first region. The material is then removed using a plasma. The substrate is biased during removing the material.
    Type: Application
    Filed: February 1, 2023
    Publication date: March 28, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Chun-Yi CHOU, Chih-Piao CHUU, Miin-Jang CHEN
  • Publication number: 20240100553
    Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Shih-Jen Lu, Yang-Ming Chou, Chih-Hao Wang, Chien-Yi Kao, Hsin-Yi Lin
  • Publication number: 20240105619
    Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Inventors: Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu, Yi-Kan Cheng
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Publication number: 20240094497
    Abstract: An imaging lens module includes a casing, an imaging lens disposed to the casing, a lens carrier supporting the image lens, an elastic element connected to the lens carrier to provide the lens carrier with a translational degree of freedom along an optical axis, a frame connected to the elastic element such that the lens carrier is movable along the optical axis with respect to the frame, a variable through hole module coupled to the imaging lens and having a light passable hole with a variable aperture size, and a wiring assembly including a fixed wiring part at least partially located closer to the opening than the elastic element and a movable wiring part electrically connected to the fixed wiring part and the variable through hole module. The optical axis passes through lens elements of the imaging lens and the center of the variable through hole module.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 21, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Hao-Jan CHEN, Heng Yi SU, Ming-Ta CHOU, Te-Sheng TSENG
  • Publication number: 20240090796
    Abstract: A foot sensor and analysis device, which includes a pressure sensing layer arranged inside the insole and a sensing module installed inside the insole. The sensing module is electrically coupled with the pressure sensing layer for receiving and processing detected electronic signals, where sensing module includes an inductance coil to perform wireless charging to the battery. The pressure sensing layer and the sensing module are integrally formed inside the insole.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Yao-Sheng Chou, Hsiao-Yi Lin, Wei-Sheng Su, Hsing-Yu Chi
  • Publication number: 20240087915
    Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Hao HUANG, Chun-Yi CHEN, I-Shi WANG, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
  • Publication number: 20240088690
    Abstract: Systems and methods for adaptive voltage regulation are described. According to an example, a method for operating a charger may include setting, by a charger controller of the charger, a maximum regulation voltage threshold and a minimum regulation voltage threshold, the minimum regulation voltage threshold being a predetermined percentage of the maximum regulation voltage threshold, the predetermined percentage ranging from between about 90% and about 98%; setting, by the charger controller, a charger regulation voltage to the maximum regulation voltage threshold; determining, by a battery monitor, a state of charge of a battery module; and operating the charger at the maximum regulation voltage threshold until the battery module is maximally charged.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 14, 2024
    Applicant: Renesas Electronics America Inc.
    Inventors: Sungkeun Lim, Chong Han, Yen-Mo Chen, HSIEN YI CHOU
  • Patent number: 11927793
    Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: March 12, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Yi-Hui Lee, Kuan-Chou Chen, Yung-Chih Cheng